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    Printhead assembly having clamped components
    214.
    发明申请
    Printhead assembly having clamped components 有权
    具有夹紧部件的打印头组件

    公开(公告)号：US20070046728A1

    公开(公告)日：2007-03-01

    申请号：US11592984

    申请日：2006-11-06

    Applicant: Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

    Inventor： Kia Silverbrook ,  Norman Berry ,  Garry Jackson ,  Akira Nakazawa

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14427 ,  B41J2/155 ,  B41J2002/14435 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20 ,  H01R12/721 ,  H01R12/79 ,  H01R13/2414 ,  H01R13/6315 ,  H05K1/142 ,  H05K3/0058 ,  H05K2201/1028 ,  H05K2201/10424

    Abstract: A printhead assembly is provided having at least one printhead module of at least two printhead integrated circuits having nozzles for delivering printing fluid onto the surface of print media and a support member supporting and carrying the printing fluid to the printhead integrated circuits, a support frame supporting the printhead module, a controller for processing print data and controlling the printhead integrated circuits to print the processed print data, electrical conductors for providing power to the controller and the printhead integrated circuits, and a mounting element mounting the controller and the electrical conductors to the support frame. The mounting element has a clamping arrangement for clamping the support member to the support frame.

    Abstract translation: 提供了一种打印头组件，其具有至少两个打印头集成电路的至少一个打印头模块，该打印头集成电路具有用于将打印流体输送到打印介质的表面上的喷嘴和支撑并将打印流体运送到打印头集成电路的支撑部件， 打印头模块，用于处理打印数据和控制打印头集成电路以打印经处理的打印数据的控制器，用于向控制器和打印头集成电路提供电力的电导体以及将控制器和电导体安装到 支持框架。 安装元件具有用于将支撑构件夹紧到支撑框架的夹紧装置。

    [METHOD FOR TUNING PARAMETER OF RF TRANSMISSION LINE AND STRUCTURE THEREOF]
    215.
    发明申请
    [METHOD FOR TUNING PARAMETER OF RF TRANSMISSION LINE AND STRUCTURE THEREOF] 审中-公开
    [RF传输线及其结构的调谐参数的方法]

    公开(公告)号：US20040207496A1

    公开(公告)日：2004-10-21

    申请号：US10249834

    申请日：2003-05-12

    Inventor： JIH-HWA LEE ,  CHUN-TSUN LIANG ,  CHIA-FAN YEH

    IPC: H01P005/00

    CPC classification number: H05K1/025 ,  H01P11/003 ,  H05K3/225 ,  H05K3/328 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2203/171

    Abstract: A method for tuning parameter of RF transmission line and a structure thereof for a printed circuit board (PCB) are provided. When the PCB is being laid out, a transmission line and a plurality of copper foils are formed on the PCB in advance, and at least one tune metal, which is welded directly to the transmission line and partial or at least a copper foil, is used to replace a discrete component such as a transistor, a capacitor, or an inductor, which is working in a low frequency. Therefore, the operation of tuning parameter of the RF element on the PCB makes good use of the open stub or short stub effect occurred between the transmission line and the copper foils, so as to modify the characteristic parameter of the RF transmission line.

    Abstract translation: 提供了用于调整RF传输线的参数的方法及其用于印刷电路板（PCB）的结构。 当PCB布置时，预先在PCB上形成传输线和多个铜箔，并且直接焊接到传输线和部分或至少铜箔的至少一个调谐金属是 用于替代以低频工作的诸如晶体管，电容器或电感器的分立元件。 因此，PCB上RF元件的调谐参数的操作很好地利用了传输线和铜箔之间发生的开路短路或短路短路，从而改变了RF传输线的特性参数。

    Ceramic circuit board
    216.
    发明授权
    Ceramic circuit board 失效
    陶瓷电路板

    公开(公告)号：US06787706B2

    公开(公告)日：2004-09-07

    申请号：US10079300

    申请日：2002-02-19

    Applicant: Tetsuo Hirakawa

    Inventor： Tetsuo Hirakawa

    IPC: H05K103

    CPC classification number: H05K1/0263 ,  H01L23/49861 ,  H01L23/538 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

    Abstract: A ceramic circuit board that protects a metallized wiring layer from fusion when a large electric current is applied thereto. The ceramic circuit board includes a ceramic substrate, a plurality of metallized wiring layers formed on the ceramic substrate, and a metal circuit plate made of copper, which is attached to part of the metallized wiring layers. The condition, S≧6×10−5i2, is fulfilled in the ceramic circuit board, whereby S (mm2) is the sectional area of the metal circuit plate and i (A) the value of a flowing electric current.

    Abstract translation: 陶瓷电路板，其在施加大电流时保护金属化布线层不熔化。 陶瓷电路板包括陶瓷基板，形成在陶瓷基板上的多个金属化布线层和连接到金属化布线层的一部分的由铜制成的金属电路板。 在陶瓷电路板中满足条件S> = 6×10 -5 i 2，由此S（mm 2）是金属电路板的截面面积，i（A）a 流动电流。

    METHOD FOR CONNECTING FLAT FILM CABLES
    217.
    发明申请
    METHOD FOR CONNECTING FLAT FILM CABLES 失效
    连接平板电缆的方法

    公开(公告)号：US20040026116A1

    公开(公告)日：2004-02-12

    申请号：US10399087

    申请日：2003-08-21

    Inventor： Helmut Kanbach

    IPC: H01B007/08

    CPC classification number: H01R12/61 ,  H01R4/025 ,  H01R43/0242 ,  H05K3/363 ,  H05K2201/1028 ,  H05K2203/1115 ,  H05K2203/175 ,  Y10T29/49149

    Abstract: The invention relates to a method of connecting two flat laminated cable ends. A metal strip tin-plated with a solder coating is placed transversely over the conductor tracks between the two flat laminated cable ends, the flat laminated cable ends are pressed onto each other with the tin-plated metal strip lying in between, current is applied to the metal strip and it is heated until the solder of the metal strip melts and enters into a soldered connection with the conductor tracks of the flat laminated cables, and, after the soldered connection, the metal strip is separated in the intermediate spaces between two neighboring conductor tracks.

    Abstract translation: 本发明涉及连接两个扁平层叠电缆端部的方法。 将镀有焊料涂层的金属带横向地放置在两个平的层压电缆端之间的导体轨道上，将平坦的层压电缆端部彼此压在镀锡金属带之间，电流施加到 金属带加热直到金属条的焊料熔化并进入与扁平层压电缆的导体轨道的焊接连接，并且在焊接连接之后，金属带在两个相邻的中间空间之间分离 导轨。

    Biocompatible bonding method and electronics package suitable for implantation
    218.
    发明申请
    Biocompatible bonding method and electronics package suitable for implantation 有权
    生物相容性接合方法和电子封装适合植入

    公开(公告)号：US20030233133A1

    公开(公告)日：2003-12-18

    申请号：US10174349

    申请日：2002-06-17

    Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

    IPC: A61N001/375

    CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

    Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

    Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

    Process and device for bonding two millimeter elements
    219.
    发明授权
    Process and device for bonding two millimeter elements 有权
    用于粘合两个毫米元件的工艺和设备

    公开(公告)号：US06529105B1

    公开(公告)日：2003-03-04

    申请号：US09494358

    申请日：2000-01-31

    Applicant: Gerard Cachier ,  Jean-Yves Daden ,  Alain Grancher

    Inventor： Gerard Cachier ,  Jean-Yves Daden ,  Alain Grancher

    IPC: H01P308

    CPC classification number: H01P1/047 ,  H05K1/0219 ,  H05K1/142 ,  H05K2201/1028

    Abstract: A device, and a method for making the same, for bonding two millimeter elements, which include a substrate having an upper face and a lower face, a conducting line on the upper face and oriented substantially perpendicular to an edge of the substrate, and two continuous bounding zones on the upper face and along the edge of the substrate, each continuous bounding zone being electrically grounded, and having a length along said edge between about two and about five times the width of the conducting lines.

    Abstract translation: 一种装置及其制造方法，用于将包括具有上表面和下表面的基板的两个毫米元件连接在上表面上的导线并基本上垂直于基板的边缘取向，并且两个元件 连续的边界区域在基板的上表面和边缘上，每个连续的边界区域是电接地的，沿着所述边缘的长度在导线宽度的大约两倍到五倍之间。

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