公开(公告)号：WO2005104756A3

公开(公告)日：2009-04-02

申请号：PCT/US2005014449

申请日：2005-04-27

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  MENARD ETIENNE

Inventor： ROGERS JOHN A ,  MENARD ETIENNE

IPC: B29C67/00 ,  B29C35/08 ,  C04B24/38 ,  C04B28/14 ,  G03F7/00 ,  G03F9/00

CPC classification number: B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C04B24/383 ,  C04B28/14 ,  C04B2111/00181 ,  G03F7/0002

Abstract: The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

Abstract translation: 本发明提供用于在衬底表面上制造图案的方法，装置和器件组件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。 本发明提供了包括多个聚合物层的复合图案形成装置，每个聚合物层各自具有选择的机械性质，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数 的热膨胀，以在各种基底表面和表面形态上提供高分辨率图案。

公开(公告)号：WO2008036837A2

公开(公告)日：2008-03-27

申请号：PCT/US2007079070

申请日：2007-09-20

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  NUZZO RALPH G ,  MEITL MATTHEW ,  KO HEUNG CHO ,  YOON JONGSEUNG ,  MENARD ETIENNE ,  BACA ALFRED J

Inventor： ROGERS JOHN A ,  NUZZO RALPH G ,  MEITL MATTHEW ,  KO HEUNG CHO ,  YOON JONGSEUNG ,  MENARD ETIENNE ,  BACA ALFRED J

IPC: H01L21/28

CPC classification number: H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Abstract translation: 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

公开(公告)号：WO2005054119A2

公开(公告)日：2005-06-16

申请号：PCT/US2004040192

申请日：2004-12-01

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  JEON SEOKWOO ,  PARK JANGUNG

Inventor： ROGERS JOHN A ,  JEON SEOKWOO ,  PARK JANGUNG

IPC: B81C99/00 ,  B82B20060101 ,  B82B3/00 ,  G03F1/00 ,  G03F1/60 ,  G03F7/00 ,  G03F7/20 ,  B82B

CPC classification number: B81C99/00 ,  B82B3/00 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/703 ,  G03F7/7035 ,  G03F7/70408 ,  Y10S430/146

Abstract: The present invention provides methods and devices for fabricating 3D structures and patterns of 3D structures on substrate surfaces, including symmetrical and asymmetrical patterns of 3D structures. Methods of the present invention provide a means of fabricating 3D structures having accurately selected physical dimensions, including lateral and vertical dimensions ranging from 10s of nanometers to 1000s of nanometers. In one aspect, methods are provided using a mask element comprising a conformable, elastomeric phase mask capable of establishing conformal contact with a radiation sensitive material undergoing photoprocessing. In another aspect, the temporal and/or spatial coherence of electromagnetic radiation using for photoprocessing is selected to fabricate complex structures having nanoscale features that do not extend entirely through the thickness of the structure fabricated.

Abstract translation: 本发明提供用于在衬底表面上制造3D结构和3D结构图案的方法和设备，包括3D结构的对称和不对称图案。 本发明的方法提供了制造具有精确选择的物理尺寸的3D结构的手段，包括范围从10纳米到1000纳米的横向和垂直尺寸。 在一个方面，提供了使用掩模元件的方法，所述掩模元件包括能够与经受光处理的辐射敏感材料建立共形接触的适形的弹性体相位掩模。 在另一方面，选择用于光学处理的电磁辐射的时间和/或空间相干性以制造具有纳米级特征的复杂结构，所述纳米级特征不完全延伸穿过所制造的结构的厚度。

公开(公告)号：WO2013109593A3

公开(公告)日：2013-09-12

申请号：PCT/US2013021686

申请日：2013-01-16

Applicant: SEMPRIUS INC ,  UNIV ILLINOIS

Inventor： MENARD ETIENNE ,  MEITL MATTHEW ,  ROGERS JOHN A

IPC: H01L21/60 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

Abstract: A method of printing transferable components includes pressing a stamp (10) including at least one transferable semiconductor component (20) thereon on a target substrate (30) such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer (31). During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation (4) that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

Abstract translation: 打印可转移部件的方法包括在目标基板（30）上按压包括至少一个可转移半导体部件（20）的印模（10），使得至少一个可转印部件和目标基板的表面接触 导电共晶层（31）。 在将印模压在目标基板上时，至少一个可转印部件暴露于电磁辐射（4），该电磁辐射（4）被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。

公开(公告)号：WO2013089867A3

公开(公告)日：2013-08-15

申请号：PCT/US2012056538

申请日：2012-09-21

Applicant: UNIV ILLINOIS ,  TUFTS COLLEGE ,  ROGERS JOHN A ,  OMENETTO FIORENZO G ,  HWANG SUK-WON ,  TAO HU ,  KIM DAE-HYEONG ,  KAPLAN DAVID

Inventor： ROGERS JOHN A ,  OMENETTO FIORENZO G ,  HWANG SUK-WON ,  TAO HU ,  KIM DAE-HYEONG ,  KAPLAN DAVID

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/09

CPC classification number: H01L29/66 ,  B82Y10/00 ,  G11B23/282 ,  H01L23/293 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L29/0669 ,  H01L29/66007 ,  H01L29/7787 ,  H01L29/78603 ,  H01L29/7869 ,  H01L29/78696 ,  H01L29/812 ,  H01L29/861 ,  H01L29/872 ,  H01L31/08 ,  H01L2924/0002 ,  H01Q1/2283 ,  H01Q7/00 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level examples of transient electronics are provided.

Abstract translation: 本发明提供了瞬态装置，包括在应用至少一个内部和/或外部刺激时电和/或物理变换的有源和无源装置。 提供了瞬态电子设备的材料，建模工具，制造方法，设备设计和系统级示例。

公开(公告)号：WO2012167096A2

公开(公告)日：2012-12-06

申请号：PCT/US2012040482

申请日：2012-06-01

Applicant: UNIV ILLINOIS ,  UNIV PENNSYLVANIA ,  ROGERS JOHN A ,  KIM DAE-HYEONG ,  LITT BRIAN ,  VIVENTI JONATHAN

Inventor： ROGERS JOHN A ,  KIM DAE-HYEONG ,  LITT BRIAN ,  VIVENTI JONATHAN

IPC: A61N1/05

CPC classification number: A61B5/0478 ,  A61B5/04001 ,  A61B5/4094 ,  A61B5/4836 ,  A61B5/6868 ,  A61B5/7246 ,  A61B5/7267 ,  A61B5/7282 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/164 ,  A61F2/72 ,  A61M5/20 ,  A61M5/31 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/36017 ,  A61N1/36025 ,  A61N1/3606 ,  A61N5/0601 ,  A61N2005/063

Abstract: Provided are methods and devices for interfacing with brain tissue, specifically for monitoring and/or actuation of spatio-temporal electrical waveforms. The device is conformable having a high electrode density and high spatial and temporal resolution. A conformable substrate supports a conformable electronic circuit and a barrier layer. Electrodes are positioned to provide electrical contact with a brain tissue. A controller monitors or actuates the electrodes, thereby interfacing with the brain tissue. In an aspect, methods are provided to monitor or actuate spatio-temporal electrical waveform over large brain surface areas by any of the devices disclosed herein.

Abstract translation: 提供了用于与脑组织接口的方法和装置，专门用于监测和/或致动时空电波形。 该器件具有高电极密度和高空间和时间分辨率的一致性。 一个适应性的基底支持符合规定的电子电路和阻挡层。 定位电极以提供与脑组织的电接触。 控制器监测或致动电极，从而与脑组织接触。 在一方面，提供了通过本文公开的任何装置来监测或致动大脑表面区域上的时空电波形的方法。

公开(公告)号：WO2008030666A3

公开(公告)日：2008-10-09

申请号：PCT/US2007074293

申请日：2007-07-25

Applicant: UNIV ILLINOIS ,  NUZZO RALPH G ,  ROGERS JOHN A ,  MACK NATHAN H ,  STEWART MATTHEW ,  MALYARCHUK VIKTOR ,  YAO JIMIN

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MACK NATHAN H ,  STEWART MATTHEW ,  MALYARCHUK VIKTOR ,  YAO JIMIN

IPC: G01N21/55

CPC classification number: G01N21/554

Abstract: The present invention provides plasmonic crystals comprising three-dimensional and quasi comprising three-dimensional distributions of metallic or semiconducting films, including multi-layered crystal structures comprising nanostructured films and film arrays. Plasmonic crystals of the present invention include precisely registered and deterministically selected nonplanar crystal geometries and spatial distributions providing highly coupled, localized plasmonic responses in thin film elements and/or nanostructures of the crystal. Coupling of plasmonic responses provided by three-dimensional and quasi-three dimensional plasmonic crystal geometries and structures of the present invention generates enhanced local plasmonic field distributions useful for detecting small changes in the composition of an external dielectric environment proximate to a sensing surface of the plasmonic crystal. Plasmonic crystal structures of the present invention are also useful for providing highly localized excitation and/or imaging of fluorophores proximate to the crystal surface.

Abstract translation: 本发明提供包含三维和准包含金属或半导体膜的三维分布的等离子体激元晶体，包括包含纳米结构膜和膜阵列的多层晶体结构。 本发明的等离子体激元晶体包括精确配准和确定性选择的非平面晶体几何形状和空间分布，在晶体的薄膜元件和/或纳米结构中提供高度耦合的，局部等离子体激元响应。 由本发明的三维和准三维等离子体晶体几何形状和结构提供的等离子体激元响应的耦合产生增强的局部等离子体激元场分布，其可用于检测靠近等离子体激元的感测表面的外部电介质环境的组成的微小变化 水晶。 本发明的等离激元晶体结构也可用于提供靠近晶体表面的荧光团的高度局部激发和/或成像。

公开(公告)号：WO2008055054A2

公开(公告)日：2008-05-08

申请号：PCT/US2007082633

申请日：2007-10-26

Applicant: UNIV ILLINOIS ,  ROGERS JOHN A ,  MENARD ETIENNE

Inventor： ROGERS JOHN A ,  MENARD ETIENNE

IPC: G03B27/04 ,  G03C5/00

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/50 ,  H01L51/0017

Abstract: The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.

Abstract translation: 本发明提供用于在衬底表面上制造图案的方法，装置和设备部件，具体地说图案包括具有在一维，二维或三维中具有选定长度的微细化和/或纳米化特征的结构，并包括具有可变高度，深度或 高度和深度。 包含多个聚合物层的复合图案形成装置各自具有选定的机械和热性能以及物理尺寸，从而在各种衬底表面和表面形态上提供高分辨率图案。 提供用于灰度图案生成的灰度油墨光刻光掩模或用于在衬底表面上产生浮雕浮雕特征的模具。 所制造的图案的特定形状可以通过改变弹性图案形成装置上的三维凹陷图案来操纵，所述弹性图案形成装置与衬底保形接触以将图案形成剂定位到图案的凹陷部分。

公开(公告)号：WO2005122285A3

公开(公告)日：2007-08-30

申请号：PCT/US2005019354

申请日：2005-06-02

Applicant: UNIV ILLINOIS ,  NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/00 ,  B81C1/00 ,  H01L21/20 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).

Abstract translation: 本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。 本发明还提供可拉伸半导体结构（760）。

公开(公告)号：EP3052017A4

公开(公告)日：2017-06-14

申请号：EP14851143

申请日：2014-10-02

Applicant: UNIV ILLINOIS ,  WASHINGTON UNIV IN ST LOUIS

Inventor： ROGERS JOHN A ,  EFIMOV IGOR ,  GUTBROD SARAH ,  XU LIZHI ,  BONIFAS ANDREW ,  WEBB RICHARD CHAD ,  KOH AHYEON

IPC: A61B5/0408

CPC classification number: A61B5/686 ,  A61B5/0084 ,  A61B5/01 ,  A61B5/015 ,  A61B5/02055 ,  A61B5/036 ,  A61B5/0422 ,  A61B5/0538 ,  A61B5/1107 ,  A61B5/1116 ,  A61B5/14539 ,  A61B5/14546 ,  A61B5/1473 ,  A61B5/4836 ,  A61B5/6869 ,  A61B5/6885 ,  A61B18/14 ,  A61B2018/00351 ,  A61B2562/0215 ,  A61B2562/028 ,  A61B2562/046 ,  A61B2562/164 ,  A61F7/007 ,  A61H23/0245 ,  A61H2201/10 ,  A61N1/0563 ,  A61N1/0597 ,  A61N1/3621 ,  A61N1/375 ,  A61N2/002 ,  A61N2/006 ,  A61N5/0603 ,  A61N5/0622

Abstract: Provided are devices and methods capable of interfacing with biological tissues, such as organs like the heart, in real-time and using techniques which provide the ability to monitor and control complex physical, chemical, biochemical and thermal properties of the tissues as a function of time. The described devices and methods utilize micro scale sensors and actuators to spatially monitor and control a variety of physical, chemical and biological tissue parameters, such as temperature, pH, spatial position, force, pressure, electrophysiology and to spatially provide a variety of stimuli, such as heat, light, voltage and current.

Abstract translation: 提供了能够与生物组织如心脏等器官实时接口的装置和方法，并且使用能够监测和控制组织的复杂物理，化学，生物化学和热特性的技术作为 时间。 所描述的装置和方法利用微尺度传感器和致动器来在空间上监测和控制各种物理，化学和生物组织参数，例如温度，pH，空间位置，力，压力，电生理学，并且在空间上提供各种刺激， 如热，光，电压和电流。