公开(公告)号：KR20070100617A

公开(公告)日：2007-10-11

申请号：KR20060053675

申请日：2006-06-14

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  KHANG DAHL YOUNG ,  SUN YUGANG

IPC: H01L21/84

CPC classification number: H01L29/78603 ,  H01L29/1606 ,  H01L29/7781 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/00

Abstract: A stretchable form of single crystal silicon for high performance electronics on rubber substrates is provided to enable various deformations such as stretching, crimping, and bending. A stretchable form of single crystal silicon for high performance electronics on rubber substrates includes a flexible substrate(705), and a bent semiconductor structure(715). The flexible substrate(705) is formed of a polymer and/or elastic material substrate having a support surface(710). The bent semiconductor structure(715) has a curved inner surface(720). At least a portion of the curved inner surface(720) of the bent semiconductor structure(715) is adhered to the support surface of the flexible substrate(705). The curved inner surface(705) can be adhered to the support surface(710) at the entire points along the inner surface(720).

Abstract translation: 提供了用于橡胶基板上的高性能电子器件的可拉伸形式的单晶硅，以实现诸如拉伸，卷曲和弯曲之类的各种变形。 用于橡胶基板上的高性能电子器件的可拉伸形式的单晶硅包括柔性基板（705）和弯曲半导体结构（715）。 柔性基底（705）由具有支撑表面（710）的聚合物和/或弹性材料基底形成。 弯曲的半导体结构（715）具有弯曲的内表面（720）。 弯曲半导体结构（715）的弯曲内表面（720）的至少一部分粘附到柔性基板（705）的支撑表面。 弯曲的内表面（705）可以沿着内表面（720）的整个点粘附到支撑表面（710）。

公开(公告)号：WO2005122285A3

公开(公告)日：2007-08-30

申请号：PCT/US2005019354

申请日：2005-06-02

Applicant: UNIV ILLINOIS ,  NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/00 ,  B81C1/00 ,  H01L21/20 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).

Abstract translation: 本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。 本发明还提供可拉伸半导体结构（760）。

公开(公告)号：WO2006130721A3

公开(公告)日：2009-06-25

申请号：PCT/US2006021161

申请日：2006-06-01

Applicant: UNIV ILLINOIS ,  NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

IPC: H01L21/302 ,  H01L21/8242 ,  H01L23/62 ,  H01R12/00 ,  H05K3/36

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/1292 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/22 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78696 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/1033 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract translation: 本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。 本发明的组合物和方法提供了高精度的记录转印和微米尺寸和/或纳米半导体结构的阵列在包括大面积基底和/或柔性基底的基底上的集成。 此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性 半导体器件。

公开(公告)号：WO2008030960A3

公开(公告)日：2008-07-24

申请号：PCT/US2007077759

申请日：2007-09-06

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG

IPC: H01B7/06 ,  H01R35/00

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract translation: 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：EP2064710A4

公开(公告)日：2011-05-04

申请号：EP07841968

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  KANG SEONG JUN ,  LEE KEON JAE ,  ZHU ZHENGTAO ,  MENARD ETIENNE ,  KIM HOON-SIK ,  KHANG DAHL-YOUNG ,  AHN JONG-HYUN

IPC: H01B7/06 ,  H01R35/00

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

公开(公告)号：EP1759422A4

公开(公告)日：2011-04-06

申请号：EP05755193

申请日：2005-06-02

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/20 ,  B81C1/00 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

公开(公告)号：EP1915774A4

公开(公告)日：2012-05-02

申请号：EP06771761

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

IPC: H01L21/302 ,  B82Y10/00 ,  H01L21/336 ,  H01L21/683 ,  H01L21/8242 ,  H01L23/62 ,  H01L29/06 ,  H01L29/16 ,  H01L29/22 ,  H01L29/66 ,  H01L29/786 ,  H01L51/00 ,  H01R12/00 ,  H05K3/36

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/1292 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/22 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78696 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/1033 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

公开(公告)号：MY151572A

公开(公告)日：2014-06-13

申请号：MYPI20062537

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO

IPC: H01L21/302

Abstract: THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (100), AND SMART-MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.

公开(公告)号：MY172115A

公开(公告)日：2019-11-14

申请号：MYPI2012005126

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  MENARD ETIENNE ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  SUN YUGANG ,  CARLSON ANDREW ,  CHOI WON MOOK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  LEE KEON JAE ,  KANG SEONG JUN ,  ZHU ZHENGTAO ,  AHN JONG-HYUN ,  KIM HOON-SIK ,  KHANG- DAHL-YOUNG

IPC: H01L31/16

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

公开(公告)号：MY152238A

公开(公告)日：2014-09-15

申请号：MYPI20113695

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO

IPC: H01L29/72

Abstract: THE PRESENT INVENTION PROVIDES A HIGH YIELD PATHWAY FOR THE FABRICATION, TRANSFER AND ASSEMBLY OF HIGH QUALITY PRINTABLE SEMICONDUCTOR ELEMENTS (300) HAVING SELECTED PHYSICAL DIMENSIONS, SHAPES, COMPOSITIONS AND SPATIAL ORIENTATIONS. THE COMPOSITIONS AND METHODS OF THE PRESENT INVENTION PROVIDE HIGH PRECISION REGISTERED TRANSFER AND INTEGRATION OF ARRAYS OF MICROSIZED AND/OR NANOSIZED SEMICONDUCTOR STRUCTURES (290) ONTO SUBSTRATES, INCLUDING LARGE AREA SUBSTRATES AND/OR FLEXIBLE SUBSTRATES. IN ADDITION, THE PRESENT INVENTION PROVIDES METHODS OF MAKING PRINTABLE SEMICONDUCTOR ELEMENTS (300) FROM LOW COST BULK MATERIALS, SUCH AS BULK SILICON WAFERS (320), AND SMART MATERIALS PROCESSING STRATEGIES THAT ENABLE A VERSATILE AND COMMERCIALLY ATTRACTIVE PRINTING-BASED FABRICATION PLATFORM FOR MAKING A BROAD RANGE OF FUNCTIONAL SEMICONDUCTOR DEVICES.