Abstract:
Subjects for the invention are to obtain a quartz powder having a high purity and high quality and a process for producing the same and to obtain a glass molding formed by melting and molding the powder and extremely reduced in bubble inclusion.The invention provides a quartz powder, preferably a synthetic quartz powder obtained by the sol-gel method, which, upon heating from room temperature to 1,700° C., generates gases in which the amount of CO is 300 nl/g or smaller and the amount of CO2 is 30 nl/g or smaller.
Abstract:
A silica glass member for semiconductor in which each concentration of Fe, Cu, Cr and Ni is 5 ppb or less and the concentration of an OH group is 30 ppm or less and which has a viscosity of 1013.0 poise or more at 1200° C. is provided as a silica glass member for semiconductor having high heat-resistance and higher purity.
Abstract:
Subjects for the invention are to obtain a quartz powder having a high purity and high quality and a process for producing the same and to obtain a glass molding formed by melting and molding the powder and extremely reduced in bubble inclusion.The invention provides a quartz powder, preferably a synthetic quartz powder obtained by the sol-gel method, which, upon heating from room temperature to 1,700° C., generates gases in which the amount of CO is 300 nl/g or smaller and the amount of CO2 is 30 nl/g or smaller.
Abstract:
A method for producing a quartz glass material with high resistance to radiation-induced density modifications when exposed to ultraviolet radiation at about 193 nm and energy densities of the order of the working energy densities of optical systems for microlithography, in which the peroxy defect level in the quartz glass material is minimized. In this way the creation of closely neighbored hydroxyl groups can be inhibited, which have been identified as an essential cause for radiation induced density reduction of the quartz glass material.
Abstract:
Subjects for the invention are to obtain a quartz powder having a high purity and high quality and a process for producing the same and to obtain a glass molding formed by melting and molding the powder and extremely reduced in bubble inclusion. The invention provides a quartz powder, preferably a synthetic quartz powder obtained by the sol-gel method, which, upon heating from room temperature to 1,700null C., generates gases in which the amount of CO is 300 nl/g or smaller and the amount of CO2 is 30 nl/g or smaller.
Abstract:
A silica glass member for semiconductor in which each concentration of Fe, Cu, Cr and Ni is 5 ppb or less and the concentration of an OH group is 30 ppm or less and which has a viscosity of 1013.0 poise or more at 1200null C. is provided as a silica glass member for semiconductor having high heat-resistance and higher purity.
Abstract:
This invention resides in a process for making silica articles having few or no visible bubbles by sintering silica gels derived from a sol-gel process. The process incorporates control of pH during hydroxylation and gelation, as well as chlorination at temperatures previously considered unsuitable. The process optionally incorporates addition of dispersant to the silica solution.
Abstract:
The invention relates to fused silica having low compaction under high energy irradiation, particularly adaptable for use in photolithography applications.
Abstract:
Opaque silica glass having a density of 2.0 to 2.18 g/cm.sup.3, sodium and potassium elements concentrations in the silica glass of each 0.5 ppm or less and an OH group concentration of 30 ppm or less, and containing bubbles which are independent bubbles having the following physical values: a bubble diameter of 300 .mu.m or less, and a bubble density of 100,000 to 1,000,000 bubbles/cm.sup.3, and a production process for opaque silica glass, including: filling quartz raw material grain having a particle size of 10 to 350 .mu.m in a heat resistant mold, heating it in a non-oxidizing atmosphere from a room temperature up to a temperature lower by 50 to 150.degree. C. than a temperature at which the above raw material grain is melted at a temperature-raising speed not exceeding 50.degree. C./minute, then, slowly heating it up to a temperature higher by 10 to 80.degree. C. than the temperature at which the quartz raw material grain is melted at the speed of 10.degree. C./minute or less, and cooling after maintaining at the above temperature.
Abstract translation:密度为2.0〜2.18g / cm 3的不透明二氧化硅玻璃,二氧化硅玻璃中的钠和钾元素浓度为0.5ppm以下,OH基浓度为30ppm以下,并且含有具有以下的独立气泡的气泡 物理值:气泡直径为300μm以下,气泡密度为100,000〜1,000,000个气泡/ cm 3,以及不透明石英玻璃的制造方法,其特征在于,填充粒径为10〜350μm的石英原料粒子 在耐热模具中,将其在非氧化性气氛中从室温加热到低于50-150℃的温度,而不是以不升温速度将上述原料颗粒熔化的温度 超过50℃/分钟,然后缓慢加热至高于10℃至80℃的温度,高于石英原料颗粒以10℃/分钟或更低的速度熔化的温度, 并保持冷却 在上述温度下。
Abstract:
Molded bodies of quartz glass have at least one surface area of transparent quartz glass, the exposed surfaces of which are smooth and which have a surface microroughness of less than 8 .mu.m. The base material has a chemical purity of at least 99.9% and a cristobalite content of no more than 1%; is gas-impermeable and opaque; and contains pores. At a wall thickness of 1 mm, the base material has a nearly uniform direct spectral transmission of less than 10% in the wavelength range of .lambda.=190-2,650 nm; and which has a density of at least 2.215 g/cm.sup.3. The transparent surface area is formed from base material by heating it to a temperature above 1,650.degree. C. The thickness of the transparent layer is at least 0.5 mm, and its direct spectral transmission in the wavelength range of .lambda.=6001-2,650 nm is at least 60% for a layer thickness of 1 mm.