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    POLYAMIC ACID COMPOSITION, POLYIMIDE FILM, AND COPPER CLAD LAMINATE
    11.
    发明申请
    POLYAMIC ACID COMPOSITION, POLYIMIDE FILM, AND COPPER CLAD LAMINATE 有权

    公开(公告)号：US20210017336A1

    公开(公告)日：2021-01-21

    申请号：US16561401

    申请日：2019-09-05

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： SZU-HSIANG SU ,  PEI-JUNG WU ,  KUAN-WEI LEE ,  SHOU-JUI HSIANG

    IPC: C08G73/10 ,  C08L79/08 ,  C09K19/12 ,  C09K19/30 ,  B32B15/20 ,  B32B15/088

    Abstract: A polyamic acid composition is polymerized by dianhydride monomers and diamine monomers. A range of molar ratio of the dianhydride monomers to the diamine monomers is from 0.9 to 1.1. The diamine monomers have a combination of specific functional groups containing at least one nitrogen heterocycle structure, at least one liquid crystal structure, and at least one soft structure, wherein the diamine monomer containing nitrogen heterocycle structure has a molar weight percentage of 3% to 8% of a total molar weight of the diamine monomers, and the diamine monomers containing at least one liquid crystal structure and at least one soft structure have a molar weight percentage of 92% to 97% of the total molar weight of the diamine monomers. The disclosure further relates to a polyimide film, a copper clad laminate, and a printed circuit board.

    DIAMINE MONOMER COMPOUND, METHOD FOR PREPARING THE SAME, RESIN, FLEXIBLE FILM, AND ELECTRONIC DEVICE
    14.
    发明申请
    DIAMINE MONOMER COMPOUND, METHOD FOR PREPARING THE SAME, RESIN, FLEXIBLE FILM, AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20230091989A1

    公开(公告)日：2023-03-23

    申请号：US17490119

    申请日：2021-09-30

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  CHING-HSUAN LIN ,  WAN-LING HSIAO ,  REN-YU YEH

    IPC: C08G73/10 ,  C08J5/18

    Abstract: A diamine monomer compound with reduced dielectric losses for better integrity and stability in digital transmissions is represented by a structural formula of wherein n1 is an integer greater than 1. A method for preparing the diamine monomer compound and a polyimide resin developed therefrom are disclosed. The diamine monomer compound introduces a long even numbered carbon chain and a liquid crystal unit structure, the long even numbered carbon chain giving flexibility, which reduces the regularity and rigidity of the molecular chain and facilitates film-forming processing. Dimensional stability is improved, and the coefficient of thermal expansion of the materials is reduced, the materials have good mechanical and heat-tolerant thermal properties, the loss factor and the coefficient of thermal expansion of the materials being reduced. A flexible film of the resin and an electronic device are also disclosed.

    CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION
    16.
    发明申请
    CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION 有权

    公开(公告)号：US20210102067A1

    公开(公告)日：2021-04-08

    申请号：US17121616

    申请日：2020-12-14

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  MING-JAAN HO

    IPC: C08L79/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03 ,  C08L51/08

    Abstract: A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

    POLYIMIDE FILM, BLOCK COPOLYMER OF POLYAMIDE ACID, AND METHOD FOR MANUFACTURING THE BLOCK COPOLYMER OF POLYAMIDE ACID
    17.
    发明申请
    POLYIMIDE FILM, BLOCK COPOLYMER OF POLYAMIDE ACID, AND METHOD FOR MANUFACTURING THE BLOCK COPOLYMER OF POLYAMIDE ACID 有权

    公开(公告)号：US20210087319A1

    公开(公告)日：2021-03-25

    申请号：US16936204

    申请日：2020-07-22

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  PEI-JUNG WU ,  WEI-HSIN HUANG

    IPC: C08F293/00 ,  C08J5/18

    Abstract: A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of and intermediate groups selected from a chemical structural formula of Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.

    MODIFIED POLYIMIDE COMPOUND, RESIN COMPOSITION AND POLYIMIDE FILM
    18.
    发明申请
    MODIFIED POLYIMIDE COMPOUND, RESIN COMPOSITION AND POLYIMIDE FILM 审中-公开

    公开(公告)号：US20190359852A1

    公开(公告)日：2019-11-28

    申请号：US16533932

    申请日：2019-08-07

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： MING-JAAN HO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  NAN-KUN HUANG ,  YU-WEN KAO ,  CHIA-YIN TENG ,  CHING-HSUAN LIN

    IPC: C09D179/08 ,  C08G73/10 ,  C08L63/00

    Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

    POLYIMIDE COMPONENT, POLYIMIDE FILM, AND POLYIMIDE COPPER CLAD LAMINATE
    20.
    发明申请
    POLYIMIDE COMPONENT, POLYIMIDE FILM, AND POLYIMIDE COPPER CLAD LAMINATE 有权

    公开(公告)号：US20220002490A1

    公开(公告)日：2022-01-06

    申请号：US16990148

    申请日：2020-08-11

    Applicant: Zhen Ding Technology Co., Ltd.

    Inventor： KUAN-WEI LEE ,  SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  PEI-JUNG WU ,  WEI-HSIN HUANG

    IPC: C08G73/10 ,  C08J5/18

    Abstract: A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is: The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.

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