公开(公告)号：US20110130721A1

公开(公告)日：2011-06-02

申请号：US12929257

申请日：2011-01-11

Applicant: John S. Foster ,  Christopher S. Gudeman

Inventor： John S. Foster ,  Christopher S. Gudeman

IPC: A61M5/142 ,  H02J1/00 ,  H01H11/00 ,  A61N1/362

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81B2207/015 ,  B81B2207/053 ,  B81C1/0023 ,  B81C2203/075 ,  H02J7/0024 ,  Y10T29/49105 ,  Y10T307/696

Abstract: Systems and methods for forming a configurable power supply uses a plurality of dual substrate MEMS switches to couple a plurality of power cells to provide a selectable, or variable, output voltage. The same circuit may output two different voltages to power two different circuits of the device, or may distribute the load evenly amongst the cells. Thus, the configurable power supply may extend the lifetime and improve the reliability of the device, or decrease its weight, size and cost.

Abstract translation: 用于形成可配置电源的系统和方法使用多个双衬底MEMS开关来耦合多个功率单元以提供可选择的或可变的输出电压。 相同的电路可以输出两个不同的电压来为装置的两个不同电路供电，或者可以在电池之间均匀地分配负载。 因此，可配置电源可延长使用寿命并提高设备的可靠性，或降低其重量，尺寸和成本。

公开(公告)号：US07944113B2

公开(公告)日：2011-05-17

申请号：US12318634

申请日：2009-01-05

Applicant: Paul J. Rubel

Inventor： Paul J. Rubel

IPC: H01L41/08

CPC classification number: F03G7/06 ,  B81B3/0059 ,  B81B2201/018 ,  B81B2201/032 ,  B81B2201/054 ,  H01H61/02 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H2061/008 ,  H02N10/00 ,  Y10T29/49105

Abstract: A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of beams may be formed in a first plane parallel to the substrate, whereas another of the plurality of beams may be formed in a second plane closer to the surface of the substrate. When the heating element is activated, it heats the plurality of beams such that they move the passive beam in a trajectory that is neither parallel to nor perpendicular to the surface of the substrate. When the beams are cooled, they may move in a different trajectory, approaching the substrate before moving laterally across it to their initial positions. By providing one electrical contact on the distal end of the passive beam and another stationary electrical contact on the substrate surface, the MEMS hysteretic actuator may form a reliable electrical switch that is relatively simple to manufacture and operate.

Abstract translation: MEMS迟滞热致动器可以具有设置在形成在基板的表面上的加热元件上的多个光束。 多个光束可以耦合到未设置在加热元件上方的无源光束。 多个光束中的一个可以形成在平行于衬底的第一平面中，而多个光束中的另一个可以形成在靠近衬底表面的第二平面中。 当加热元件被激活时，它加热多个光束，使得它们以不平行于或垂直于衬底表面的轨迹移动被动束。 当梁被冷却时，它们可以以不同的轨迹移动，在横向移动到其初始位置之前接近基板。 通过在被动束的远端上提供一个电接触，并在衬底表面上提供另一个固定的电触点，MEMS滞后致动器可形成可靠的电开关，其制造和操作相对简单。

公开(公告)号：US07602097B2

公开(公告)日：2009-10-13

申请号：US12237681

申请日：2008-09-25

Applicant: Shunji Nakamura

Inventor： Shunji Nakamura

IPC: H02N2/00

CPC classification number: B81B3/0059 ,  B81B2201/018 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058

Abstract: A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

Abstract translation: 可移动装置同时能够将尺寸减小到亚微米级，更高的速度操作，简化的生产过程，低成本和更高的可靠性。 一种可移动装置，其具有底部电极和固定在基板上的基本导电层，碳纳米管的弹性轴，其底端固定在基本导电层上并竖立起来，顶部结构包括顶部电极， 底部电极并固定到弹性轴的顶端，其中当在底部电极和顶部电极之间施加电压时，顶部电极在弹性轴的弹性变形的允许范围内相对于底部电极移位。

公开(公告)号：US07507665B2

公开(公告)日：2009-03-24

申请号：US11200191

申请日：2005-08-10

Applicant: Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

Inventor： Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

IPC: H01L21/4763 ,  H01L21/44

CPC classification number: C25D5/34 ,  B81B2201/018 ,  B81B2207/07 ,  B81C1/00698 ,  C25D5/022 ,  C25D5/10 ,  H05K3/205 ,  H05K2203/0315 ,  H05K2203/1157

Abstract: A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.

Abstract translation: 提供一种制造电气部件的方法，该方法包括以下步骤：在基板表面的一部分上形成光致抗蚀剂; 在形成光致抗蚀剂之后，在基板的表面上形成金属层; 去除所述金属层的一部分; 通过除去金属层的一部分，去除形成在金属层的表面上的金属氧化物膜; 并去除光致抗蚀剂。 通过这种方法，可以减少电气部件表面上的接触电阻。

公开(公告)号：US20080278268A1

公开(公告)日：2008-11-13

申请号：US11797924

申请日：2007-05-09

Applicant: John S. Foster ,  Kimberly L. Turner

Inventor： John S. Foster ,  Kimberly L. Turner

IPC: H01H59/00 ,  H01H49/00

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00333 ,  Y10T29/49105 ,  Y10T29/5317

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract translation: 用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。 可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。 气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

公开(公告)号：US20070116406A1

公开(公告)日：2007-05-24

申请号：US11603063

申请日：2006-11-22

Applicant: Yu Yonezawa ,  Naoyuki Mishima ,  Tadashi Nakatani ,  Anh Nguyen ,  Satoshi Ueda

Inventor： Yu Yonezawa ,  Naoyuki Mishima ,  Tadashi Nakatani ,  Anh Nguyen ,  Satoshi Ueda

IPC: G02B6/26

CPC classification number: B81B3/0086 ,  B81B2201/018 ,  G02B6/3566 ,  G02B6/357 ,  G02B6/3584 ,  H01H59/0009 ,  H01H2059/0054

Abstract: A switch includes multiple torsion springs with each of one ends thereof secured to a substrate, a beam portion, to which each of the other ends of the multiple torsion springs is secured, and which is swung by an electrostatic actuator, and a switch contact portion in which a first contact provided at the beam portion and a second contact secured to the substrate are in connection or disconnection.

Abstract translation: 开关包括多个扭转弹簧，其一端中的每一个固定到基底，梁部分，多个扭转弹簧的另一端的每个固定到所述梁部分，并且由静电致动器摆动，并且开关接触部分 其中设置在所述梁部分处的第一触点和固定到所述基板的第二触头是连接或断开的。

公开(公告)号：US20050269688A1

公开(公告)日：2005-12-08

申请号：US11144429

申请日：2005-06-02

Applicant: Lior Shiv

Inventor： Lior Shiv

IPC: B81B7/00 ,  H01H1/00 ,  H01L23/12

CPC classification number: B81B7/0041 ,  B81B7/007 ,  B81B2201/018 ,  H01H1/0036

Abstract: A package for a MEMS device includes a semiconductor cap structure and a lid substrate that define an encapsulated area within which the MEMS device is located. Feed-through metallization hermetically seals micro-vias in the semiconductor cap structure and extends through the semiconductor cap structure to provide interconnections coupled electrically to the MEMS device and to an exterior of the semiconductor cap structure.

Abstract translation: 用于MEMS器件的封装包括限定MEMS器件所在的封装区域的半导体盖结构和盖基板。 直通金属化气密地密封半导体盖结构中的微通孔并且延伸穿过半导体帽结构以提供电耦合到MEMS器件和半导体帽结构的外部的互连。

公开(公告)号：US06939784B2

公开(公告)日：2005-09-06

申请号：US10820761

申请日：2004-04-09

Applicant: Li-Shu Chen ,  Philip C. Smith ,  Thomas J. Moloney ,  Howard Fudem

Inventor： Li-Shu Chen ,  Philip C. Smith ,  Thomas J. Moloney ,  Howard Fudem

IPC: B81B7/00 ,  H01L21/50 ,  H01L23/10 ,  H01L21/30 ,  H01L21/48

CPC classification number: H01L23/10 ,  B81B2201/018 ,  B81B2207/097 ,  B81C1/00301 ,  B81C2203/0118 ,  H01L21/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like number of locations each including one or more cavities to accommodate the electronic circuit and associated signal lines. The cover wafer includes a plurality of vias for making electrical connection to the signal lines. A multi layer metallic arrangement hermetically seals the periphery of each location as well as sealing the bottom of each via. The joined base and cover wafers may then be diced to form individual die packages.

Abstract translation: 多个电子电路和相关联的信号线位于基底晶片上的相应位置。 安装在基底晶片上方的覆盖晶片包括相应的相似数量的位置，每个位置包括一个或多个空腔以容纳电子电路和相关联的信号线。 覆盖晶片包括用于与信号线进行电连接的多个通孔。 多层金属装置密封每个位置的周边以及密封每个通孔的底部。 然后可以将接合的基底和覆盖晶片切割成单独的管芯封装。

公开(公告)号：US20050168306A1

公开(公告)日：2005-08-04

申请号：US11088411

申请日：2005-03-23

Applicant: Michael Cohn ,  Ji-Hai Xu

Inventor： Michael Cohn ,  Ji-Hai Xu

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H01H59/00 ,  H01H51/22 ,  H01H1/66 ,  H01H51/00 ,  H01L21/30 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01H59/0009 ,  B81B7/0077 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/093 ,  B81C1/00301 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.

公开(公告)号：US20050032379A1

公开(公告)日：2005-02-10

申请号：US10941350

申请日：2004-09-14

Applicant: Marvin Wong ,  Paul Carson

Inventor： Marvin Wong ,  Paul Carson

IPC: H01H29/30 ,  B81C1/00 ,  H01H1/00 ,  H01H29/06 ,  B05D3/12 ,  H01L21/302 ,  H01L21/461

CPC classification number: B81C1/00611 ,  B81B2201/018 ,  B81C2201/0121 ,  H01H1/0036 ,  H01H2029/008

Abstract: A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist, the material registering with at least one channel edge as a result of the material's abutment to the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Abstract translation: 一种用于在通道板上沉积材料使得该材料与通道板中形成的一个或多个通道对准的方法包括用未被该材料润湿的抗蚀剂填充至少一个通道; 在包括至少部分抗蚀剂的通道板的至少一个区域上沉积材料，由于材料与抗蚀剂的邻接，材料与至少一个通道边缘配准; 然后除去抗蚀剂。 在一个实施例中，可以使用该方法来施加用于组装开关的粘合剂或垫圈材料。