公开(公告)号：US20220248145A1

公开(公告)日：2022-08-04

申请号：US17675850

申请日：2022-02-18

Applicant: Vesper Technologies Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H04R17/02 ,  H04R7/06 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332 ,  H04R31/00

Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

公开(公告)号：US20210273152A1

公开(公告)日：2021-09-02

申请号：US17180193

申请日：2021-02-19

Applicant: The Regents of the University of Michigan ,  VESPER TECHNOLOGIES INC.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H01L41/083 ,  H01L41/187 ,  H01L41/113 ,  H04R17/00 ,  H04R17/02 ,  B81B7/00 ,  B81B7/02 ,  B81B3/00

Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

公开(公告)号：US10964880B2

公开(公告)日：2021-03-30

申请号：US16196922

申请日：2018-11-20

Applicant: The Regents of the University of Michigan ,  Vesper Technologies Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H01L41/083 ,  H01L41/187 ,  H01L41/113 ,  H04R17/00 ,  H04R17/02 ,  B81B7/00 ,  B81B7/02 ,  B81B3/00

Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

公开(公告)号：US20190281393A1

公开(公告)日：2019-09-12

申请号：US16353934

申请日：2019-03-14

Applicant: Vesper Technologies Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H04R17/02 ,  H04R31/00 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332 ,  H04R7/06

Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

公开(公告)号：US10284960B2

公开(公告)日：2019-05-07

申请号：US14702319

申请日：2015-05-01

Applicant: Vesper Technologies Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H01L41/09 ,  H04R25/00 ,  H04R17/00 ,  H04R17/02 ,  H04R7/06 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332 ,  H04R31/00

Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

公开(公告)号：US10001391B1

公开(公告)日：2018-06-19

申请号：US14826188

申请日：2015-08-13

Applicant: Vesper Technologies Inc.

Inventor： Robert J. Littrell ,  Karl Grosh

IPC: G01D18/00 ,  G01H13/00 ,  H04R3/06 ,  H04R19/04

CPC classification number: G01D18/00 ,  G01H13/00 ,  H04R3/002 ,  H04R3/04 ,  H04R3/06 ,  H04R19/04 ,  H04R2201/003

Abstract: An electronic device comprises a sensor comprising first and second electrodes, with the sensor being configured for a first acoustic displacement due to input acoustic pressure; circuitry configured to measure a charge between the first and second electrodes due to the input acoustic pressure and to apply a voltage to cause a second acoustic displacement of the sensor that is out of phase with the first acoustic displacement, with the applied voltage further causing a charge to develop across the sensor, and with the first and second acoustic displacements causing an increase in damping in a resonance frequency of the sensor, relative to damping of the resonance frequency of the sensor prior to applying the voltage; and a passive electronic component configured to cancel out the charge developed across the sensor due to the applied voltage.