公开(公告)号：CN105849862A

公开(公告)日：2016-08-10

申请号：CN201480071050.7

申请日：2014-12-17

Applicant: DIC株式会社

Inventor： 伊部武史 ,  矢田真

IPC: H01L21/027 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L25/02 ,  C08L101/02 ,  H01L21/3065

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: 本发明提供一种干式蚀刻抗蚀剂用固化性树脂组合物，其特征在于，所述干式蚀刻抗蚀剂用固化性树脂组合物含有聚合物(A)，所述聚合物(A)在侧链具有包含连接有乙烯基的芳香族基团的特定结构，该聚合物(A)中的特定结构在聚合物(A)中占80～100重量％。还提供一种干式蚀刻用抗蚀掩模，其特征在于，其是使该干式蚀刻抗蚀剂用固化性组合物固化而成的，以及提供一种干式蚀刻用抗蚀掩模，其具有由纳米压印法得到的图案。

公开(公告)号：JP4872373B2

公开(公告)日：2012-02-08

申请号：JP2006037362

申请日：2006-02-15

Applicant: 株式会社日立製作所

Inventor： 健二 村尾 ,  孝介 桑原 ,  雅彦 荻野

IPC: G02B1/02 ,  C12N15/09 ,  G02B1/04

CPC classification number: B81C1/0046 ,  B29C43/021 ,  B29C2043/025 ,  B81B2201/0214 ,  B81B2203/0361 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y15/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: It is an object of the present invention to provide a method which can easily and selectively modify specific sites on indentations or protrusions of indentation/protrusion structures fabricated by nanoimprinting. Pressing a mold having indentation/protrusion structures onto a polymer substrate comprising at least two layers of different chemical composition exposes the second layer, which has been covered by the outermost layer, in pillars formed as a result of the pressing. Site-specific chemical modification of the pillars can be achieved by formulating a desired chemical composition for the second layer beforehand, or by chemical modification of the exposed second layer cross-sections in the pillars.

公开(公告)号：WO2013044180A1

公开(公告)日：2013-03-28

申请号：PCT/US2012/056769

申请日：2012-09-22

Applicant: 1366 TECHNOLOGIES INC. ,  SACHS, Emanuel, M.

Inventor： SACHS, Emanuel, M.

IPC: H01L31/18

CPC classification number: H01L31/18 ,  B29C33/40 ,  B29C33/42 ,  B29C33/424 ,  B29C43/021 ,  B29C2033/426 ,  B29C2043/025 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

Abstract: A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp. If the resist layer as deposited is somewhat thicker than the targeted amount, it will simply result in a smaller gap between resist and tool. The presence of a continuous gap assures that no pressure builds under the stamp. Thus, the force on the protrusions i determined only by the pressure above the stamp and is well controlled, resulting in well-controlled hole sizes. The gap prevents resist from being pumped entirely out of any one region, and thus prevents any regions from being uncovered of resist. The stamp can be pulsed in its contact with the substrate, repeatedly deforming the indenting protrusions. Several pulses clears away any scum layer better than does a single press, as measured by an etch test comparison of the degree to which a normal etch for a normal duration etches away substrate material. A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving a gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp.

Abstract translation: 将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下 差距在其间。 在抗蚀剂和印模的延伸表面之间留有间隙。 如果沉积的抗蚀剂层比目标量稍厚一些，则将简单地导致抗蚀剂和工具之间的较小的间隙。 连续间隙的存在确保印章下没有压力。 因此，突起上的力i仅由压力上方的压力确定并且被良好地控制，导致良好控制的孔尺寸。 间隙防止抗蚀剂完全从任何一个区域泵出，从而防止任何区域不被抗蚀剂覆盖。 印模可以与基板接触地脉动，使压痕突起重复变形。 几个脉冲比单次压机更好地清除任何浮渣层，如通过蚀刻测试比较正常蚀刻对正常时间蚀刻掉的衬底材料的程度所测量的。 将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下 在它们之间的差距。 在抗蚀剂和印模的延伸表面之间留有间隙。

公开(公告)号：WO2007085044A1

公开(公告)日：2007-08-02

申请号：PCT/AU2007/000062

申请日：2007-01-24

Applicant: MYCROLAB PTY LTD ,  ATKIN, Micah, James

Inventor： ATKIN, Micah, James

IPC: B81B1/00 ,  B81C1/00

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C59/022 ,  B32B38/00 ,  B32B38/0008 ,  B32B38/162 ,  B32B39/00 ,  B32B2038/1891 ,  B32B2310/0831 ,  B32B2310/14 ,  B32B2425/00 ,  B32B2457/08 ,  B81C1/0046 ,  B81C2201/0153

Abstract: A method of forming a stamped feature (P) on a substrate (S) includes: applying a plurality of stamping tool segments (32, 40a, 40b, 40c, 50, 60, 70, 80, 92) to at least one surface of the substrate. An arrangement (30, 90) for forming a stamped feature (P) on a substrate (S) includes a plurality of stamping tool segments (32, 40a, 40b, 40c, 50, 60, 70, 80, 92) that actuatable individually, in concert in groups of more than one, or combinations thereof.

Abstract translation: 在衬底（S）上形成冲压特征（P）的方法包括：将多个冲压工具段（32,50a，40b，40c，50,60,70,80,92）施加到至少一个表面 底物。 用于在衬底（S）上形成冲压特征（P）的装置（30,90）包括可单独致动的多个冲压工具段（32,50a，40b，40c，50,60,70,80,92） ，多于一个的组合，或其组合。

公开(公告)号：US09956720B2

公开(公告)日：2018-05-01

申请号：US14431348

申请日：2013-09-27

Applicant: North Carolina State University

Inventor： Thomas A. Dow ,  Erik Zdanowicz ,  Alexander Sohn ,  Ron Scattergood ,  William John Nowak, Jr.

IPC: B29C59/02 ,  B29C33/42 ,  B29C33/38 ,  B81C99/00 ,  H01L31/0232 ,  B82Y40/00 ,  B29L31/00 ,  B29L11/00

CPC classification number: B29C59/022 ,  B29C33/3878 ,  B29C33/424 ,  B29C2059/023 ,  B29K2995/0018 ,  B29K2995/0093 ,  B29L2011/00 ,  B29L2031/7562 ,  B81C99/0025 ,  B81C2201/0153 ,  B82Y40/00 ,  H01L31/02325

Abstract: The subject matter described herein relates to methods and systems for fast imprinting of nanometer scale features in a workpiece. According to one aspect, a system for producing nanometer scale features in a workpiece is disclosed. The system includes a die having a surface with at least one nanometer scale feature located thereon. A first actuator moves the die with respect to the workpiece such that the at least one nanometer scale feature impacts the workpiece and imprints a corresponding at least one nanometer scale feature in the workpiece.

公开(公告)号：US20160272737A1

公开(公告)日：2016-09-22

申请号：US15035897

申请日：2014-12-17

Applicant: DIC CORPORATION

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: C08F12/36 ,  H01L21/311 ,  B29C59/02

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract translation: 提供一种干蚀刻抗蚀剂用固化性树脂组合物，该固化性树脂组合物含有在侧链具有包含具有乙烯基的芳香族基团的特定结构的聚合物（A）。 聚合物（A）包括80至100重量％的特定结构。 此外，提供了通过固化用于干蚀刻抗蚀剂的可固化组合物获得的干蚀刻抗蚀剂掩模，以及具有通过纳米压印法形成的图案的干蚀刻抗蚀剂掩模。

公开(公告)号：US08916053B2

公开(公告)日：2014-12-23

申请号：US13528348

申请日：2012-06-20

Applicant: Yoshiaki Kawamonzen ,  Yasuaki Ootera ,  Akiko Yuzawa ,  Naoko Kihara ,  Yoshiyuki Kamata ,  Hiroyuki Hieda ,  Norikatsu Sasao ,  Ryosuke Yamamoto ,  Takeshi Okino ,  Tomoyuki Maeda ,  Takuya Shimada

Inventor： Yoshiaki Kawamonzen ,  Yasuaki Ootera ,  Akiko Yuzawa ,  Naoko Kihara ,  Yoshiyuki Kamata ,  Hiroyuki Hieda ,  Norikatsu Sasao ,  Ryosuke Yamamoto ,  Takeshi Okino ,  Tomoyuki Maeda ,  Takuya Shimada

IPC: C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  B44C3/08 ,  B44C5/04 ,  B81C1/00 ,  B44C1/22 ,  H01L21/033 ,  G03F7/00 ,  B41M5/00

CPC classification number: B44C1/227 ,  B41M5/00 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0337 ,  Y10T156/1041

Abstract: A pattern forming method according to an embodiment includes: forming a pattern film on a first substrate, the pattern film having a concave-convex pattern, the pattern film being made of a material containing a first to-be-imprinted agent; forming a material film on a second substrate, the material film containing a second to-be-imprinted agent having a higher etching rate than an etching rate of the first to-be-imprinted agent; transferring the concave-convex pattern of the pattern film onto the material film by applying pressure between the first substrate and the second substrate, with the pattern film being positioned to face the material film, and by curing the second to-be-imprinted agent; detaching the first substrate from the pattern film; and removing the material film by etching, to leave the pattern film on the second substrate.

Abstract translation: 根据实施例的图案形成方法包括：在第一基板上形成图案膜，所述图案膜具有凹凸图案，所述图案膜由包含第一待打印剂的材料制成; 在第二基板上形成材料膜，所述材料膜含有蚀刻速率高于第一待打印剂的蚀刻速率的第二待定印剂; 通过在第一基板和第二基板之间施加压力将图案膜的凹凸图案转印到材料膜上，图案膜定位成面对材料膜，并且通过固化第二待打印剂; 从图案膜分离第一衬底; 并通过蚀刻去除材料膜，以将图案膜留在第二基板上。

公开(公告)号：US20110117723A1

公开(公告)日：2011-05-19

申请号：US13014771

申请日：2011-01-27

Applicant: Robert Seidel ,  Carsten Peters ,  Frank Feustel

Inventor： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC: H01L21/768 ,  H01L21/762 ,  H01L21/28

CPC classification number: B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

Abstract: By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Abstract translation: 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。

公开(公告)号：US20090074955A1

公开(公告)日：2009-03-19

申请号：US12212330

申请日：2008-09-17

Applicant: Harry D. Rowland

Inventor： Harry D. Rowland

IPC: B32B3/10 ,  B05D5/00

CPC classification number: G03F7/0002 ,  B81C1/00031 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00

Abstract: A method for patterning a surface includes providing a first layer of mechanically deformable material having a first surface. A second layer of mechanically deformable material is placed on the first surface. At least a portion of the second layer is controllably displaced to form at least one patterned void through the second layer.

Abstract translation: 用于图案化表面的方法包括提供具有第一表面的可机械可变形材料的第一层。 第二层机械可变形材料放置在第一表面上。 可控地移位第二层的至少一部分以通过第二层形成至少一个图案化的空隙。

公开(公告)号：US20070117243A1

公开(公告)日：2007-05-24

申请号：US11286065

申请日：2005-11-22

Applicant: Manish Sharma

Inventor： Manish Sharma

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: B81C1/00063 ,  B81B2201/06 ,  B81C2201/0133 ,  B81C2201/0153

Abstract: The present invention provides a method of fabricating a biosensor. The method includes providing a substrate which has a surface coating. The surface coating is deformable and the substrate includes a layered structure which has at least two electrically conductive layers separated by at least one electrically insulating layer. The method also includes imprinting a structure into the surface coating. Further, the method includes etching at least a region of the imprinted structure and the substrate to remove at least a portion of the structure and the substrate. The structure is shaped so that the etching forms at least a portion of the biosensor in the substrate and exposes at least a portion of each electrically conductive layer to form electrodes of the biosensor.

Abstract translation: 本发明提供一种制造生物传感器的方法。 该方法包括提供具有表面涂层的基底。 表面涂层是可变形的，并且衬底包括具有由至少一个电绝缘层分开的至少两个导电层的分层结构。 该方法还包括将结构压印到表面涂层中。 此外，所述方法包括蚀刻所述压印结构的至少一个区域和所述基板以去除所述结构和所述基板的至少一部分。 该结构被成形为使得蚀刻形成衬底中的生物传感器的至少一部分并且暴露出每个导电层的至少一部分以形成生物传感器的电极。