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公开(公告)号：JP2014000747A
公开(公告)日：2014-01-09
申请号：JP2012138338
申请日：2012-06-20
Inventor： TAKASE SHINJI , KAWAMOTO YOSHIHISA
Abstract: PROBLEM TO BE SOLVED: To provide a resin supply method and a resin supply device capable of supplying a predetermined amount of resin material R evenly over the whole area of a bottom mold cavity 31 in a compression molding device 30, which seals a number of electronic components with a sealing resin all together.SOLUTION: The resin supply method and the resin supply device in which a resin storage case 22 of a resin supply device 20 has a number of resin amount dividing sections 22a which divide the area of a bottom mold cavity 31 virtually evenly, a resin injection hole 22b of each resin dividing section 22a is closed with a shutter opening and closing mechanism (main body plate 21), a resin material R is stored in the resin storage case 22 and then divided evenly into each resin dividing section 22a, the resin supply device 20 is transferred to the bottom mold cavity 31 and set at a predetermined position, the resin material R in each resin dividing section 22a is injected into the bottom mold cavity 31 by opening each resin injection hole 22b with the shutter opening and closing mechanism 21, and then the resin material R is supplied evenly over the whole area of the bottom mold cavity 31.
Abstract translation: 要解决的问题：提供一种树脂供给方法和树脂供给装置，其能够在压缩成型装置30中在底模腔31的整个区域均匀地供给预定量的树脂材料R，所述压缩成型装置30密封多个电子 具有密封树脂的部件全部在一起。解决方案：树脂供应方法和树脂供应装置，其中树脂供应装置20的树脂储存盒22具有多个树脂量分隔部分22a，树脂量分隔部分22a将底模腔的面积 在实际上均匀地，每个树脂分隔部分22a的树脂注入孔22b用活门开闭机构（主体板21）封闭，树脂材料R被储存在树脂储存盒22中，然后均匀地分成各树脂 分割部22a将树脂供给装置20转移到底模腔31并设定在规定位置，将树脂分割部22a的树脂材料R注入到 通过用活门打开和关闭机构21打开每个树脂注入孔22b，然后将树脂材料R均匀地供应到底模腔31的整个区域上，从而形成底模腔31。
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212.发明专利Mold for compression molding, compression molding apparatus, and compression molding method 有权用于压缩成型的模具，压缩成型装置和压缩成型方法
公开(公告)号：JP2013226693A
公开(公告)日：2013-11-07
申请号：JP2012099908
申请日：2012-04-25
Inventor： KAWAMOTO YOSHIHISA
Abstract: PROBLEM TO BE SOLVED: To enable a film to be adhesion-coated on a surface of a mold for compression molding without being wrinkled, in compression molding using the film.SOLUTION: A mold for compression molding includes a lower mold 1A and a upper mold 1B constituting a cavity C, a first suction groove 5 for sucking and holding a mold release film 4 and a second suction groove 6 sucking the mold release film 4 inside the first suction groove 5 radially are provided in a upper surface being a cavity outside, of the lower mold 1A. A groove side surface s2 on the cavity side in the second suction groove 6 is formed into an inclined surface more gentle than that of a groove side surface s1 on the outside radially to make a cross section shape of the second sucking groove 6 be inside/outside asymmetrical and widened upward.
Abstract translation: 要解决的问题：为了使膜能够在压缩成型用模具的表面上附着涂布而不发生褶皱，在使用该膜的压缩成型中使用。溶液：压缩成型用模具包括下模具1A和上模具 1B构成空腔C，用于吸引并保持脱模膜4的第一吸入槽5和在第一吸入槽5的内部径向吸附脱模膜4的第二吸入槽6设置在外部空腔的上表面， 的下模具1A。 第二吸入槽6的空腔侧的槽侧面s2形成为比外侧的槽侧面s1更加平缓的倾斜面，使第二吸引槽6的截面形状在内侧/ 外面不对称，向上扩大。
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公开(公告)号：JP5334933B2
公开(公告)日：2013-11-06
申请号：JP2010202547
申请日：2010-09-10
Applicant: Towa株式会社
IPC: H01L33/48
Abstract: PROBLEM TO BE SOLVED: To improve, in a cutting and dividing process for a resin-sealed LED (luminous element) substrate W, the efficiency of the substrate by cutting means such as a rotating blade and the endurance of the cutting means. SOLUTION: First, a resin 41 attached on the surface at a cutting position (cutting line) C on a resin-sealed LED substrate W is peeled off and removed, and then cutting means such as a rotating blade is used to cut and divide the substrate W from which the attached resin 41 has been peeled off and removed into individual minimum units along the cutting position C. Also, in a process for peeling off and removing the resin 41, the resin 41 attached on a required cutting width 80 at the cutting and dividing position of the substrate W is peeled off and removed by a peeling blade 71 such as a scraper. Also, in other processes for peeling off and removing the attached resin 41, first of all, two rotating blades 73 are used to cut two cutting grooves 42 in the resin 41 attached on the position corresponding to the required cutting width 80 of the substrate W, and then the resin 41 attached between the cutting grooves 42 is peeled off and removed by the peeling blade 71. COPYRIGHT: (C)2012,JPO&INPIT
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214.发明专利Mold for compression molding, compression molding apparatus and compression molding method 有权用于压缩成型的模具，压缩成型装置和压缩成型方法
公开(公告)号：JP2013180461A
公开(公告)日：2013-09-12
申请号：JP2012045031
申请日：2012-03-01
Inventor： SUNADA MAMORU
Abstract: PROBLEM TO BE SOLVED: To prevent defects caused by wrinkles occurring in a film by removing the wrinkles in a compression molding using the film.SOLUTION: A lower mold 2 opposed to an upper mold 1 has a frame-like frame mold 4 and a compression mold 5 fitted to the mold 4 and movable in a direction coming close to and separating from the upper mold 1. A projection 5a is formed on an outer peripheral edge of a surface opposed to the upper mold 1, of the compression mold 5. A step part 4a is formed at a side close to the upper mold 1, of the inner peripheral surface of the mold 4. A resin 9 is supplied to the lower mold 2 covered with a release film 8. The wrinkle 8a occurs by moving the compression mold 5 in a direction coming close to the upper mold 1 thereby loosening the release film 8, and the wrinkle 8a is removed by moving the compression mold 5 in a direction more close to the upper mold 1 with the result that the projection 5a of the compression mold 5 projects more than the step part 4a of the mold 4 thereby spreading the release film 8.
Abstract translation: 要解决的问题：通过使用该膜除去压缩成型中的褶皱，以防止膜中产生的褶皱所引起的缺陷。解决方案：与上模具1相对的下模具2具有框架状框架模具4和压缩 模具5装配到模具4上，并且可以在靠近上模具1分离的方向上移动。在压模5的与上模具1相对的表面的外周边缘上形成有突起部5a。 台阶部4a形成在模具4的内周面的靠近上模具1的一侧。树脂9被供给到被隔离膜8覆盖的下模具2上。通过移动压缩 模具5沿着靠近上模具1的方向旋转，从而松开隔离膜8，并且通过沿着更靠近上模具1的方向移动压模5来去除皱纹8a，结果是 压缩模具5个项目超过了ste p部分4a，从而使剥离膜8扩展。
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公开(公告)号：JP5285285B2
公开(公告)日：2013-09-11
申请号：JP2008017000
申请日：2008-01-29
Applicant: Towa株式会社
IPC: H01L21/56
CPC classification number: B29C43/34 , B29C33/20 , B29C43/18 , B29C43/36 , B29C43/52 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01006 , H01L2924/01033 , H01L2924/01052 , H01L2924/01079 , H01L2924/181 , H01L2224/81 , H01L2924/00
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Patent Agency Ranking216.发明专利
公开(公告)号：JP2013158943A
公开(公告)日：2013-08-19
申请号：JP2012020663
申请日：2012-02-02
Inventor： TANE YUKITOMO , TAKAHASHI NORIYUKI
Abstract: PROBLEM TO BE SOLVED: To achieve compression resin sealing molding using a substrate 1 before resin sealing having a structure having a resin uncontactable area B on a mounting surface side for an LED chip (semiconductor chip) 2 on a semiconductor substrate.SOLUTION: A substrate 1 before resin sealing is set in a lower mold cavity 7c, and a resin uncontactable area B is covered by joining an upper end part 10a of a member 10 for resin burr prevention which projects into the lower mold cavity 7c to respective parts of the resin uncontactable area B of the substrate 1 before resin sealing. In this state, both upper and lower molds 6, 7 are closed and an LED chip 2 on the substrate 1 before resin sealing is dipped in a transparent resin material R in the lower mold cavity 7c. Further, respective LED chips 2 are sealed and molded in a transparent resin molding (lens) by compressing the transparent resin material R in the lower mold cavity 7c, and resin burrs are prevented from sticking on the resin uncontactable area B.
Abstract translation: 要解决的问题：在半导体衬底上的用于LED芯片（半导体芯片）2的安装表面侧上具有树脂密封结构的树脂密封之前，使用基板1进行压缩树脂密封成型。解决方案：基板 在将树脂密封装置设置在下模腔7c中之前，将树脂密封的树脂密封装置1固定在树脂密封装置1中，通过将用于防止树脂毛刺的构件10的上端部10a接合到下模腔7c中而将树脂未接触区域B覆盖， 树脂密封前的基板1的不可接触区域B. 在这种状态下，关闭上下模具6,7，将树脂密封前的基板1上的LED芯片2浸渍在下模腔7c中的透明树脂材料R中。 此外，各LED芯片2通过压缩下模腔7c中的透明树脂材料R而密封并模制在透明树脂模制件（透镜）中，并且防止树脂毛刺粘在树脂不接触区域B上。
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公开(公告)号：JP2013089726A
公开(公告)日：2013-05-13
申请号：JP2011228016
申请日：2011-10-17
Inventor： BANDO KAZUHIKO , MIYAGAWA SHIGERU , MATSUO MAKOTO , TAKAHASHI KAZUHIRO , ONISHI HISAYOSHI
CPC classification number: H01L25/0753 , H01L24/97 , H01L33/58 , H01L2924/12041 , H01L2924/15787 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To manufacture a thin opto-electronic component capable of efficiently leading the light generated to the outside at a low cost.SOLUTION: An opto-electronic component 15 corresponding to a plurality of regions 2 of a substrate 1 comprises: a unit substrate 16; a plurality of small optical elements 4; a flat plate 17 composed of sealing resin 12; and a plurality of convex small lenses 18 composed of sealing resin 12. The opto-electronic component 15 has a separation surface (division surface) DF, formed by separating a sealed substrate 13 into multiple region 2 units, as the side surface. The optical axis of each small lens 18 and the optical axis of each small optical element 4 match as the center line CL.
Abstract translation: 要解决的问题：制造能够以低成本有效地引导产生到外部的光的薄型光电子部件。 ＆lt; P＆gt;解决方案：对应于基板1的多个区域2的光电子部件15包括：单元基板16; 多个小型光学元件4; 由密封树脂12构成的平板17; 以及由密封树脂12构成的多个凸形小透镜18.光电子部件15具有通过将密封基板13分离为多个区域2单元而形成的分离面（分割面）DF作为侧面。 每个小透镜18的光轴和每个小光学元件4的光轴与中心线CL相匹配。 版权所有（C）2013，JPO＆INPIT
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218.发明专利
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