-
公开(公告)号：US20180304318A1
公开(公告)日：2018-10-25
申请号：US15492433
申请日：2017-04-20
Applicant: Texas Instruments Incorporated
Abstract: Methods and apparatus for surface wetting control are disclosed. In certain described examples, an apparatus can expel fluid from a droplet on a surface using a transducer mechanically coupled to the surface. A first area of the surface can have a first wettability for the fluid, and a second area of the surface can have a second wettability for the fluid. The first wettability of the first area of the surface can be greater than the second wettability of the second area of the surface. The first area and the second area can be arranged in a patterned arrangement.
-
公开(公告)号：US20180240886A1
公开(公告)日：2018-08-23
申请号：US15437818
申请日：2017-02-21
Applicant: Texas Instruments Incorporated
Inventor： Archana Venugopal , Benjamin Stassen Cook , Luigi Colombo , Robert Reid Doering
IPC: H01L29/66 , H01L29/778 , H01L23/66 , H01L49/02
CPC classification number: H01L29/66045 , H01L23/66 , H01L28/40 , H01L29/1606 , H01L29/778 , H01L2223/6677
Abstract: A microelectronic device includes an electrical conductor which includes a graphene heterolayer. The graphene heterolayer includes a plurality of alternating layers of graphene and barrier material. Each layer of the graphene has one to two atomic layers of graphene. Each layer of the barrier material has one to three layers of hexagonal boron nitride, cubic boron nitride, and/or aluminum nitride. The layers of graphene and the layers of barrier material may be continuous, or may be disposed in nanoparticles of a nanoparticle film.
-
公开(公告)号：US10027376B2
公开(公告)日：2018-07-17
申请号：US15410818
申请日：2017-01-20
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Swaminathan Sankaran , Bradley Allen Kramer , Benjamin Stassen Cook , Juan Alejandro Herbsommer , Lutz Naumann , Mark W. Morgan , Baher Haroun
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module.
-
公开(公告)号：US20180181076A1
公开(公告)日：2018-06-28
申请号：US15393096
申请日：2016-12-28
Applicant: Texas Instruments Incorporated
CPC classification number: G04F5/14 , H01S5/005 , H01S5/022 , H01S5/02438 , H01S5/02453 , H01S5/0687 , H01S5/183 , H03B17/00 , H03L7/26
Abstract: In described examples, an apparatus includes: a physics cell including: a laser source configured to emit light towards an atomic chamber containing an atomic gas; a photodetector configured to receive emissions from the atomic chamber; and a coil for generating a magnetic field in the atomic chamber; and an electronics circuit, including: a controller circuit coupled to the photodetector output and having control outputs to a digital to analog converter circuit; the digital to analog converter circuit having a coil current output to adjust the magnetic field, a modulation control output to control a modulation of the light, and having an output to control a voltage controlled oscillator; and a radio-frequency output circuit having a voltage controlled oscillator coupled to the output of the digital to analog converter circuit and outputting a radio frequency signal to the laser source in the physics cell.
-
公开(公告)号：US20180151464A1
公开(公告)日：2018-05-31
申请号：US15361397
申请日：2016-11-26
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Archana Venugopal , Luigi Colombo , Robert Reid Doering
IPC: H01L23/367 , H01L23/528 , H01L23/373 , H01L23/48 , H01L23/522 , H01L23/532 , H01L21/3205 , H01L21/768 , H01L21/324
CPC classification number: H01L23/367 , H01L21/32051 , H01L21/32055 , H01L21/324 , H01L21/743 , H01L21/76895 , H01L23/3677 , H01L23/3735 , H01L23/481 , H01L23/5226 , H01L23/528 , H01L23/53276 , H01L27/0248 , H01L2224/48463
Abstract: An integrated circuit has a substrate which includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.
-
Patent Agency Ranking
公开(公告)号：US20170330930A1
公开(公告)日：2017-11-16
申请号：US15152518
申请日：2016-05-11
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Roberto Giampiero Massolini , Daniel Carothers
IPC: H01L49/02 , H01L23/495 , H01L21/3065 , H01L21/768 , H01L23/498
CPC classification number: H01L28/10 , H01L21/30655 , H01L21/76877 , H01L23/49541 , H01L23/49811 , H01L23/49827
Abstract: An integrated circuit (IC) that includes a circuit substrate having a front side surface and an opposite back side surface. Active circuitry is located on the front side surface. An inductive structure is located within a deep trench formed in the circuit substrate below the backside surface. The inductive structure is coupled to the active circuitry.
-
公开(公告)号：US20170330841A1
公开(公告)日：2017-11-16
申请号：US15248151
申请日：2016-08-26
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Steven Kummerl , Kurt Peter Wachtler
CPC classification number: H01L23/562 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L21/78 , H01L23/3114 , H01L23/315 , H01L23/49513 , H01L23/4952 , H01L23/49541 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/8592 , H01L2224/9205 , H01L2224/98 , H01L2924/00014 , H01L2924/18165 , H01L2224/83 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20759 , H01L2924/2076 , H01L2924/206 , H01L2924/00012
Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.
-
228.发明申请公开(公告)号：US20170187094A1
公开(公告)日：2017-06-29
申请号：US14982932
申请日：2015-12-29
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Swaminathan Sankaran
CPC classification number: H01Q1/2283 , H01Q13/20 , H04B10/90
Abstract: In an example arrangement an apparatus includes a semiconductor substrate having a front side surface including circuitry and a backside surface opposing the front side surface; a plurality of metal conductors formed over a front side surface of the semiconductor substrate; at least one cavity opening etched in a backside surface of the semiconductor substrate; and a radiator formed in a portion of the metal conductors and configured to radiate signals through the cavity opening in the backside surface. Methods and additional apparatus arrangements are also disclosed.
-
公开(公告)号：US09646906B2
公开(公告)日：2017-05-09
申请号：US14849026
申请日：2015-09-09
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Juan Alejandro Herbsommer , Django Trombley , Steven Alfred Kummerl , Paul Emerson
IPC: H01L21/288 , H01L23/00 , H01L23/31 , H01L23/522 , H05K1/09 , H05K1/16 , H01L23/495
CPC classification number: H01L23/3121 , H01L21/288 , H01L23/3107 , H01L23/495 , H01L23/5227 , H01L24/09 , H01L2224/08268 , H01L2224/32245 , H01L2224/48247 , H01L2924/13055 , H01L2924/146 , H05K1/092 , H05K1/162 , H05K1/165 , H05K2201/0179 , H05K2201/0999 , H05K2201/10151
Abstract: A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.
-
公开(公告)号：US09590699B1
公开(公告)日：2017-03-07
申请号：US14970315
申请日：2015-12-15
Inventor： Swaminathan Sankaran , Bradley Allen Kramer , Benjamin Stassen Cook , Juan Alejandro Herbsommer , Lutz Naumann , Mark W. Morgan , Baher Haroun
CPC classification number: H04B5/0031 , H04B5/0075 , H04W4/80
Abstract: A system is provided in which a set of modules each have a substrate on which is mounted a radio frequency (RF) transmitter and/or an RF receiver coupled to a near field communication (NFC) coupler located on the substrate. Each module has a housing that surrounds and encloses the substrate. The housing has a port region on a surface of the housing. Each module has a field confiner located between the NFC coupler and the port region on the housing configured to guide electromagnetic energy emanated from the NFC coupler through the port region to a port region of an adjacent module.
Abstract translation: 提供了一种系统，其中一组模块各自具有衬底，其上安装有射频（RF）发射器和/或耦合到位于衬底上的近场通信（NFC）耦合器）的RF接收器。 每个模块具有围绕并包围衬底的壳体。 壳体在壳体的表面上具有端口区域。 每个模块具有位于NFC耦合器和壳体上的端口区域之间的场约束器，其被配置成将通过端口区域从NFC耦合器发出的电磁能引导到相邻模块的端口区域。
-
-
-
-
-
-
-
-
-
Search Results
232
records
(took 0.037 seconds)
