公开(公告)号：US12043721B2

公开(公告)日：2024-07-23

申请号：US17192491

申请日：2021-03-04

Applicant: Ascend Performance Materials Operations LLC

Inventor： Vikram Gopal ,  Wai-shing Yung ,  Albert Ortega

IPC: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/11 ,  B29C48/00 ,  B29K77/00 ,  B29K105/00 ,  C08K3/02 ,  C08L77/06 ,  D01F6/60 ,  D02G3/04 ,  D02G3/44

CPC classification number: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/1192 ,  B29C48/022 ,  C08L77/06 ,  D01F6/60 ,  D02G3/047 ,  D02G3/448 ,  D02G3/449 ,  B29K2077/00 ,  B29K2105/0011 ,  B29K2995/0077 ,  B29K2995/0092 ,  C08K2003/026 ,  C08K2003/0893 ,  C08K2201/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/12 ,  D10B2331/021 ,  D10B2401/02 ,  D10B2401/13

Abstract: A polymer composition having antimicrobial properties, the composition comprising from 50 wt % to 99.99 wt % of a polymer, from 10 wppm to 900 wppm of zinc, less than 1000 wppm of phosphorus, and less than 10 wppm coupling agent and/or surfactant, wherein zinc is dispersed within the polymer; and wherein fibers formed from the polymer composition demonstrate a Klebsiella pneumonia log reduction greater than 0.90, as determined via ISO20743:2013 and/or an Escherichia coli log reduction greater than 1.5, as determined via ASTM E3160 (2018).

公开(公告)号：US12031028B2

公开(公告)日：2024-07-09

申请号：US17256055

申请日：2019-12-26

Applicant: LG CHEM, LTD.

Inventor： Il Hwan Choi ,  Young Ji Tae ,  Soonyong Park ,  Youngseok Park ,  Bi Oh Ryu

IPC: C08L77/10 ,  B32B27/08 ,  B32B27/34 ,  C08G69/26 ,  C08G69/42 ,  C08K5/3475 ,  C08K5/3492

CPC classification number: C08L77/10 ,  B32B27/08 ,  C08G69/265 ,  C08G69/42 ,  C08K5/3475 ,  C08K5/3492 ,  B32B27/34 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2307/412 ,  B32B2307/71 ,  B32B2457/20 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/20

Abstract: The present invention relates to a polyamide resin film having improved UV shielding function by using a polyamide resin having a backbone chain of alternative structure of two types of polyamide segments; and a resin laminate using the polyamide resin film.

公开(公告)号：US12031024B2

公开(公告)日：2024-07-09

申请号：US17764633

申请日：2020-12-18

Applicant: LG CHEM, LTD.

Inventor： Chun Ho Park ,  Tae Hoon Kim ,  Daeun Sung ,  Yong Hee An ,  Wangrae Joe ,  Ho Hoon Kim ,  Jeongmin Jang

IPC: C08L51/04 ,  B29B9/06 ,  B29C48/09 ,  B29C48/151 ,  B32B1/08 ,  B32B15/18 ,  B32B27/08 ,  F16L9/147 ,  B29K96/02 ,  B29K705/00 ,  B29L23/00

CPC classification number: C08L51/04 ,  B29B9/06 ,  B29C48/09 ,  B29C48/151 ,  B32B1/08 ,  B32B15/18 ,  B32B27/08 ,  F16L9/147 ,  B29K2096/02 ,  B29K2705/00 ,  B29L2023/22 ,  C08L2201/08 ,  C08L2203/18 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2207/04 ,  Y10T428/1352 ,  Y10T428/1355 ,  Y10T428/1386 ,  Y10T428/1393

Abstract: A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.

公开(公告)号：US20240209148A1

公开(公告)日：2024-06-27

申请号：US18551810

申请日：2022-03-23

Applicant: NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY

Inventor： Yoshiyuki OISHI ,  Yuji SHIBASAKI ,  Tadashi TSUKAMOTO

IPC: C08G65/40 ,  C08G61/12 ,  C08L71/10

CPC classification number: C08G65/40 ,  C08G61/122 ,  C08L71/10 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/206

Abstract: Provided are a resin composition which has a low dielectric constant, a low dielectric loss tangent, high transparency, high solubility, and high heat resistance and can be used suitably as a low-dielectric material, a film for a multilayer substrate, in which the resin composition is used, a multilayer substrate, and methods for producing the same. A resin composition for a low-dielectric material, which contains a triazine-containing polyether compound having a specific repeating unit, a film for a multilayer substrate, a multilayer substrate, a method for producing a resin composition for a low-dielectric material, a method for producing a film for a multilayer substrate, and a method for producing a multilayer substrate.

公开(公告)号：US12018140B2

公开(公告)日：2024-06-25

申请号：US14909756

申请日：2014-07-09

Applicant: SG GLOBAL CHEMICAL CO., LTD.

Inventor： Sébastien Quinebeche ,  Vincent Palluault ,  Benoît Savignat

IPC: C08L23/06 ,  C08K3/22 ,  C08L23/04 ,  C08L23/08 ,  C08L51/06 ,  C09K21/02 ,  F16L9/12 ,  H01B3/44 ,  H01B7/295

CPC classification number: C08L23/06 ,  C08K3/22 ,  C08L23/04 ,  C08L23/0853 ,  C08L51/06 ,  C09K21/02 ,  F16L9/12 ,  H01B3/441 ,  H01B7/295 ,  C08K2003/2227 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/18 ,  C08L2203/202 ,  C08L2205/03 ,  C08L2207/066 ,  C08L23/0853 ,  C08L23/04 ,  C08L51/06 ,  C08K3/22

Abstract: A halogen-free fire-retardant thermoplastic composition composed of: 50% to 70% by weight of fire-retardant fillers, 0.1% to 45% by weight of a copolymer of ethylene and of an ethylenic monomer bearing a polar function, 10% to 25% by weight of a non-functionalized very low density polyethylene (VLDPE), optionally, up to 10% of additives, and 0.1% to 10% by weight of a linear low density polyethylene (LLDPE), characterized in that the density of the very low density polyethylene (VLDPE) is between 0.85 and 0.91, in that the density of the linear low density polyethylene is greater than 0.91 and in that the linear low density polyethylene (LLDPE) is grafted with maleic anhydride grafts present on the main chain. Also, a cable, tube, pipe or the like, a layer of which is formed with said composition.

公开(公告)号：US11999823B2

公开(公告)日：2024-06-04

申请号：US17059644

申请日：2020-01-28

Applicant: LG CHEM, LTD.

Inventor： Kyunghwan Kim ,  Jiyeon Sung

IPC: C08G73/10 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/1333

CPC classification number: C08G73/1067 ,  C08G73/1007 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/14 ,  C08J5/18 ,  C08L79/08 ,  G02B1/04 ,  G02F1/133305 ,  C08J2379/08 ,  C08L2201/08 ,  C08L2203/16 ,  C08L2203/20 ,  C09K2323/00 ,  C09K2323/027 ,  G02F2202/022

Abstract: The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound and a diamine compound having a specific structure, a substrate for display device, and an optical device using the same.

公开(公告)号：US11993694B2

公开(公告)日：2024-05-28

申请号：US17844144

申请日：2022-06-20

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Chun-Che Tsao ,  Yueh-Shin Liu

IPC: H01B1/24 ,  C01B32/00 ,  C08K3/04 ,  C08L67/00 ,  H01B1/12

CPC classification number: C08K3/041 ,  C08L67/00 ,  H01B1/124 ,  H01B1/24 ,  C08K2201/001 ,  C08K2201/011 ,  C08L2201/08 ,  C08L2310/00

Abstract: A conductive polyester composition is provided, which includes a polyester base material and a conductive reinforcing material. The conductive reinforcing material includes a plurality of carbon nanotubes, and the plurality of carbon nanotubes are dispersed in the polyester base material. In each of the carbon nanotubes, a length of the carbon nanotube is defined as L, a diameter of the carbon nanotube is defined as D and is between 1 nanometer and 30 nanometers, and an L/D value of the carbon nanotube is between 300 and 2,000. The plurality of carbon nanotubes are in contact with each other to form a plurality of contact points, so that the conductive polyester composition has a surface impedance of not greater than 107 Ω/sq.

公开(公告)号：US20240158571A1

公开(公告)日：2024-05-16

申请号：US18282864

申请日：2022-03-07

Applicant: TOYOBO MC Corporation

Inventor： Yuki TAMASHIRO ,  Takuya AKAISHI ,  Yoshitaka AYUZAWA

IPC: C08G63/183 ,  C08G63/672 ,  C08G63/91 ,  C08G64/02 ,  C08K5/13 ,  C08K5/18 ,  C08L69/00 ,  F16L11/04

CPC classification number: C08G63/183 ,  C08G63/672 ,  C08G63/916 ,  C08G64/0208 ,  C08K5/13 ,  C08K5/18 ,  C08L69/005 ,  F16L11/04 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/30 ,  C08L2207/04

Abstract: The present invention aims to provide a thermoplastic polyester elastomer having particularly excellent extrusion moldability and extrusion molding stability, from which a hollow and long molded article can be stably produced with a uniform thickness for a long time. A polyester elastomer comprising a hard segment made of a polyester constituted of an aromatic dicarboxylic acid and an aliphatic or alicyclic diol and a soft segment made of an aliphatic polycarbonate, wherein the hard segment and the soft segment are bonded to each other, wherein the polyester elastomer is at least partially end-capped with a reactive compound, wherein the reactive compound comprises a polycarbodiimide, wherein the polyester elastomer has an acid value of 15 eq/ton or less, and wherein, under a condition of 230° C., the polyester elastomer satisfies (i) the melt viscosity at a shear rate of 10/sec after a preheating time of 5 minutes is 1,800 Pa·s or more, and the melt viscosity at a shear rate of 1,000/sec after a preheating time of 5 minutes is 800 Pa·s or less; and (ii) a ratio of the melt viscosity measured at a shear rate of 10/sec after a preheating time of 5 minutes to the melt viscosity measured at a shear rate of 10/sec after a preheating time of 25 minutes is 0.7 to 1.3.

公开(公告)号：US20240067821A1

公开(公告)日：2024-02-29

申请号：US18267796

申请日：2021-12-16

Applicant: INV Nylon Polymers Americas, LLC

Inventor： John Buzinkai ,  Peng He ,  Isaac K. Iverson ,  Charles Richard Langrick ,  Chee Sern Lim

IPC: C08L77/06 ,  B29C43/00 ,  C08J3/20 ,  C08K7/14

CPC classification number: C08L77/06 ,  B29C43/003 ,  C08J3/203 ,  C08K7/14 ,  B29K2077/00 ,  C08J2377/06 ,  C08J2477/06 ,  C08L2201/08 ,  C08L2203/30 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2310/00

Abstract: Compounded thermoplastic resin, molding composition, compounded polyamide composition, articles formed from the same, and methods of making the resins/compositions and articles. A compounded thermoplastic resin includes a polyamide composition and a random copolymer composition.

公开(公告)号：US20240067809A1

公开(公告)日：2024-02-29

申请号：US18254224

申请日：2021-11-22

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Santosh S. Bawiskar ,  James R. de Garavilla ,  Jessica Ye Huang ,  Rajesh P. Paradkar ,  George Prejean ,  Kalyan Sehanobish ,  Barry A. Morris

IPC: C08L23/08

CPC classification number: C08L23/0876 ,  C08L2201/08 ,  C08L2205/02 ,  C08L2207/062

Abstract: Embodiments of polymer blends may include a first polymer composition and a second polymer composition. The first polymer composition may include a polyolefin having a thermal transition temperature of at least 100° C. and a graftable monomer having at least one acid or anhydride functional group grafted onto the polyolefin. The second polymer composition may include an E/X/Y ethylene interpolymer, wherein E is an ethylene monomer and comprises greater than 50 wt. % of the interpolymer, X is an α,β-unsaturated C3-C8 carboxylic acid and comprises greater than 0 to 25 wt. % of the interpolymer, and Y is an optional comonomer comprising C1-C8 alkyl acrylate.