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公开(公告)号：JP2015023107A
公开(公告)日：2015-02-02
申请号：JP2013149045
申请日：2013-07-18
Inventor： YAMAJI SHUZO , YAMAMOTO MASAYUKI , NAKAGAWARA SHUJI
IPC: H01L21/301 , B24B27/06 , B24B55/02
Abstract: 【課題】電子部品製造用の切削装置において、被加工物に対して切削水が噴射される位置が被加工点から離れることに起因する不具合の発生を抑制する。【解決手段】領域3を単位として封止済基板1を個片化することによって複数の電子部品を製造する際に使用される電子部品製造用の切削装置に、封止済基板1が固定されるテーブル7と、回転軸9に固定された回転刃8と、回転刃8と封止済基板1とに向かって切削水を噴射する切削水用ノズル12と、切削水用ノズル12が固定されたノズル取付板21と、Z方向の基準点になるテーブル7の上面と切削水用ノズル12の開口14との間におけるZ方向の距離からなる第1の高さを、基準点と回転軸9の中心との間におけるZ方向の距離からなる回転軸高さとは独立して設定する設定手段と、第1の高さが変わらないようにしてノズル取付板21を固定する固定手段とを備える。【選択図】図3
Abstract translation: 要解决的问题：为了防止从用于制造电子部件的切割装置中的加工点分离从工件排出切割水的位置而引起的问题。解决方案：用于制造用于制造电子部件的电子部件的切割装置 多个电子部件通过将封装的基板1分割而同时限定作为一个单元的区域3包括：固定有封装基板1的工作台7; 固定在旋转轴9上的旋转刀片8; 将切割水朝向旋转刀片8和封装基板1喷射的切割水喷嘴12; 固定切割水喷嘴12的喷嘴安装板21; 设定装置，用于设定从在Z方向成为基准点的工作台7的顶面之间的Z方向上的距离形成的第一高度与形成的旋转轴高度的切割水喷嘴12的开口14 从基准点和旋转轴9的中心之间的Z方向的距离; 以及用于固定喷嘴安装板21同时防止第一高度改变的固定装置。
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公开(公告)号：JP5627619B2
公开(公告)日：2014-11-19
申请号：JP2012041624
申请日：2012-02-28
Applicant: Towa株式会社
CPC classification number: H01L21/566 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2924/00
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公开(公告)号：JP2014133253A
公开(公告)日：2014-07-24
申请号：JP2013003308
申请日：2013-01-11
Inventor： OKAMOTO JUN
IPC: B23K26/38 , B23K26/00 , B23K26/10 , B23K26/364 , H01L23/12
Abstract: PROBLEM TO BE SOLVED: To cut and separate a laminated substrate W with every electronic part module W3 in this warping-corrected state, by measuring warping of the laminated substrate W of sealing an electronic part on the substrate by resin.SOLUTION: A cutting work method and a device of a laminated substrate comprises: a substrate supply step of supplying a laminated substrate W; a warping measuring step of measuring the warping of the laminated substrate W; a groove forming step of forming a slit-like groove S by irradiating a laser beam L1 to a cutting expected line in a sealing resin layer W2 of the laminated substrate W when a warping measured value of the laminated substrate W is a reference value or more; a warping correction step of locking and holding the laminated substrate W in its warping-corrected state; a substrate cutting step of cutting and separating (S1) the laminated substrate with every electronic part module W3 by irradiating a laser beam L3 along the cutting expected line in the sealing resin layer W2 of the laminated substrate W or executing cutting work by a cutting blade; and a mold storage step of storing the respective electronic part modules W3.
Abstract translation: 要解决的问题：通过测量通过树脂将基板上的电子部件密封的层叠基板W的翘曲测量，在该翘曲校正状态下，利用每个电子部件模块W3切割和分离层压基板W.解决方案：切割工作 方法和层叠基板的装置包括：提供叠层基板W的基板供给步骤; 测量层叠基板W的翘曲的翘曲测量步骤; 沟槽形成步骤，当叠层基板W的翘曲测量值为基准值或更大时，通过将激光束L1照射到层压基板W的密封树脂层W2中的切割预期线来形成狭缝状槽S ; 将叠层基板W锁定并保持在其翘曲校正状态的翘曲校正步骤; 基板切割步骤，通过沿层叠基板W的密封树脂层W2中的切割预期线照射激光束L3，或者通过切割刀片进行切割加工，用每个电子部件模块W3切割（S1）层压基板 ; 以及存储各个电子部件模块W3的模具存储步骤。
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205.发明专利
公开(公告)号：JP5542522B2
公开(公告)日：2014-07-09
申请号：JP2010114057
申请日：2010-05-18
Applicant: Towa株式会社 , 国立大学法人 岡山大学
IPC: B23K26/142
Abstract: PROBLEM TO BE SOLVED: To provide a jet nozzle for assist gas used for laser beam machining and a laser beam machining device in which a shape of an object to be laser beam machined is approximated to a desired shape.SOLUTION: The jet nozzle for jetting assist gas to be blown on a surface to be machined in laser beam machining includes: a nozzle surface confronted to the surface to be machined; a jetting opening formed on the nozzle surface so as to make the assist gas and the laser beam pass to the outer space from the inner space; and a concaved slot formed on the nozzle surface to pass through the jetting opening. Laser beam machining is performed while cooling a cooling part which is at least one of an irradiation part of the surface to be machined to which the laser beam is irradiated, a part after irradiation, or a part before irradiation. A dehumidified gas jetting hole is provided for jetting the dehumidified gas to the surface to be machined in such a manner of being directed to the irradiation part or surrounding the irradiation part.
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Patent Agency Ranking
公开(公告)号：JP2014108491A
公开(公告)日：2014-06-12
申请号：JP2012264409
申请日：2012-12-03
Inventor： NAKAGAWARA SHUJI , AMAKAWA TAKESHI
IPC: B24B27/06 , B24B55/02 , H01L21/301 , H01L21/56
CPC classification number: H01L2224/45144 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To prevent the occurrence of chipping and the occurrence of burrs when a resin sealing body is collectively cut by using a rotary blade.SOLUTION: In a state where a rotary blade 9 is rotated in one direction in which an outer circumference part of the rotary blade 9 can keep cutting from a surface (upper surface) of a substrate 2 being an uppermost layer toward the inside, a stage 8 is moved in the +X direction and the rotary blade 9 cuts the substrate 2. Subsequently, in the state where the outer circumference part of the rotary blade 9 can keep cutting from a surface (lower surface) of a sealing resin 4 being a lowermost layer toward the inside, the stage 8 is moved in the -X direction and the rotary blade 9 cuts the sealing resin 4. By these arrangements, the resin sealing body 1 having a double-layered structure comprising the substrate 2 and the sealing resin 4 is cut.
Abstract translation: 要解决的问题：为了防止当通过旋转刀片共同切割树脂密封体时发生切屑和毛刺的发生。解决方案：在旋转刀片9沿一个方向旋转的状态下，其中外周 旋转刀片9的一部分可以保持从最上层的基板2的表面（上表面）向内侧切割，台架8沿+ X方向移动，旋转刀片9切割基板2.随后， 在旋转刀片9的外周部能够从最下层的密封树脂4的表面（下表面）向内侧保持切断的状态下，台架8向-X方向移动，旋转刀片 切割密封树脂4.通过这些布置，切割包括基板2和密封树脂4的具有双层结构的树脂密封体1。
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公开(公告)号：JP2014036053A
公开(公告)日：2014-02-24
申请号：JP2012175209
申请日：2012-08-07
Inventor： YAMAMOTO MASAYUKI , AMAKAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a storage device in which a plurality of individual pieces obtained by cutting a plate-like object to be cut can be surely stored in storage sections of a tray regardless of variation in sizes of the trays, and a storage method.SOLUTION: A storage device comprises: imaging means 12 for capturing images of a placement table 11 and a tray 10 placed thereon; tray size determination means for determining a distance between predetermined two reference points of the placement table 11 on the basis of the distance between the two reference points from the images; and individual piece storage means for storing a plurality of individual pieces 50, respectively, in a plurality of storage sections 20 of the tray 10 on the basis of the determined distance between the predetermined two reference points of the tray 10. In the storage device 1, the actual size of the tray 10 is determined and based on the actual size of the tray 1, the individual pieces 50 are stored in the storage sections 20, so that all the individual pieces 50 can be stored surely in the storage sections 20.
Abstract translation: 要解决的问题：提供一种存储装置，其中通过切割待切割的板状物体而获得的多个单独的片段可以可靠地存储在托盘的存储部分中，而与盘的尺寸的变化无关，并且存储 方法。解决方案：存储装置包括：用于捕获放置台11和放置在其上的托盘10的图像的成像装置12; 基于来自图像的两个参考点之间的距离来确定放置台11的预定两个参考点之间的距离的托盘尺寸确定装置; 以及个体片存储装置，用于基于确定的托盘10的预定两个参考点之间的距离，将多个单独的片50分别存储在托盘10的多个存储部分20中。在存储装置1 ，确定托盘10的实际尺寸，并且基于托盘1的实际尺寸，将各个片50存储在存储部20中，使得可以将所有单个片50可靠地存储在存储部20中。
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209.发明专利
公开(公告)号：JP2014033121A
公开(公告)日：2014-02-20
申请号：JP2012173612
申请日：2012-08-06
Inventor： OKADA HIROKAZU , MIYAGAWA SHIGERU , GAMO KIYOSHIGE , MATSUO MAKOTO , TAKAHASHI KAZUHIRO , ONISHI HISAYOSHI
IPC: H01L33/52
CPC classification number: H01L24/97 , H01L2924/181 , H01L2924/1815 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of an opto-electronic component capable of suppressing leakage of light in an undesired direction to the minimum, in which an optical element is resin-sealed.SOLUTION: A substrate comprising a plurality of unit regions to each of which at least one optical element is mounted is resin-sealed using an upper mold and a lower mold in the manufacturing method of the opto-electronic component. The manufacturing method includes a substrate holding step for holding the substrate so that the optical element faces the lower die side, a fluid resin supply step for supplying a fluid resin to a cavity provided in the lower die while having a unit cavity forming a recessed part each corresponding to the unit region, a mold clamping step for clamping the upper mold and the lower mold by puting them together, and a resin curing step for curing the fluid resin. In the mold clamping step, a communication space for communicating between adjoining unit cavities is formed between the upper mold and the lower mold, and the communication space has the minimum height allowing the fluid resin to reliably flow.
Abstract translation: 要解决的问题：提供一种光学元件的制造方法，其能够将不希望的方向的光的泄漏抑制到光学元件被树脂密封的最小值。解决方案：一种基板，包括多个单元区域 在光电部件的制造方法中，使用上模和下模将树脂密封至其中的至少一个光学元件。 该制造方法包括用于保持基板以使得光学元件面向下模具侧的基板保持步骤，用于将流体树脂供应到设置在下模中的空腔的流体树脂供给步骤，同时具有形成凹部的单元空腔 各自对应于单位区域，通过将上模和下模夹在一起而夹紧的合模步骤和用于固化流体树脂的树脂固化步骤。 在合模步骤中，在上模和下模之间形成用于连通相邻单元腔的连通空间，并且连通空间具有使流体树脂可靠地流动的最小高度。
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210.发明专利Molding tool, component for resin mold face, production method of resin product, and resin product 审中-公开模塑工具，树脂模具面料的组分，树脂产品的生产方法和树脂产品
公开(公告)号：JP2014019065A
公开(公告)日：2014-02-03
申请号：JP2012160053
申请日：2012-07-18
Inventor： AMAKAWA TAKESHI , MATSUO MAKOTO , ONISHI HISAYOSHI
IPC: B29C33/42
Abstract: PROBLEM TO BE SOLVED: To provide a molding tool in which releasability is favorable, and to which stain or the like hardly adheres.SOLUTION: A molding tool is the molding tool for resin product molding, and at least one of a concavity and a salient is formed on at least one part of a resin mold face of the molding tool, in a concavity formation surface and a salient formation surface, an angle with the resin mold face of the molding tool exceeds 90°. In the figure 1, a mark 11 represents a salient (quadrangular pyramid), and a mark 12 represents a salient apex.
Abstract translation: 要解决的问题：提供一种其中脱模性良好并且污渍等几乎不粘附的成型工具。解决方案：一种模制工具是用于树脂产品成型的模制工具，并且至少一个凹形和凸面 形成在成形工具的树脂模制面的至少一部分上，在凹面形成面和突出形成面上，与成形工具的树脂模制面的角度超过90°。 在图1中，标记11表示突出（四角锥），标记12表示突出的顶点。
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