Thermally-curable heat-conductive silicone grease composition
    213.
    发明专利
    Thermally-curable heat-conductive silicone grease composition 有权
    热固性导热硅油组合物

    公开(公告)号:JP2013227374A

    公开(公告)日:2013-11-07

    申请号:JP2012098765

    申请日:2012-04-24

    Abstract: PROBLEM TO BE SOLVED: To provide a thermally-curable heat-conductive silicone grease composition which has high shape retention characteristics even in an early stage when the viscosity of the composition is low (the composition is easily applied), and which becomes soft (having low hardness) after being cured.SOLUTION: A thermally-curable heat-conductive silicone grease composition includes: (A) an organopolysiloxane having viscosity of 100 to 100,000 mPa s at 25°C and containing at least one alkenyl group per molecule; (B) an organopolysiloxane represented by general formula (1); (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms each directly bound to a silicon atom per molecule; (D) a catalyst selected from a group consisting of platinum and platinum compounds; (F) a heat-conductive filler having heat conductivity of 10 W/m °C or more; and (G) silica fine powder, as essential components.

    Abstract translation: 要解决的问题:为了提供即使在组合物的粘度低(组合物容易涂布)的情况下,即使在早期阶段也具有高形状保持特性的可热固化的导热硅油组合物,并且变软(具有 低硬度)。溶解性:可热固化的导热硅脂组合物包括:(A)在25℃下粘度为100至100,000mPa·s且每分子含有至少一个烯基的有机聚硅氧烷; (B)由通式(1)表示的有机聚硅氧烷; (C)每分子含有至少两个氢原子直接键合到硅原子上的有机氢聚硅氧烷; (D)选自铂和铂化合物的催化剂; (F)导热性为10W / m℃以上的导热性填料; 和(G)二氧化硅细粉,作为必要成分。

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