公开(公告)号：US09533375B2

公开(公告)日：2017-01-03

申请号：US14504433

申请日：2014-10-02

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hung Cho ,  Yi-Chen Hsieh ,  Kai-Ping Chuang ,  Sen-Yih Chou ,  Chun-Jen Lin

IPC: B23K26/34 ,  B23K26/067 ,  B23K26/30 ,  B23K26/03 ,  G01J5/08 ,  B29C67/00 ,  B22F3/105

CPC classification number: B23K26/342 ,  B22F3/1055 ,  B22F2003/1056 ,  B23K26/032 ,  B23K26/034 ,  B23K26/082 ,  B23K26/707 ,  B29C64/153 ,  B29C67/0077 ,  G01J5/0803 ,  G01J5/0806 ,  G01J5/0828 ,  G01J5/0846 ,  G01J2005/106 ,  Y02P10/295

Abstract: A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.

Abstract translation: 提供了一种被配置为测量待测表面的温度分布的温度感测装置。 温度感测装置包括透镜组，滤光模块，多个传感器阵列和处理单元。 透镜组被配置为从待测量的表面接收辐射。 滤波模块被配置为将来自透镜组的辐射滤波成分别具有不同波长的多个辐射部分。 传感器阵列被配置成分别感测辐射部分。 处理单元被配置为根据由传感器阵列分别感测的辐射部分来计算不同波长之间的辐射的强度比分布，并根据强度比分布确定温度分布。 还提供了激光加工系统和温度测量方法。

公开(公告)号：US08912494B2

公开(公告)日：2014-12-16

申请号：US13211413

申请日：2011-08-17

Applicant: James A. Chervenak ,  Ari D. Brown ,  Edward J. Wollack ,  Dominic J. Benford

Inventor： James A. Chervenak ,  Ari D. Brown ,  Edward J. Wollack ,  Dominic J. Benford

IPC: G01J5/00 ,  G01J3/02 ,  G01J5/08 ,  G01J3/42 ,  G01J5/20 ,  G01N21/35

CPC classification number: G01J3/0227 ,  G01J3/42 ,  G01J5/0828 ,  G01J5/0837 ,  G01J5/20 ,  G01N21/3581

Abstract: An apparatus for ultrasensitive long-wave imaging cameras is provided. In one embodiment, the apparatus includes a filter configured to allow high frequencies of interest to pass through the filter. The apparatus also includes an antenna that is configured to receive the high frequencies of interest. The apparatus further includes a plurality of bolometers that are configured to measure data regarding the high frequencies of interest.

Abstract translation: 提供了一种用于超灵敏长波成像相机的设备。 在一个实施例中，该装置包括被配置为允许感兴趣的高频通过滤波器的滤波器。 该装置还包括被配置为接收感兴趣的高频的天线。 该装置还包括多个测辐射热计，其配置成测量关于感兴趣的高频的数据。

公开(公告)号：WO2018217220A1

公开(公告)日：2018-11-29

申请号：PCT/US2017/043478

申请日：2017-07-24

Applicant: APPLIED MATERIALS, INC.

Inventor： HOWELLS, Samuel C.

IPC: H01L21/67 ,  H01L21/66

CPC classification number: G01J5/0828 ,  G01J3/18 ,  G01J5/0007 ,  G01J5/041 ,  H01L21/67115 ,  H01L21/67248

Abstract: Apparatus and methods of processing substrates include a detector manifold to detect radiation from proximate a processing area in a chamber body; a radiation detector optically coupled to the detector manifold; and a spectral multi-notch filter. Apparatus and methods of processing substrates include detecting transmitted radiation from an emitting surface of a substrate in a chamber body; conveying at least one spectral band of the detected radiation to a photodetector; and analyzing the detected radiation in the at least one spectral band to determine an inferred temperature of the substrate.

公开(公告)号：KR1020090096196A

公开(公告)日：2009-09-10

申请号：KR1020080021613

申请日：2008-03-07

Applicant: 주식회사 모다이노칩

Inventor： 장상권 ,  김대겸 ,  배인수 ,  이준성

IPC: G01K11/00 ,  G01K11/30 ,  G01K1/00

CPC classification number: G01J5/0828 ,  G01K7/13 ,  G01K7/22

Abstract: A contactless infrared temperature sensor module and a manufacturing method thereof are provided to narrow the acceptance angle of an infrared ray without increasing the size of a module by forming a wide angle controlling layer of a thin film shape. A contactless infrared temperature sensor module comprises a package part(100), an infrared temperature sensor(200), an infrared filter part(300), and a wide angle controlling layer(400). The upper part of the package part is opened. The package part comprises a receiving space. The infrared temperature sensor is mounted inside the receiving space of the package part. The infrared filter part covers the upper part of the package part and seals the receiving space. The wide angle controlling layer is formed in the one-side surface of the infrared filter part. The wide angle controlling layer comprises an expose area exposing the infrared filter part of the upper part of the infrared temperature sensor.

Abstract translation: 提供一种非接触式红外线温度传感器模块及其制造方法，通过形成薄膜形状的广角控制层，不增加模块的尺寸，来缩小红外线的接收角度。 无接触红外线温度传感器模块包括封装部分（100），红外温度传感器（200），红外滤光器部分（300）和广角控制层（400）。 打包零件的上部。 包装部分包括接收空间。 红外线温度传感器安装在封装部分的接收空间内。 红外线过滤器部分覆盖封装部分的上部并密封接收空间。 广角控制层形成在红外线过滤器部分的单面表面。 广角控制层包括露出红外线温度传感器上部的红外滤光片部分的曝光区域。