公开(公告)号：US5376804A

公开(公告)日：1994-12-27

申请号：US90071

申请日：1993-07-19

Applicant: Clive I. Coleman

Inventor： Clive I. Coleman

IPC: G01B11/00 ,  G01B11/26 ,  G01N21/59 ,  G01N21/64 ,  G01N21/86 ,  G02B21/26

CPC classification number: G01N21/5911 ,  G01N2021/177 ,  G01N21/4738 ,  G01N21/6445 ,  G01N21/8483 ,  G01N2201/103

Abstract: An optical analysis or processing system for use, for example, in the analysis of microscopic spots of material by their effect on a very fine polarized beam of light (e.g., FPIA). For multiple "spot" analysis the spot samples are disposed on a substrate in predetermined relation with an optical pattern, bars, chevrons, etc. The substrate is mounted in the path of the fixed and focused beam with three degrees of freedom of movement. A video camera records the optical pattern very accurately and controls the substrate mounting to position a selected sample spot at the beam focus. Multiple and rapid sample analysis can thus be performed.

Abstract translation: PCT No.PCT / GB92 / 02239 Sec。 371日期：1993年7月19日 102（e）日期1993年7月19日PCT提交1992年12月2日PCT公布。 公开号WO93 / 11469 日期：1993年6月10日。一种光学分析或处理系统，例如用于通过对非常精细的偏振光束（例如，FPIA）的影响来分析材料的微观斑点。 对于多个“斑点”分析，光斑样品以与光学图案，条，人字纹等预定的关系设置在基板上。基板被安装在具有三个自由度的固定聚焦光束的路径中。 摄像机非常精确地记录光学图案，并控制基板安装以将选定的样品点放置在光束焦点处。 因此可以进行多次和快速的样品分析。

公开(公告)号：US4966457A

公开(公告)日：1990-10-30

申请号：US298920

申请日：1989-01-19

Applicant: Fuminori Hayano ,  Kazunori Imamura ,  Sunao Murata

Inventor： Fuminori Hayano ,  Kazunori Imamura ,  Sunao Murata

IPC: G01N21/88 ,  G01N21/31 ,  G01N21/94 ,  G01N21/956 ,  G01N21/958 ,  G03F1/84

CPC classification number: G03F1/84 ,  G01N21/94 ,  G03F1/62 ,  G01N2021/556 ,  G01N21/314 ,  G01N2201/103

Abstract: A defect inspecting apparatus for determining the presence of a defect element adhering to either of the front and back surfaces of a thin film-like object to be inspected (the object having a light-transmitting property) applies two light beams of different wavelengths to a surface of the object and varies the incident angle of the light beams. A first photoelectric detector receives light of the two light beams reflected by or transmitted by the object, and a second photoelectric detector receives light of the two light beams scattered by the defect element. A discriminator determines the surface of the object to which the defect element adheres based on detection outputs of the photoelectric detectors.

Abstract translation: 用于确定粘附在待检查的薄膜状物体（具有透光性的物体）的前表面和后表面中的任一个的缺陷元件的存在的缺陷检查装置将两个不同波长的光束施加到 物体的表面并改变光束的入射角。 第一光电检测器接收被物体反射或透射的两个光束的光，第二光电检测器接收由缺陷元件散射的两个光束的光。 鉴别器基于光电检测器的检测输出来确定缺陷元件粘附到的物体的表面。

公开(公告)号：US4874956A

公开(公告)日：1989-10-17

申请号：US177412

申请日：1988-04-04

Applicant: Toshihiro Kato ,  Masamichi Shindo ,  Yoshihito Fukasawa

Inventor： Toshihiro Kato ,  Masamichi Shindo ,  Yoshihito Fukasawa

IPC: H01L21/66 ,  G01N21/88 ,  G01N21/956 ,  G01R31/265 ,  G01R31/28 ,  H01L21/60

CPC classification number: H01L24/85 ,  G01N21/88 ,  G01R31/2656 ,  G01R31/2853 ,  H01L24/78 ,  G01N2201/103 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181

Abstract: An apparatus and a method for inspecting semiconductor devices, where a focused laser beam scans the semiconductor device, and the reflected beam thereof indicating height information of the reflection positions on the semiconductor device is detected for producing detected signals. The detected signals are compared with predetermined acceptance levels of height and distance.

Abstract translation: 检测半导体器件的装置和方法，其中聚焦的激光束扫描半导体器件，并且检测其表示半导体器件上的反射位置的高度信息的反射光束，以产生检测信号。 将检测到的信号与高度和距离的预定接受水平进行比较。

公开(公告)号：US4748335A

公开(公告)日：1988-05-31

申请号：US752160

申请日：1985-07-03

Applicant: James T. Lindow ,  Simon D. Bennett ,  Ian R. Smith

Inventor： James T. Lindow ,  Simon D. Bennett ,  Ian R. Smith

IPC: H01L21/66 ,  G01B11/02 ,  G01B11/24 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956 ,  G02B21/00 ,  H01L21/027 ,  H01L21/30

CPC classification number: G01N21/956 ,  G01B11/02 ,  G01B11/24 ,  G02B21/0052 ,  G02B21/006 ,  G01N21/9501 ,  G01N2201/103

Abstract: A system for determining surface profiles of specimens such as semiconductor wafers includes a drive for mounting the wafer for oscillatory movement along a line and an optical imaging system overlying the wafer for focusing a beam on a small sport on the wafer and including a photodetector for detecting the reflected sport from the wafer. The spot is scanned along the line on the wafer while the focal depth of the imaging system is progressively changed while the photodetector and connected digital circuitry generate a plurality of spaced output signals for each scan along the line so that data comprised of a series of spaced signals are provided at a plurality of focus levels extending through the surface profile of the wafer. Computer means are provided for analyzing the data and providing a graphical output of the surface profile.

Abstract translation: 用于确定诸如半导体晶片的样品的表面轮廓的系统包括用于沿着线安装用于振荡运动的晶片的驱动器和覆盖晶片的光学成像系统，用于将光束聚焦在晶片上的小型运动上，并且包括用于检测的光电检测器 从晶圆反射的运动。 沿着晶片上的线扫描点，同时成像系统的焦深逐渐改变，同时光电检测器和连接的数字电路为沿着该线的每次扫描产生多个间隔的输出信号，使得由一系列间隔开的数据组成 信号被提供在延伸穿过晶片的表面轮廓的多个聚焦水平。 提供计算机装置用于分析数据并提供表面轮廓的图形输出。

公开(公告)号：US4691106A

公开(公告)日：1987-09-01

申请号：US775749

申请日：1985-09-13

Applicant: Choi J. Hyun ,  Lee J. Chul ,  Choi W. Bum

Inventor： Choi J. Hyun ,  Lee J. Chul ,  Choi W. Bum

IPC: G01J1/16 ,  G01M11/00 ,  G01N21/55 ,  G01N21/88

CPC classification number: G01N21/88 ,  G01M11/005 ,  G01J1/1626 ,  G01N21/35 ,  G01N21/55 ,  G01N2201/103

Abstract: An apparatus for detecting defects in a laser mirror by using a laser beam in order to detect any possible changes in reflectivity over the surface of the mirror. A laser beam is split by a beam splitter into one portion for scanning the mirror to be inspected and which is reflected therefrom to produce a reflection signal, the remaining portion of the beam providing a reference signal. A computer receives both signals and on the basis of comparison thereof determines the condition of the mirror because there will be incorrect reflection of the laser beam from any region of the mirror which is defective.

Abstract translation: 一种用于通过使用激光束来检测激光反射镜中的缺陷的装置，以便检测反射镜表面上的任何可能的反射率变化。 激光束被分束器分裂成一部分，用于扫描要检查的反射镜，并且由其反射以产生反射信号，光束的剩余部分提供参考信号。 计算机接收两个信号，并且在比较的基础上，确定反射镜的状态，因为激光束将会从反射镜的任何有缺陷的区域反射出来。

公开(公告)号：US12044627B2

公开(公告)日：2024-07-23

申请号：US17597319

申请日：2019-07-24

Applicant: Hitachi High-Tech Corporation

Inventor： Masaya Yamamoto ,  Toshifumi Honda ,  Masami Makuuchi ,  Nobuhiro Obara ,  Shunichi Matsumoto

IPC: G01N21/89 ,  G01N21/95 ,  G02B21/00

CPC classification number: G01N21/8901 ,  G01N21/9505 ,  G02B21/0032 ,  G02B21/0036 ,  G01N2201/103

Abstract: This defect inspection device for emitting illumination light onto a moving and rotating sample and inspecting for sample defects by scanning the sample in a spiral shape or concentric circle shapes comprises: an illumination and detection unit comprising an emission optical system and a detection optical system; a rotary stage for rotating the sample; a rectilinear stage for rectilinearly moving the rotary stage; and a controller for controlling the illumination and detection unit, rotary stage, and rectilinear stage. On the linear path of the rectilinear stage are a scanning start position where illumination light is emitted onto the sample and scanning is started and a sample delivery position where movement of the sample to the scanning start position starts. When the sample arrives at the scanning start position, the defect inspection device starts emitting the illumination light onto the sample without waiting for the rotation speed of the rotary stage to rise to a specified rotation speed for scanning and raises the rotation speed of the rotary stage to the specified rotation speed while scanning the sample.

公开(公告)号：US20240201105A1

公开(公告)日：2024-06-20

申请号：US18143257

申请日：2023-05-04

Applicant: EPIR, Inc.

Inventor： Issac L. Chang ,  Sushant Sonde ,  Silviu Velicu ,  Yong Chang

IPC: G01N21/95 ,  G01N1/42

CPC classification number: G01N21/9505 ,  G01N1/42 ,  G01N2201/06113 ,  G01N2201/0636 ,  G01N2201/103

Abstract: A method of contactless, non-destructive contamination-free 2-dimensional mapping of the cutoff wavelength (or bandgap) and the minority carrier lifetime, which is measured through photo-excited excess free carrier absorption decay method, in semiconductor thin film materials and wafers, including typical semiconductor wafers such as Si, Ge, GaAs, and GaSb as well as narrow gap semiconductors such as InSb, type II superlattices (T2SLs) and HgCdTe, at variable temperatures from room temperature down to 2K, utilizing a three-chamber arrangement in which the external chamber and cold chamber are held at ultra-high vacuum and the innermost (sample) chamber is held at cryogenic temperature to cool wafer or thin film samples through gaseous thermal transfer media to cryogenic temperatures down to 1.9 K under pumping. To achieve full-range wafer mapping, the measurement and sensing components for transmitted and reflected light, including infrared probing beam sources, such as long-wavelength infrared lasers, fast HgCdTe detectors, or detector liner or 2-dimensional arrays mounted in liquid nitrogen dewars or thermoelectric (TE)-cooled detector housings, excitation lasers with a wavelength shorter than the bandgap of the sample to be measured, a broadband infrared source with focusing mirror, light grating with mirror and its other accessories including the motion execution and control components, and a linear LWIR array in a liquid nitrogen Dewar, are positioned outside all three chambers and can be moved through a carriage mounting to create the radial component of the mapping motion domain. The rotation of the sample holder is controlled through a drive gear located inside the sample chamber and creates the angular component of the mapping motion domain.

公开(公告)号：US20240019243A1

公开(公告)日：2024-01-18

申请号：US18476919

申请日：2023-09-28

Applicant: The Boeing Company ,  FemtoMetrix, Inc.

Inventor： Jeffrey H. Hunt ,  Jianing Shi ,  John Paul Changala

IPC: G01B11/24 ,  G01J3/10 ,  G01J3/44 ,  G01N21/63 ,  G01N21/65

CPC classification number: G01B11/24 ,  G01J3/10 ,  G01J3/108 ,  G01J3/44 ,  G01N21/636 ,  G01N21/65 ,  G01J2003/102 ,  G01N2021/638 ,  G01N2021/655 ,  G01N2201/103 ,  G01N2201/105

Abstract: Surface sensing methods for imaging a scanned surface of a sample via sum-frequency vibrational spectroscopy are disclosed herein. The methods include exposing a sampled location of the scanned surface to a visible light beam and exposing the sampled location to a tunable infrared beam such that the tunable infrared beam is at least partially coincident with the visible light beam. The methods also include varying a frequency of the tunable infrared beam an inducing optical resonance within an imaged structure that extends at least partially within the sampled location. The methods further include receiving at least a portion of an emitted light beam from the sampled location and scanning the visible light beam and the runnable infrared beam across the scanned portion of the scanned surface. The methods also include generating an image of the scanned portion of the scanned surface based upon the receiving and the scanning.

公开(公告)号：US11808563B2

公开(公告)日：2023-11-07

申请号：US17942813

申请日：2022-09-12

Applicant: The Boeing Company ,  FemtoMetrix, Inc.

Inventor： Jeffrey H. Hunt ,  Jianing Shi ,  John Paul Changala

IPC: G01N21/63 ,  G01B11/24 ,  G01J3/10 ,  G01J3/44 ,  G01N21/65

CPC classification number: G01B11/24 ,  G01J3/10 ,  G01J3/108 ,  G01J3/44 ,  G01N21/636 ,  G01N21/65 ,  G01J2003/102 ,  G01N2021/638 ,  G01N2021/655 ,  G01N2201/103 ,  G01N2201/105

Abstract: Surface sensing methods for imaging a scanned surface of a sample via sum-frequency vibrational spectroscopy are disclosed herein. The methods include exposing a sampled location of the scanned surface to a visible light beam and exposing the sampled location to a tunable infrared beam such that the tunable infrared beam is at least partially coincident with the visible light beam. The methods also include varying a frequency of the tunable infrared beam an inducing optical resonance within an imaged structure that extends at least partially within the sampled location. The methods further include receiving at least a portion of an emitted light beam from the sampled location and scanning the visible light beam and the runnable infrared beam across the scanned portion of the scanned surface. The methods also include generating an image of the scanned portion of the scanned surface based upon the receiving and the scanning.

公开(公告)号：US20190212132A1

公开(公告)日：2019-07-11

申请号：US16352569

申请日：2019-03-13

Applicant: The Boeing Company ,  FemtoMetrix, Inc.

Inventor： Jeffrey H. Hunt ,  Jianing Shi ,  John Paul Changala

IPC: G01B11/24 ,  G01J3/10 ,  G01J3/44 ,  G01N21/63 ,  G01N21/65

CPC classification number: G01B11/24 ,  G01J3/10 ,  G01J3/108 ,  G01J3/44 ,  G01J2003/102 ,  G01N21/636 ,  G01N21/65 ,  G01N2021/638 ,  G01N2021/655 ,  G01N2201/103 ,  G01N2201/105

Abstract: Surface sensing methods for imaging a scanned surface of a sample via sum-frequency vibrational spectroscopy are disclosed herein. The methods include exposing a sampled location of the scanned surface to a visible light beam and exposing the sampled location to a tunable infrared beam such that the tunable infrared beam is at least partially coincident with the visible light beam. The methods also include varying a frequency of the tunable infrared beam an inducing optical resonance within an imaged structure that extends at least partially within the sampled location. The methods further include receiving at least a portion of an emitted light beam from the sampled location and scanning the visible light beam and the runnable infrared beam across the scanned portion of the scanned surface. The methods also include generating an image of the scanned portion of the scanned surface based upon the receiving and the scanning.