公开(公告)号：US5928440A

公开(公告)日：1999-07-27

申请号：US513397

申请日：1995-08-10

Applicant: Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

Inventor： Takeo Kuramoto ,  Masataka Watabe ,  Satoshi Noda ,  Takashi Shoji ,  Takekazu Sakai

IPC: B23K3/06 ,  B23K35/02 ,  B23K35/36 ,  H01L23/495 ,  H05K3/28 ,  H05K3/34 ,  B23K35/24

CPC classification number: H05K3/282 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/3615 ,  H01L23/49582 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/0002 ,  H05K2201/10984 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/0557 ,  H05K2203/0591 ,  H05K2203/124 ,  Y10T428/12556

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract translation: 在诸如印刷电路板的金属电路板的焊盘和电子部件的引线框架的金属表面上形成焊料膜的方法，其能够形成精确和精细的图案，并且包括仅选择性地赋予粘合性 通过粘性层形成溶液将金属表面的预定部分粘附到所得粘性部分上，然后通过加热熔化焊料从而形成焊料膜。

公开(公告)号：US5911356A

公开(公告)日：1999-06-15

申请号：US911458

申请日：1997-08-14

Applicant: Arata Tsurusaki

Inventor： Arata Tsurusaki

IPC: B23K1/008 ,  H05K3/00 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3405 ,  B23K1/008 ,  B23K2201/42 ,  H05K2201/10371 ,  H05K3/0052 ,  Y10S174/34

Abstract: A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.

Abstract translation: 一种将引线部分和屏蔽壳体附接以防止高频信号泄漏到印刷电路板的方法包括：涂覆焊料的焊料涂覆步骤，使得焊料应覆盖通过印刷电路提供的整个孔 插入引线部分的引线的板，使得焊料应覆盖通过印刷电路板提供的孔的一部分，其中插入有屏蔽壳的接合部分的安装步骤， 导线部分和屏蔽壳体的接合部分分别插入相应的孔中，从而将引线部分和屏蔽壳体安装在印刷电路板上，以及焊接步骤，将安装有引线部分和屏蔽壳体的印刷电路板插入 回流炉并熔化焊料从而进行焊接。

公开(公告)号：US5904782A

公开(公告)日：1999-05-18

申请号：US785699

申请日：1997-01-17

Applicant: Hiep Diep-Quang

Inventor： Hiep Diep-Quang

IPC: B23K35/363 ,  B23K35/02 ,  B23K35/22 ,  B23K35/36 ,  H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2201/42 ,  B23K35/0227 ,  B23K35/025

Abstract: A resin-based VOC-free soldering flux consists of 40 to 50 wt % of a liquid epoxy resin, 25 to 30 wt % of a non-volatile liquid epoxy diluent, 20 to 33 wt % of a polyfunctional carboxylic acid, and 2.0 to 3.5 wt % of a thixotropic agent. There are no volatile organic solvents or compounds in the flux which can evaporate during the reflow process. The carboxylic acids are provided in powdered form and are suspended in the epoxy blend wherein they remain as solid particles until heated in the solder reflow process. A VOC-free solder paste formed from the flux consists of 40 to 95 wt % soldering particles, and 5 to 60 wt % of the VOC-free soldering flux. The thixotropic agent improves printability of the solder paste onto printed wiring boards. A VOC-free flux-core solder wire includes the VOC-free flux as the inner core of the wire with an outer shell of solder alloy. The VOC-free, epoxy resin based flux effectively activates the solder powder and the copper contact during the reflow process, while at the same time hardens to leave a solid, dry, yet flexible residue on a printed wiring board. No organic compounds are emitted during the reflow process.

Abstract translation: 基于树脂的无VOC焊剂由40至50重量％的液体环氧树脂，25至30重量％的非挥发性液体环氧稀释剂，20至33重量％的多官能羧酸和2.0至 3.5重量％的触变剂。 焊剂中没有挥发性有机溶剂或化合物，可在回流过程中蒸发。 羧酸以粉末形式提供并悬浮在环氧树脂共混物中，其中它们作为固体颗粒保留，直到在回流焊接过程中加热。 由焊剂形成的无VOC焊膏由40至95重量％的焊接颗粒和5至60重量％的无VOC焊剂组成。 触变剂提高了焊膏对印刷线路板的印刷性。 无VOC的助焊剂芯焊丝包括不含VOC的焊剂作为焊丝内芯与焊料合金外壳。 无回流环氧树脂基助焊剂在回流过程中有效地激活焊料粉末和铜接触，同时硬化在印刷电路板上留下固体，干燥而又柔软的残留物。 在回流过程中不排放有机化合物。

公开(公告)号：US5894980A

公开(公告)日：1999-04-20

申请号：US718607

申请日：1996-09-23

Applicant: Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

Inventor： Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz

IPC: B23K3/06 ,  B23K37/06

CPC classification number: B23K3/0623 ,  B22F2009/0836 ,  B22F2999/00 ,  B23K2201/42

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.

Abstract translation: 一种用于将选择的焊料图案沉积到衬底上的装置，包括：具有用于承载要在其上安装一个或多个电子部件的衬底的结构的衬底支撑件; 焊料喷射器，其限定用于容纳熔融焊料的空腔和用于喷射熔融焊料流的孔口; 用于将焊料加热到高于焊料熔点的温度的加热器; 耦合到所述焊料喷射器的振动器，以在所述流中以期望的频率形成液滴以沉积到所述衬底上; 以及设置在加热器和振动器之间的适于接收冷却剂的冷却器，以将振动器的温度保持在低于不利地影响振动器性能的温度。

公开(公告)号：US5868564A

公开(公告)日：1999-02-09

申请号：US920948

申请日：1992-07-28

Applicant: William Wayne Olah ,  Thomas Paul White

Inventor： William Wayne Olah ,  Thomas Paul White

IPC: F27B9/00 ,  B23K3/06 ,  F27B9/12 ,  F27B9/24 ,  F27B9/36 ,  F27B9/40 ,  F27D19/00 ,  F27B9/28

CPC classification number: B23K3/0676 ,  F27B9/243 ,  F27B9/36 ,  F27B9/40 ,  B23K2201/42 ,  F27B9/12 ,  F27D2019/0059

Abstract: This invention relates generally to a belt type furnace. More specifically, this invention relates to a belt type furnace that sequentially stops the belt at the vicinity of at least one heater, and where the heater comprises at least two heating elements.

公开(公告)号：US5826779A

公开(公告)日：1998-10-27

申请号：US874836

申请日：1997-06-13

Applicant: David C. Jacks ,  Randall R. Walston

Inventor： David C. Jacks ,  Randall R. Walston

IPC: B23K1/012 ,  B23K1/018 ,  B23K3/02 ,  B23K3/047

CPC classification number: B23K1/012 ,  B23K1/018 ,  B23K3/025 ,  B23K2201/36 ,  B23K2201/42 ,  H01L2224/16225

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract translation: 一方面，提供了一种用于将部件附接到电路板的装置，包括保持在保持器中的电路板和接触加热器，所述接触加热器通过接触加热电路板上的部件并且通过部件传导热量。 在另一方面，接触加热器是手动移动到部件上的魔杖。 在另一方面，本发明提供了一种用于将部件附接到电路板的方法，包括以下步骤：用接触加热器夹紧部件; 将组件放置在电路板上; 并且通过接触加热电路板上的部件，其中通过部件传导的热量熔化部件下的焊料并将部件附接到电路板。

公开(公告)号：US5815912A

公开(公告)日：1998-10-06

申请号：US745082

申请日：1996-11-07

Applicant: Jeffery Richard Willshere ,  Trevor Martin Ruddock

Inventor： Jeffery Richard Willshere ,  Trevor Martin Ruddock

IPC: B23K3/08 ,  H05K3/00 ,  H05K3/12 ,  B23P21/00

CPC classification number: B23K3/08 ,  B23K2201/42 ,  H05K3/0008 ,  H05K3/1216 ,  Y10T29/53091 ,  Y10T29/53265 ,  Y10T29/53374

Abstract: A circuit board locating assembly for locating a circuit board during a manufacturing operation such as a solder paste printing operation performed on the board, the locating assembly comprising a tooling platen for supporting during the operation a plurality of individual board support means, a magazine for storing the board support means when the board support means are removed from the area in which the board is supported during the operation, and conveying means adapted to convey the board support means from the magazine and to position the board support means in selected positions on the tooling platen.

Abstract translation: 一种用于在制造操作期间定位电路板的电路板定位组件，例如在板上执行的焊膏打印操作，定位组件包括用于在操作期间支撑多个单独的板支撑装置的工具台板，用于存储 板支撑装置，当板支撑装置在操作期间从板被支撑的区域移除时;以及输送装置，适于将输送板支撑装置从料盒移动并且将板支撑装置定位在工具上的选定位置 滚筒。

公开(公告)号：US5800856A

公开(公告)日：1998-09-01

申请号：US943446

申请日：1997-10-03

Applicant: Loan T. Hong Vuong

Inventor： Loan T. Hong Vuong

IPC: B23K3/06 ,  B41C1/14 ,  H05K3/12 ,  B05D1/00

CPC classification number: H05K3/1225 ,  B23K3/0638 ,  B41C1/14 ,  B23K2201/42

Abstract: A mask stencil (112) is made with at least one indicator line (204, 205) of material pre-removed from a wear surface (212) of the mask stencil, the depth of the line is approximately the amount of stencil mask material that can be worn from the wear surface of the mask stencil by a squeegee (110) without adversely affect an amount of solder paste (114) that accumulates on a printed circuit board substrate (116) through openings (201) in the mask stencil. In another embodiment, the mask stencil (112) is made with at least one indicator line (304, 305) of material pre-removed from a surface opposite (314) the wear surface (312). The amount of stencil mask material that remains above the indicator line is approximately equal to the amount of material that can be worn from the wear surface of the mask stencil by the squeegee without adversely affect an amount of solder paste that accumulates on the printed circuit board.

Abstract translation: 掩模模板（112）由至少一个从掩模模板的磨损表面（212）去除的材料的指示线（204,205）制成，该线的深度大约是模版掩模材料的量， 可以通过刮板（110）从掩模模板的磨损表面磨损，而不会不利地影响通过掩模模板中的开口（201）积聚在印刷电路板基板（116）上的焊膏（114）的量。 在另一个实施例中，掩模模板（112）由与磨损表面（312）相对的表面（314）预先去除的材料的至少一个指示线（304,305）制成。 保留在指示线上方的模板掩模材料的量大致等于可以通过刮板从掩模模板的磨损表面磨损的材料的量，而不会不利地影响积聚在印刷电路板上的焊膏的量 。

公开(公告)号：US5794836A

公开(公告)日：1998-08-18

申请号：US783720

申请日：1997-01-16

Applicant: Jeff J. Lin ,  Peter J. Sinkunas ,  Myron Lemecha ,  Stephen H. P. Wong

Inventor： Jeff J. Lin ,  Peter J. Sinkunas ,  Myron Lemecha ,  Stephen H. P. Wong

IPC: B23K1/20 ,  H05K3/34 ,  B23K3/08

CPC classification number: B23K1/203 ,  B23K2201/42 ,  H05K3/3489

Abstract: An inert gas air horn distribution device employs a labyrinth with a baffle to clean the nitrogen gas used to deposit flux on circuit boards before wave soldering operations. The baffle diverts the gas flow causing heavier flux particles to collect in the labyrinth while the lighter gas exits for use in depositing flux on the circuit boards. The labyrinth cleans the gas thereby keeping the knife clean which produces more uniform results with less maintenance.

Abstract translation: 惰性气体空气喇叭分配装置在波峰焊接操作之前使用具有挡板的迷宫式清洁用于在电路板上沉积焊剂的氮气。 挡板转移气流，导致较重的助焊剂颗粒收集在迷宫中，而较轻的气体离开以用于在电路板上沉积焊剂。 迷宫清洁气体，从而保持刀具清洁，从而在维护较少的情况下产生更均匀的结果。

公开(公告)号：US5775568A

公开(公告)日：1998-07-07

申请号：US686781

申请日：1996-07-26

Applicant: Jess Asla ,  Roy Lange ,  Ron Despain

Inventor： Jess Asla ,  Roy Lange ,  Ron Despain

IPC: B23K3/06 ,  B23K3/08 ,  H05K3/34

CPC classification number: B23K3/08 ,  B23K3/0676 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2201/09418

Abstract: A method for wave soldering comprises the steps of providing a circuit board having a plurality of electronic components thereon and providing a pallet comprising a frame, first and second parallel rails attached to the frame, and third and fourth rails for receiving the circuit board. The third and fourth rails are attached to the first and second rails and the third and fourth rails form an angle of between about 30.degree. and 60.degree. with the first and second rails. Next, a solder wave is provided which generally flows in a first direction. Finally, the pallet is moved in a second direction generally perpendicular with the first direction across the solder wave. The components are therefore positioned at an angle with respect to the solder wave and solder-related electrical defects are reduced.

Abstract translation: 一种用于波峰焊的方法包括以下步骤：在其上提供具有多个电子部件的电路板，并提供包括框架的托盘，附接到框架的第一和第二平行导轨以及用于接收电路板的第三和第四导轨。 第三和第四轨道附接到第一和第二轨道，并且第三和第四轨道与第一和第二轨道形成在约30度和60度之间的角度。 接下来，提供通常沿第一方向流动的焊波。 最后，托盘在大致垂直于焊料波的第一方向的第二方向移动。 因此，这些部件相对于焊料波形成一角度，并减少焊料相关的电气缺陷。