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公开(公告)号：US20170325356A1
公开(公告)日：2017-11-09
申请号：US15191550
申请日：2016-06-24
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： NING HOU , CONG LEI , BIAO LI , MING-JAAN HO
IPC: H05K7/20
CPC classification number: H01L23/3735 , H01L21/4882 , H01L23/3736 , H01L23/3737 , H01L23/4275
Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.
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公开(公告)号：US20160381786A1
公开(公告)日：2016-12-29
申请号：US14858652
申请日：2015-09-18
Applicant: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , ZHEN DING TECHNOLOGY CO., LTD.
Inventor： XIAN-QIN HU , FU-YUN SHEN , MING-JAAN HO , YI-QIANG ZHUANG
CPC classification number: H05K1/0216 , H05K1/0219 , H05K1/0237 , H05K1/024 , H05K1/09 , H05K3/06 , H05K3/4697 , H05K2201/0154 , H05K2201/0394 , H05K2201/09618 , H05K2203/063
Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.
Abstract translation: 柔性电路板包括两个覆铜层压板，电路图案和两个接合层。 每个覆铜层压板包括绝缘基底和外部电路层。 电路图案位于两个覆铜层压板之间。 电路图案包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 每个结合层位于电路图案和相应的覆铜层压板之间。 每个编码层限定了一个没有粘合剂的槽。 接合层通过槽与线性信号线隔开。 狭槽和中空区域协同地限定了包围线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US20150101785A1
公开(公告)日：2015-04-16
申请号：US14512546
申请日：2014-10-13
Inventor： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN
CPC classification number: F28F21/085 , B21D53/04 , F28D15/02 , F28F2275/025 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
Abstract translation: 散热装置包括第一铜片和第二铜片。 第一铜片包括多个第一凹槽，第二铜片包括多个对应的第二凹槽。 第二铜片被固定在第一铜片上，并且每个第一凹部和每个第二凹部形成气密接收腔，气密接收腔中的工作流体携带不需要的热量。
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公开(公告)号：US20180265699A1
公开(公告)日：2018-09-20
申请号：US15871141
申请日：2018-01-15
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： SZU-HSIANG SU , SHOU-JUI HSIANG , MAO-FENG HSU , MING-JAAN HO
CPC classification number: C08L79/08 , C08J3/246 , C08J5/18 , C08J2351/00 , C08J2351/04 , C08J2351/06 , C08J2351/08 , C08J2379/08 , C08J2447/00 , C08J2463/00 , C08J2471/12 , C08L51/003 , C08L51/006 , C08L51/08 , C08L2203/20 , C08L2205/03 , C08L2312/00 , H05K1/0373 , H05K3/386 , H05K2201/0104 , H05K2201/0154 , C08L71/12 , C08L51/04
Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.
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5.发明申请公开(公告)号：US20180223048A1
公开(公告)日：2018-08-09
申请号：US15686232
申请日：2017-08-25
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： MAO-FENG HSU , SHOU-JUI HSIANG , SZU-HSIANG SU , YU-WEN KAO , CHIA-YIN TENG , MING-JAAN HO , YAO-YI CHENG , HSIN-MIN HSIAO
CPC classification number: C08G81/024 , C03C17/32 , C03C2218/32 , C08G73/1014 , C08G73/1039 , C08G73/105 , C08G73/1071 , C09D179/08 , H05K1/024 , H05K1/0326 , H05K1/034 , H05K1/0393 , H05K3/22 , H05K2201/0158 , H05K2203/0759
Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.
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Patent Agency Ranking
公开(公告)号：US20150053466A1
公开(公告)日：2015-02-26
申请号：US14465794
申请日：2014-08-21
Inventor： MING-JAAN HO , XIAN-QIN HU , JIAN LUO , FU-YUN SHEN
CPC classification number: H05K1/0274 , H05K1/09 , H05K3/06 , H05K2201/0108 , H05K2201/0145 , H05K2201/0338 , H05K2201/0355 , Y10T29/49156
Abstract: A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.
Abstract translation: 公开了一种印刷电路板（PCB）及其制造方法。 PCB包括透明绝缘基板，导电电路层16和透明覆盖层。 导电电路层位于透明绝缘基板和透明覆盖层之间。 导电电路层包括第一Ni-W合金图案层，铜图案层和第二Ni-W合金图案层。 第一Ni-W合金图案层用透明粘合剂层粘附。 导电图案层的底表面被第一Ni-W合金图案层涂覆。 导电图案层的顶表面和侧表面由第二Ni-W合金图案层涂覆。
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7.发明申请PCB WITH VISIBLE CIRCUIT AND METHOD FOR MAKING AND USING PCB WITH VISIBLE CIRCUIT 审中-公开具有可见电路的PCB和用于制造和使用具有可见电路的PCB的方法公开(公告)号：US20140151092A1
公开(公告)日：2014-06-05
申请号：US14085654
申请日：2013-11-20
Inventor： MING-JAAN HO , XIAN-QIN HU
CPC classification number: H05K1/0274 , H05K3/0058 , H05K2201/0108
Abstract: A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA).
Abstract translation: 具有可见电路的印刷电路板（PCB）包括电路基板，第一和第二释放膜以及第一和第二光学透明粘合剂（OCA）层。 第一和第二释放膜分别经由第一和第二OCA层被压制并且分别粘合到流通的衬底的两个相对的表面上，并且第一和第二OCA层由聚甲基丙烯酸甲酯（PMMA）制成。
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公开(公告)号：US20170188451A1
公开(公告)日：2017-06-29
申请号：US15078214
申请日：2016-03-23
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： XIAN-QIN HU , FU-YUN SHEN , MING-JAAN HO , YI-QIANG ZHUANG
CPC classification number: H05K1/0242 , H05K1/0219 , H05K1/0298 , H05K1/0393 , H05K1/09 , H05K1/144 , H05K3/4038 , H05K3/4611 , H05K3/4652 , H05K3/4697 , H05K2201/042 , H05K2201/05 , H05K2201/0715 , H05K2201/09236 , H05K2201/09618
Abstract: A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two grounding lines. The metal coating layer encloses the signal line. The second circuit substrate includes a third circuit layer. The bonding layer is located between and bonding the first circuit substrate and the second circuit substrate. The second circuit layer, the third circuit layer are electrically coupled with the grounding lines by a plurality of electrically conductive holes. The first base layer, the bonding layer and the second circuit substrate cooperatively enclose a hermetic medium layer receiving the signal line. The hermitic medium layer is filled with air. A method for manufacturing the flexible circuit board is also provided.
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公开(公告)号：US20170105280A1
公开(公告)日：2017-04-13
申请号：US14926195
申请日：2015-10-29
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： XIAN-QIN HU , MING-JAAN HO
CPC classification number: H05K1/0219 , H05K1/0221 , H05K1/024 , H05K1/0296 , H05K3/022 , H05K3/06 , H05K3/4697 , H05K2201/05 , H05K2201/0715
Abstract: A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.
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公开(公告)号：US20160320142A1
公开(公告)日：2016-11-03
申请号：US14835978
申请日：2015-08-26
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN
CPC classification number: B32B38/10 , B32B3/30 , B32B7/12 , B32B7/14 , B32B15/01 , B32B15/018 , B32B15/043 , B32B15/20 , B32B37/12 , B32B37/1292 , B32B2457/00 , C22C9/00 , F28D15/0233 , F28D15/0283 , F28F3/048 , F28F21/085 , F28F2275/025 , H01L23/427
Abstract: A thin heat dissipation foil includes a first copper foil, a second copper foil, a plurality of bonding blocks and a working fluid. The first copper foil includes a first bonding surface, the first bonding surface defines a plurality of first receiving cavities and a plurality of first bonding recesses surrounding the first receiving cavities. The second copper foil includes a second bonding surface, the second bonding surface defines a plurality of second receiving cavities corresponding to each of the first receiving cavities. Each bonding block is located in the first bonding recess. The bonding block is configured to bond the first bonding surface and the second bonding surface to form a seamless interface, and each first receiving cavity and each second receiving cavity together form a vacuum tube. The working fluid is received in the vacuum tube.
Abstract translation: 薄的散热箔包括第一铜箔，第二铜箔，多个接合块和工作流体。 第一铜箔包括第一接合表面，第一接合表面限定多个第一接收腔和围绕第一接收腔的多个第一接合凹槽。 第二铜箔包括第二接合表面，第二接合表面限定对应于每个第一接收腔的多个第二接收腔。 每个接合块位于第一接合凹部中。 接合块被配置为结合第一接合表面和第二接合表面以形成无缝接口，并且每个第一接收腔和每个第二接收腔一起形成真空管。 工作流体被接收在真空管中。
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