Abstract:
A photovoltaic (PV) module includes a plurality of PV cells and a plurality of reconfigurable interconnects which electrically interconnect the plurality of PV cells.
Abstract:
A composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.
Abstract:
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Abstract:
A printhead assembly is provided having at least one printhead module of at least two printhead integrated circuits having nozzles for delivering printing fluid onto the surface of print media and a support member supporting and carrying the printing fluid to the printhead integrated circuits, a support frame supporting the printhead module, a controller for processing print data and controlling the printhead integrated circuits to print the processed print data, electrical conductors for providing power to the controller and the printhead integrated circuits, and a mounting element mounting the controller and the electrical conductors to the support frame. The mounting element has a clamping arrangement for clamping the support member to the support frame.
Abstract:
A method for tuning parameter of RF transmission line and a structure thereof for a printed circuit board (PCB) are provided. When the PCB is being laid out, a transmission line and a plurality of copper foils are formed on the PCB in advance, and at least one tune metal, which is welded directly to the transmission line and partial or at least a copper foil, is used to replace a discrete component such as a transistor, a capacitor, or an inductor, which is working in a low frequency. Therefore, the operation of tuning parameter of the RF element on the PCB makes good use of the open stub or short stub effect occurred between the transmission line and the copper foils, so as to modify the characteristic parameter of the RF transmission line.
Abstract:
A ceramic circuit board that protects a metallized wiring layer from fusion when a large electric current is applied thereto. The ceramic circuit board includes a ceramic substrate, a plurality of metallized wiring layers formed on the ceramic substrate, and a metal circuit plate made of copper, which is attached to part of the metallized wiring layers. The condition, S≧6×10−5i2, is fulfilled in the ceramic circuit board, whereby S (mm2) is the sectional area of the metal circuit plate and i (A) the value of a flowing electric current.
Abstract:
The invention relates to a method of connecting two flat laminated cable ends. A metal strip tin-plated with a solder coating is placed transversely over the conductor tracks between the two flat laminated cable ends, the flat laminated cable ends are pressed onto each other with the tin-plated metal strip lying in between, current is applied to the metal strip and it is heated until the solder of the metal strip melts and enters into a soldered connection with the conductor tracks of the flat laminated cables, and, after the soldered connection, the metal strip is separated in the intermediate spaces between two neighboring conductor tracks.
Abstract:
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Abstract:
A device, and a method for making the same, for bonding two millimeter elements, which include a substrate having an upper face and a lower face, a conducting line on the upper face and oriented substantially perpendicular to an edge of the substrate, and two continuous bounding zones on the upper face and along the edge of the substrate, each continuous bounding zone being electrically grounded, and having a length along said edge between about two and about five times the width of the conducting lines.
Abstract:
An electroconductive sheet is stuck on electrodes of an electronic device so as to electrically connect the electrodes with each other. Next, the electrodes are inserted into a corresponding connector. Finally, the electroconductive sheet is peeled from the electrodes.