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    Modular lighting elements with leds (light-emitting diodes)
    11.
    发明公开
    Modular lighting elements with leds (light-emitting diodes) 审中-公开
    Modulare Lichtelemente mit LED（lichtemittierenden Dioden）

    公开(公告)号：EP1162400A2

    公开(公告)日：2001-12-12

    申请号：EP01109899.3

    申请日：2001-04-24

    Applicant: Omnilux s.r.l.

    Inventor： Callegari, Stefano

    IPC: F21S2/00 ,  H01L25/075

    CPC classification number: F21K9/00 ,  F21S2/005 ,  F21S4/28 ,  F21V23/005 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/142 ,  H05K2201/09027 ,  H05K2201/09963 ,  H05K2201/10106

    Abstract: The invention concerns new modular lighting elements (M) comprising a printed circuit (B), at least one male connector (Cm) and at least one female connector (Cf), series of LEDs (light-emitting diodes) (L) connected in series in groups and integrated circuits (I) for the adjustment of the current supplied to the LEDs; the connectors (Cf,Cm) are electrically and directly connected to each other and said connection lines (La,Lb) for the connectors supplies power to one or more microchips that in turn supplies/supply power to a series of LEDs.
    The printed circuit (B) may have any shape, for example it may be linear, rectangular, angular, T-shaped, arc-shaped, square, circular or polyhedral, regular or irregular. It is possible to carry out a modular lighting system comprising one or more lighting elements (M).

    Abstract translation: 本发明涉及包括印刷电路（B），至少一个阳连接器（Cm）和至少一个母连接器（Cf）的新的模块化照明元件（M），一系列LED（发光二极管）（L） 串联和集成电路（I），用于调节提供给LED的电流; 连接器（Cf，Cm）彼此电连接并且直接连接，并且用于连接器的所述连接线（La，Lb）向一个或多个微芯片供电，所述微芯片又向一系列LED供电。 印刷电路（B）可以具有任何形状，例如可以是直线形，矩形，角形，T形，弧形，正方形，圆形或多面体，规则或不规则形状。 可以执行包括一个或多个照明元件（M）的模块化照明系统。

    Ablative process for printed circuit board technology
    12.
    发明公开
    Ablative process for printed circuit board technology 失效
    印刷电路板技术的演进过程

    公开(公告)号：EP0575848A3

    公开(公告)日：1994-09-07

    申请号：EP93109454.4

    申请日：1993-06-14

    Applicant: Martin Marietta Corporation

    Inventor： Akins, Rickey D. ,  Walvoord, John

    IPC: H05K3/02 ,  G03F7/22 ,  G03F7/24 ,  G03F7/20 ,  H01Q15/14 ,  B23K26/06 ,  B23K26/08

    CPC classification number: G03F7/24 ,  B23K26/032 ,  B23K26/066 ,  H01Q1/425 ,  H01Q15/0013 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/061 ,  H05K2201/09018 ,  H05K2201/09963 ,  H05K2203/056 ,  H05K2203/107 ,  Y10S430/146

    Abstract: 5 In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

    Abstract translation: 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 衬底包括底层和金属化层。 图案的至少第一元件通过将元件烧蚀成抗蚀剂涂层或者用相干光源将元件烧蚀到金属化层中而形成。 相干光源优选地包括准分子激光器。 然后将基板相对于相干光源移位，直到预定图案的所有元件形成在基板的整个表面上。 当图案被烧蚀到抗蚀剂材料中时，使用蚀刻技术从基底去除金属化层的部分。

    Electrical connector for connecting electrical units, electrical device, and production metod for producing electrical device
    15.
    发明公开
    Electrical connector for connecting electrical units, electrical device, and production metod for producing electrical device 有权
    用于连接电气单元，电气装置以及方法用于制备一种电连接器

    公开(公告)号：EP1503452A1

    公开(公告)日：2005-02-02

    申请号：EP04017892.3

    申请日：2004-07-28

    Applicant: JAPAN ELECTRONICS INDUSTRY, LTD. ,  OSAKA PREFECTURE

    Inventor： Miyazaki, Nagao, c/o Japan Electronics ind. Ltd. ,  Suzuki, Yoshihiko

    IPC: H01R4/04 ,  G01L5/00

    CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

    Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

    Abstract translation: 在用于电连接的电气单元，带失真计电气连接接合面其反对海誓山盟，布线图案的结构形成在每个电三维单元的功能元件形成面和延伸到功能 - 之间形成的边缘部分 元件形成面和邻近布线表面作为接合面以形成第一焊盘; 第二焊盘按照指定的距离从所述边缘部分延伸的配线表面对应于所述第一焊盘的位置处形成; 和电连接器显示在被按压在一起的接合性能被形成，同时与第一和第二焊盘紧密接触被保持到桥接第一和第二连接盘。 三维电单元的多个能够可靠且容易地电海誓山盟连接以高精度。

    Modular lighting elements with leds (light-emitting diodes)
    16.
    发明公开
    Modular lighting elements with leds (light-emitting diodes) 审中-公开
    具有LED模块化照明元件（发光二极管）

    公开(公告)号：EP1162400A3

    公开(公告)日：2004-04-21

    申请号：EP01109899.3

    申请日：2001-04-24

    Applicant: Omnilux s.r.l.

    Inventor： Callegari, Stefano

    IPC: F21S2/00 ,  H01L25/075

    CPC classification number: F21K9/00 ,  F21S2/005 ,  F21S4/28 ,  F21V23/005 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/142 ,  H05K2201/09027 ,  H05K2201/09963 ,  H05K2201/10106

    Abstract: The invention concerns new modular lighting elements (M) comprising a printed circuit (B), at least one male connector (Cm) and at least one female connector (Cf), series of LEDs (light-emitting diodes) (L) connected in series in groups and integrated circuits (I) for the adjustment of the current supplied to the LEDs; the connectors (Cf,Cm) are electrically and directly connected to each other and said connection lines (La,Lb) for the connectors supplies power to one or more microchips that in turn supplies/supply power to a series of LEDs. The printed circuit (B) may have any shape, for example it may be linear, rectangular, angular, T-shaped, arc-shaped, square, circular or polyhedral, regular or irregular. It is possible to carry out a modular lighting system comprising one or more lighting elements (M).

    Ablative process for printed circuit board technology
    20.
    发明公开
    Ablative process for printed circuit board technology 失效
    Ablatives Verfahrenfürdie Leiterplattentechnologie。

    公开(公告)号：EP0575848A2

    公开(公告)日：1993-12-29

    申请号：EP93109454.4

    申请日：1993-06-14

    Applicant: Martin Marietta Corporation

    Inventor： Akins, Rickey D. ,  Walvoord, John

    IPC: H05K3/02 ,  G03F7/22 ,  G03F7/24 ,  G03F7/20 ,  H01Q15/14 ,  B23K26/06 ,  B23K26/08

    CPC classification number: G03F7/24 ,  B23K26/032 ,  B23K26/066 ,  H01Q1/425 ,  H01Q15/0013 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/061 ,  H05K2201/09018 ,  H05K2201/09963 ,  H05K2203/056 ,  H05K2203/107 ,  Y10S430/146

    Abstract: 5 In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

    Abstract translation: 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 衬底包括底层和金属化层。 图案的至少第一元件通过将元件烧蚀成抗蚀剂涂层或者用相干光源将元件烧蚀到金属化层中而形成。 相干光源优选地包括准分子激光器。 然后将基板相对于相干光源移位，直到预定图案的所有元件形成在基板的整个表面上。 当图案被烧蚀到抗蚀剂材料中时，使用蚀刻技术从基底去除金属化层的部分。

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