열전도성 실리콘 그리스 조성물 및 그의 경화물
    230.
    发明公开
    열전도성 실리콘 그리스 조성물 및 그의 경화물 无效
    导热硅脂润滑脂组合物及其固化产品

    公开(公告)号:KR1020080006482A

    公开(公告)日:2008-01-16

    申请号:KR1020070069424

    申请日:2007-07-11

    Abstract: A thermally conductive silicone grease composition is provided to realize high thermal conductivity, excellent flowability and workability before curing and a reduced contact heat resistance, and excellent heat transfer property, durability and reliability after curing. A thermally conductive silicone grease composition comprises: (A) 100 parts by volume of organopolysiloxane having at least two alkenyl groups bound to Si per molecule; (B) 0.1-300 parts by volume of organopolysiloxane represented by the following formula 1 and having a dynamic viscosity of 10-10,000 mm^2/s at 25 deg.C; (C) 0.1-50 parts by volume of alkoxysilane represented by the formula of R3cR4dSi(OR5)4-c-d (wherein R3 independently represents a C9-C15 alkyl, R4 independently represents a C1-C8 monovalent hydrocarbyl, R5 independently represents a C1-C6 alkyl, c is an integer of 1-3, and d is an integer of 0-2, with the proviso that c+d is an integer of 1-3); (D) organo-hydrogen polysiloxane having at least two hydrogen atoms bound to Si, present in such an amount that the number of hydrogen atoms bound to Si in (D) is 0.1-5.0 per alkenyl group in (A); (E) 100-2500 parts by volume of a thermally conductive filler; (F) an effective amount of a Pt-based catalyst; and (G) an effective amount of addition inhibitor. The thermally conductive filler exclusively includes a thermally conductive filler having an average particle diameter of 0.01-50 micrometers. In formula 1, R1 independently represents a substituted or non-substituted monovalent hydrocarbyl, R2 independently represents an alkyl, alkoxyalkyl, alkenyl or acyl, a is an integer of 5-100, and b is an integer of 1-3.

    Abstract translation: 提供导热硅脂组合物以实现高导热性,优异的流动性和固化前的可加工性以及降低的接触耐热性,并且固化后的传热性能,耐久性和可靠性优异。 导热硅脂组合物包含:(A)100体积份的具有至少两个与每分子的Si键合的烯基的有机聚硅氧烷; (B)0.1-300体积份由下式1表示的有机聚硅氧烷,在25℃动态粘度为10-10,000mm 2 / s; (C)0.1-50体积份由式R3cR4dSi(OR5)4-cd表示的烷氧基硅烷(其中R3独立地表示C9-C15烷基,R4独立地表示C1-C8单价烃基,R5独立地表示C1- C6烷基,c为1-3的整数,d为0-2的整数,条件是c + d为1-3的整数); (D)具有至少两个与Si结合的氢原子的有机氢聚硅氧烷,其存在量使得(D)中与Si结合的氢原子数量为(A)中的每个烯基为0.1-5.0。 (E)100-2500体积份的导热填料; (F)有效量的Pt系催化剂; 和(G)有效量的加成抑制剂。 导热填料专门包括平均粒径为0.01-50微米的导热填料。 在式1中,R 1独立地表示取代或未取代的一价烃基,R 2独立地表示烷基,烷氧基烷基,烯基或酰基,a是5-100的整数,b是1-3的整数。

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