Abstract:
A method for the production of nano- or microscaled ID, 2D and/or 3D depositions from an solution (6), by means of a liquid reservoir (2) for holding the ink with an outer diameter (3,D) of at least 50 nm, is proposed, wherein there is provided an electrode (7,8 or 9) in contact with said ink (6) in said capillary (2), and wherein there is a counter electrode in and/or on and/or below and/or above a substrate (15) onto which the depositions are to be produced, including the steps of: i) keeping the electrode (7, 8, 9) and the counter electrode (15, 18) on an essentially equal potential; ii) establishing a potential difference between the electrode (7, 8, 9) and the counter electrode (15, 18) leading to the growth of an ink meniscus (1) at the nozzle (3) and to the ejection of droplets (13) at this meniscus with a homogeneous size smaller than the meniscus size (11) at a homogenous ejection frequency; keeping the voltage applied while the continuously dried droplets leave behind the dispersed material which leads a structure to emerge with essentially the same diameter as a single droplet, wherein the distance between the substrate (1) and the nozzle (3) is smaller than or equal to 20 times the meniscus diameter at least at the moment of nano-droplet ejection (12); wherein the conductivity of the ink (6) is high enough to stabilize the liquid meniscus during droplet ejection;
Abstract:
A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.
Abstract:
A system and method for manufacturing a display device having an electrically connected front plate and back plate are disclosed. In one embodiment, the method comprises printing conductive raised contours onto a non-conductive back plate, aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings, and sealing the back plate and the front plate.
Abstract:
A method for the production of nano- or microscaled ID, 2D and/or 3D depositions from an solution (6), by means of a liquid reservoir (2) for holding the ink with an outer diameter (3,D) of at least 50 nm, is proposed, wherein there is provided an electrode (7,8 or 9) in contact with said ink (6) in said capillary (2), and wherein there is a counter electrode in and/or on and/or below and/or above a substrate (15) onto which the depositions are to be produced, including the steps of: i) keeping the electrode (7, 8, 9) and the counter electrode (15, 18) on an essentially equal potential; ii) establishing a potential difference between the electrode (7, 8, 9) and the counter electrode (15, 18) leading to the growth of an ink meniscus (1) at the nozzle (3) and to the ejection of droplets (13) at this meniscus with a homogeneous size smaller than the meniscus size (11) at a homogenous ejection frequency; keeping the voltage applied while the continuously dried droplets leave behind the dispersed material which leads a structure to emerge with essentially the same diameter as a single droplet, wherein the distance between the substrate (1) and the nozzle (3) is smaller than or equal to 20 times the meniscus diameter at least at the moment of nano-droplet ejection (12); wherein the conductivity of the ink (6) is high enough to stabilize the liquid meniscus during droplet ejection;
Abstract:
Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
Abstract:
La présente invention concerne un procédé de fabrication d'une pièce d'horlogerie comprenant au moins une première partie réalisée par un procédé de micro fabrication ou de micro formage dans au moins un premier matériau, ledit procédé comprenant au moins : - une étape de dépôt sur ladite première partie d'au moins une deuxième partie de ladite pièce dans au moins un deuxième matériau et - une étape de traitement sur ladite seconde partie (3) pour lier entre eux les composants de la seconde partie (3) et lier la seconde partie à la première partie.
Abstract:
An optimized method of interconnecting layers separated by an insulating layer, and a device by the method. A solid layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. The method includes fabricating a via trench that extends from a surface of the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and for this setup, a specific process period is determined. During said process period, capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. Droplets of the mixture are ink-jetted within said period into a blob on the bottom surface of the via trench, and the layered solid structure is heat treated to evaporate the liquid carrier of the mixture. The resulting conductive interconnection element does not cover the via trench but is substantially higher at a side wall of the via trench, or within an undercut formed into the third layer, than at a point between the side wall and a side wall opposite to it
Abstract:
A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.
Abstract:
A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.