公开(公告)号：MY172115A

公开(公告)日：2019-11-14

申请号：MYPI2012005126

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  MENARD ETIENNE ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  SUN YUGANG ,  CARLSON ANDREW ,  CHOI WON MOOK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  LEE KEON JAE ,  KANG SEONG JUN ,  ZHU ZHENGTAO ,  AHN JONG-HYUN ,  KIM HOON-SIK ,  KHANG- DAHL-YOUNG

IPC: H01L31/16

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

公开(公告)号：MY151572A

公开(公告)日：2014-06-13

申请号：MYPI20062537

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO

IPC: H01L21/302

Abstract: THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (100), AND SMART-MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.

公开(公告)号：MY152238A

公开(公告)日：2014-09-15

申请号：MYPI20113695

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO

IPC: H01L29/72

Abstract: THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS (300) HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES (290) ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (320), AND SMART MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.

公开(公告)号：MY145225A

公开(公告)日：2012-01-13

申请号：MYPI20062536

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/027 ,  H01L21/77

Abstract: PATTERN TRANSFER PRINTING BY KINETIC CONTROL OF ADHESION TO AN ELASTOMERIC STAMP THE PRESENT INVENTION PROVIDES METHODS, SYSTEMS AND SYSTEM COMPONENTS FOR 5 TRANSFERRING, ASSEMBLING AND INTEGRATING FEATURES AND ARRAYS OF FEATURES HAVING SELECTED NANOSIZED AND/OR MICROSIZED PHYSICAL DIMENSIONS, SHAPES AND SPATIAL ORIENTATIONS. METHODS OF THE PRESENT INVENTION UTILIZE PRINCIPLES OF 'SOFT ADHESION'TO GUIDE THE TRANSFER, ASSEMBLY AND/OR INTEGRATION OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENTS OR OTHER COMPONENTS OF ELECTRONIC DEVICES. METHODS OF THE PRESENT INVENTION ARE USEFUL FOR 10 TRANSFERRING FEATURES FROM A DONOR SUBSTRATE TO THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE AND, OPTIONALLY, FROM THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE TO THE RECEIVING SURFACE OF A RECEIVING SUBSTRATE. THE PRESENT METHODS AND SYSTEMS PROVIDE HIGHLY EFFICIENT, REGISTERED TRANSFER OF FEATURES AND ARRAYS OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENT, IN A CONCERTED MANNER THAT MAINTAINS THE 15 RELATIVE SPATIAL ORIENTATIONS OF TRANSFERRED FEATURES. DOOG)OI/06/&

公开(公告)号：MY153233A

公开(公告)日：2015-01-29

申请号：MYPI20092343

申请日：2005-06-03

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/00 ,  B81C1/00 ,  H01L29/06 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18 ,  H10K99/00

Abstract: THE INVENTION PROVIDES METHODS AND DEVICES FOR FABRICATING PRINTABLE SEMICONDUCTOR ELEMENTS (150) AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS ONTO SUBSTRATE SURFACES (160). METHODS, DEVICES AND DEVICE COMPONENTS OF THE PRESENT INVENTION ARE CAPABLE OF GENERATING A WIDE RANGE OF FLEXIBLE ELECTRONIC AND OPTOELECTRONIC DEVICES AND ARRAYS OF DEVICES ON SUBSTRATES COMPRISING POLYMERIC MATERIALS. THE PRESENT INVENTION ALSO PROVIDES STRETCHABLE SEMICONDUCTOR STRUCTURES AND STRETCHABLE ELECTRONIC DEVICES CAPABLE OF GOOD PERFORMANCE IN STRETCHED CONFIGURATIONS.

公开(公告)号：MY151968A

公开(公告)日：2014-07-31

申请号：MYPI20052553

申请日：2005-06-03

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/322 ,  B81C1/00 ,  H01L29/06 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18 ,  H10K99/00

Abstract: THE INVENTION PROVIDES METHODS AND DEVICES FOR FABRICATING PRINTABLE SEMICONDUCTOR ELEMENTS (150) AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS ONTO SUBSTRATE SURFACES. METHODS, DEVICES AND DEVICE COMPONENTS OF THE PRESENT INVENTION ARE CAPABLE OF GENERATING A WIDE RANGE OF FLEXIBLE ELECTRONIC AND OPTOELECTRONIC DEVICES AND ARRAYS OF DEVICES ON SUBSTRATES (100) COMPRISING POLYMERIC MATERIALS. THE PRESENT INVENTION ALSO PROVIDES STRETCHABLE SEMICONDUCTOR STRUCTURES AND STRETCHABLE ELECTRONIC DEVICES CAPABLE OF GOOD PERFORMANCE IN STRETCHED CONFIGURATIONS.