Abstract:
A semiconductor device having the advantages of an SOI structure without the attendant disadvantages is obtained by implanting oxygen ions using the gate electrode (4) as a mask, and heating to form thin, self-aligned buried oxide regions (20, 21) extending from a field oxide region (3) under source/drain regions self-aligned with the side surfaces (4A, 4B) of the gate electrode. In other embodiments, the thin buried oxide layer extends from a point in close proximity to the field oxide region and/or partially under the gate electrode.
Abstract:
An instruction translation unit is provided which reduces instructions from a source instruction set to a set of intermediate, atomic operations. The atomic operations are then recombined into instructions in the target instruction set. An execution core coupled to the instruction translation unit may be configured to execute instructions from the target instruction set. However, compatibility with the source instruction set is maintained. By reducing a plurality of source instructions into atomic operations, portions of multiple source instructions may be combined into target instructions. The execution core may thereby be more efficiently utilized.
Abstract:
A clock generator circuit for providing a clock signal to a dual-edged D-type flip-flop, enabling the flip-flop to be dual-edged, single-edged, or to enable a user to provide clock edge selection, asynchronous clocking, clock enabling, or a mixture of different type of clock signals. The clock generator circuit includes inputs receiving first and second enable signals and a clock signal. The clock generator circuit further includes circuitry to provide an output clock signal which transitions when a rising edge of a pulse of the clock signal is received when the first clock signal is enabled, or if a falling edge of a pulse of the clock signal is received when the second clock signal is enabled.
Abstract:
A metal oxide semiconductor static random access memory (SRAM) includes NMOS transistors and resistor structures implemented without multiple polysilicon layers. According to a first embodiment, the SRAM cell comprises a plurality of appropriately interconnected NMOS transistors having transistor gates formed of a polysilicon layer and resistors formed of the same polysilicon layer. In accordance with a second embodiment, the SRAM cell comprises a plurality of appropriately interconnected NMOS transistors, a dielectric layer overlying the NMOS transistors, and polysilicon resistors passing through the dielectric layer to connect the NMOS transistors to a first metal layer. The dielectric layer, deposited on the NMOS transistors, defines holes exposing drain regions in the NMOS transistors. A polysilicon layer is deposited on the dielectric layer to fill the holes, and the excess polysilicon is removed.
Abstract:
A system and method for providing a constant electric field that is insensitive to fluctuations in the power supply to a FLASH EPROM during erasure. The system comprises a plurality of sector source drivers and a power supply insensitive constant current source. Each sector has at least one binary storage element. Each storage element has a source. The sector source drivers couple the at least one source of a sector to be erased to the power supply insensitive constant current source. The power supply insensitive constant current source provides an electric field across the tunneling oxide which is constant and insensitive to fluctuations in the power supply. This improves the wear characteristics and lifetime of the binary storage elements. In addition, this system remedies problems associated with short channel effects, electron trapping, and the use of various voltage sources.
Abstract:
Within an integrated circuit, an input/output driver circuit is provided. The input/output driver circuit is configured to provide electrical isolation and power savings when the integrated circuit is configured into a computer system such as a personal information device. By providing a mechanism permitting removal of power from the driver circuit, the integrated circuit inhibits current flow from the integrated circuit into a powdered-down peripheral device. A force term is activated, when electrical isolation is desired, to inhibit current flow into or from the integrated circuit via an input/output pad voltage level. A power savings is enabled by allowing the power down of peripheral devices coupled to the integrated circuit without the need for external buffer circuits.
Abstract:
An x-y RAM array with a reconfigurable bit width is provided. The array contains a RAM cell columns organized into a number of column groups where the number of groups determines the bit width of the memory. The number of columns in each group are configurable thereby configuring the number of groups and thus the bit width of the memory. Multiplexor logic selects a column from each group to be accessed and passgate logic determines how the multiplexor logic is combined and thus determines the column group configuration. Decode logic provides the appropriate select signals to the multiplexor logic for selecting from the configured number of columns in each group.
Abstract:
A method for reducing encroachment of an impurity implant into a channel region in a non-ESD transistor in a semiconductor circuit, the non-ESD transistor receiving both first and second implant dopants, and the circuit including a plurality of ESD transistors includes forming the ESD transistors of the circuit at a predetermined angular offset from the non-ESD transistor, and performing the second dopant implant at a predetermined tilt implant angle, wherein the non-ESD transistor has reduced encroachment of the impurity implant. A plurality of transistors formed on a semiconductor wafer include a plurality of non-ESD transistors, the plurality of non-ESD transistors including spacer regions and impurity implant regions encroaching the spacer regions, and a plurality of ESD transistors, the plurality of ESD transistors formed at a predetermined angular offset from the non-ESD transistors. Further, the plurality of ESD transistors include the spacer regions and impurity implant regions encroaching the spacer regions further than the impurity implant regions of the non-ESD transistors.
Abstract:
A system management mode (SMM) (900) of operating a processor (120) includes only a basic set of hardwired hooks or mechanisms in the processor for supporting SMM. Most of SMM functionality, such as the processing actions performed when entering and exiting SMM, is "soft" and freely defined. A system management interrupt (SMI) pin (960) is connected to the processor so that a signal on the SMI pin causes the processor to enter SMM mode. SMM is completely transparent to all other processor operating software. SMM handler code and data is stored in memory that is protected and hidden from normal software access.
Abstract:
A superscalar microprocessor (200) includes a scheduler (280) which stores information related to operations and issues operations for out-of-order execution by execution units (251 to 257). Operations are issued without regard for the availability of operands required for execution. After the issue stage, an operand forward stage identifies operand sources which may be a register file (290) or an operation in the scheduler (280). The scheduler (280) forwards a value and state information for the operand. The state information indicates whether an operation providing the operand was or is being completed so that execution can continue. The state information can also indicate a wait until a source operation is completed. If the wait is too long, the issued operation is bumped so that another operation can be issued and executed. This reduces hold ups and increases utilization of execution units (251 to 257).