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公开(公告)号：JP2011045981A
公开(公告)日：2011-03-10
申请号：JP2009197924
申请日：2009-08-28
Applicant: Ritsumeikan , Towa Corp , Towa株式会社 , 学校法人立命館
Inventor： SUGIYAMA SUSUMU , AMAYA SATOSHI , DAO VIET DZUNG
CPC classification number: B81C99/0085 , B81B2201/052 , G02B26/0833
Abstract: PROBLEM TO BE SOLVED: To provide a low cost MEMS (micro electro mechanical systems) with a high function, and a method for manufacturing the same. SOLUTION: The method for manufacturing MEMS 101 is constituted of: a device layer 61 formed of a microstructure; and a base material 91, and has: a forming step S42 forming the device layer 61 and the base material 91 by forming a formable material by a mold 51; a joining step S44 joining the device layer 61 and the base material 91 formed in the forming step; and a removing step S45 removing a remaining film 61a generated in the forming step, from the device layer 61. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供具有高功能的低成本MEMS（微机电系统）及其制造方法。 解决方案：用于制造MEMS 101的方法由以下部分构成：由微结构形成的器件层61; 和基材91，并且具有：通过由模具51形成可成形材料而形成装置层61和基材91的成形步骤S42; 接合步骤S44，其接合在形成步骤中形成的器件层61和基底材料91; 以及从装置层61去除在成形步骤中产生的剩余膜61a的去除步骤S45。版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2011009589A
公开(公告)日：2011-01-13
申请号：JP2009153158
申请日：2009-06-29
Inventor： OKADA MASATOSHI , OSHIDA YUKI , HIROTA ATSUSHI
Abstract: PROBLEM TO BE SOLVED: To suppress occurrence of a resin mold flash caused by intrusion of a liquid resin between an end face of a substrate with a chip mounted thereon and an inner surface of a molding die by using a simple mechanism.SOLUTION: An upper die 2 provided with a cavity 16, and a lower die 1 facing the upper die 2 are provided. In a predetermined region 9 with a substrate 20 arranged therein on a die surface of the lower die 1, a guide pin 11 having a slope 12 is arranged on the side opposite to an inner surface 10 of the lower die 1 against which the right end face of the substrate 20 is pressed, and an O-ring 13 formed of an elastic member having appropriate hardness and appropriate elasticity is fitted in the root of the guide pin 11. The substrate 20 is arranged in the predetermined region 9 after the left end face lowers along the slope 12 of the guide pin 11. The left end face of the substrate 20 is pressed by the compressed O-ring 13 in this state, whereby the right end face of the substrate 20 is pressed against the inner surface 10 of the lower die 1.
Abstract translation: 要解决的问题：通过使用简单的机构，抑制由于液体树脂在其上安装有芯片的基板的端面与成型模具的内表面之间的侵入而引起的树脂模具的闪蒸。解决方案：上部 设置有空腔16的模具2和面向上模2的下模1。 在下模1的模具表面上布置有基板20的预定区域9中，具有斜面12的引导销11布置在与下模1的内表面10相对的一侧，右下端 将基板20的表面按压，将由具有合适的硬度和合适的弹性的弹性部件形成的O形环13嵌合在导向销11的根部。基板20配置在左端部之后的规定区域9 面向导引销11的斜面12的下降。在该状态下，基板20的左端面被压缩的O形环13按压，由此基板20的右端面被压靠在内表面10上 下模1。
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Patent Agency Ranking236.发明专利
公开(公告)号：JP2010172900A
公开(公告)日：2010-08-12
申请号：JP2009015062
申请日：2009-01-27
Inventor： HIBI TAKAAKI , KITAGAWA YASUYUKI , OKAMOTO JUN
Abstract: PROBLEM TO BE SOLVED: To prevent dross caused in cutting from sticking to a surface and rewelding to a section, in a segmentation process of cutting a pre-sealed substrate with a laser beam, to make efficient segmentation possible, and to improve quality of segmented electronic components. SOLUTION: In a sealed substrate 4 which is formed by resin-sealing a plurality of chips 3 mounted on a ceramic substrate 1 altogether with resin 5, grooves 11 are provided on the ceramic substrate 1 along a separatrix 6 sectioning for every partition 2. Using a cutting apparatus equipped with a laser beam irradiation mechanism 14 for emitting a laser beam 9 and a base 13 for arranging a dicing tape 7 with the sealed substrate 4 stuck thereto, the laser beam 9 is emitted along the separatrix 6 for cutting, so that dross 10 caused is stored in the grooves 11. The pieces of pre-sealed substrate 4 stuck to the dicing tape 7 after the segmentation are transported to a prescribed place of the next process altogether. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了防止在切割中产生的浮渣粘附到表面并重新焊接到部分上，在用激光束切割预密封的基板的分割过程中，以使得有效的分割成为可能，并且改善 分段电子元件的质量。 解决方案：在通过树脂密封安装在陶瓷基板1上与树脂5一起的多个芯片3形成的密封基板4中，沿陶瓷基板1沿着分隔线6设置槽11，每个分区 2.使用配备有用于发射激光束9的激光束照射机构14和粘贴有密封基板4的切割带7的基座13的切割装置，激光束9沿着切割用分割基板6发射 ，使得所产生的渣滓10被存储在槽11中。在分割之后粘附到切割胶带7上的预密封基板4被一起运送到下一个处理的规定位置。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP4517193B2
公开(公告)日：2010-08-04
申请号：JP2004165409
申请日：2004-06-03
Applicant: Towa株式会社
Inventor： 和夫 堀内
CPC classification number: B29C45/0025 , B29C45/14655 , B29C45/2708 , H01L2924/15311 , H01L2924/3511
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238.发明专利
公开(公告)号：JP2010149165A
公开(公告)日：2010-07-08
申请号：JP2008332054
申请日：2008-12-26
Inventor： HIBI TAKAAKI , KITAGAWA YASUYUKI , OKAMOTO JUN
CPC classification number: B23K26/40 , B23K26/364 , B23K26/389 , B23K2203/172 , B23K2203/50
Abstract: PROBLEM TO BE SOLVED: To suppress generation of dross and occurrence of cracking and chipping of ceramic substrate, when cutting sealed substrate including a ceramic substrate or a metallic substrate by laser beam.
SOLUTION: The cutting method is applied for manufacturing a plurality of electronic components by forming a sealed substrate 1 by applying resin sealing on chips 3 which are arranged respectively in the plurality of zones 7 prepared on a circuit substrate 2, and then cutting the sealed substrate 1 along boundary lines 6 of a plurality of zones 7. The method includes a step of fixing the sealed substrate 1 on a table 9, a step of irradiating a first and a second laser beams 12, 18 from irradiation heads to the sealed substrate 1, and a step of moving the irradiation heads and the sealed substrate 1 relatively each other. In the irradiation step, the sealed substrate 1 is cut by the second laser beam 18 irradiated toward the boundary lines 6 after formation of perforated holes 17 along the boundary lines 6 through irradiation of the first laser beam 12.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 待解决的问题：为了抑制杂质的产生和陶瓷基板的破裂和碎裂的发生，当通过激光束切割包括陶瓷基板或金属基板的密封基板时。 解决方案：通过在分别布置在电路基板2上制备的多个区域7中的芯片3上施加树脂密封来形成密封基板1，将切割方法应用于制造多个电子部件，然后切割 密封基板1沿着多个区域7的边界线6。该方法包括将密封基板1固定在工作台9上的步骤，将第一和第二激光束12,18从照射头照射到 密封基板1，以及使照射头和密封基板1相对移动的工序。 在照射步骤中，通过照射第一激光束12，沿着边界线6形成穿孔17之后，通过照射到边界线6的第二激光束18切割密封基板1。 ）2010，JPO＆INPIT
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239.发明专利
公开(公告)号：JP2010120232A
公开(公告)日：2010-06-03
申请号：JP2008295063
申请日：2008-11-19
Inventor： KITADA RYOJI , KISHIMOTO TOMOKO
Abstract: PROBLEM TO BE SOLVED: To realize a material having appropriately gentle ups and downs on the surface, inexpensively in a short time, by subjecting a blasted base material to a high-energy process. SOLUTION: After the surface 2 of a base material 1 is blasted, the surface 5 of the intermediate 4 after the blasting is subjected to a high-energy process selected from among electron beam, laser and plasma processes. An application of an electron beam process e.g. melts and then solidifies the surface 5, in a short time, in a large numbers of sharp concaves 6 and a large number of convexes 7 formed on the surface 5 of the intermediate 4 through the blasting, thus giving a material 9 having gentle ups and downs in which there are a large number of gentle troughs 11 and a large number of gentle crests 12 on the surface 10. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：通过对喷砂基材进行高能量处理，在短时间内廉价地实现在表面上适当地平缓起伏的材料。 解决方案：在对基材1的表面2进行喷砂处理之后，中间体4的喷砂表面5经受从电子束，激光和等离子体工艺中选出的高能量处理。 电子束过程的应用，例如 熔化，然后在短时间内通过喷砂在中间体4的表面5上形成大量尖锐的凹陷6和大量的凸起7，使表面5固化，从而得到具有平缓起伏的材料9， 在表面10上存在大量温和的槽11和大量温和的波峰12的下降。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2010097135A
公开(公告)日：2010-04-30
申请号：JP2008269969
申请日：2008-10-20
Applicant: Ritsumeikan , Towa Corp , Towa株式会社 , 学校法人立命館
Inventor： AMAYA SATOSHI , SUGIYAMA SUSUMU , DAO VIET DZUNG
Abstract: PROBLEM TO BE SOLVED: To provide an actuator which is manufactured by a simple manufacturing method, less deviating laterally, and having a long life.
SOLUTION: The actuator 1 has a base 2 and a microstructure 3 fixed to the base 2. Further, it has a first and second supports 4, 5 both facing the microstructure 3, a turn plate 7 connected to the first supports 4 through V-shaped elastic joints 6 in a manner free to turn and floating on the base 2, comb-shaped movable electrode groups 11 provided at the edges of the turn plate 7, fixed sections 9 connected to the second supports 5 through spring sections 8 and fixed to the base 2, comb-shaped electrode groups 10 provided at the edges of fixed sections 9 and engaging with the movable electrode groups 11, and positioning sections 14 positioning the base 2 and the microstructure 3. The fixed sections 9 including fixed electrode groups 10 are thinner than the second supports 5, moved to the location lower than the turn plate 7 having the movable electrode groups 11 by its own weight and deformation of the spring sections 8 and are fixed to the base 2. The movable electrode groups 11 are located higher than the fixed electrode groups 10.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种通过简单的制造方法制造的致动器，在侧向偏移较少并且具有长的使用寿命。 解决方案：致动器1具有固定在基座2上的底座2和微结构3。此外，它具有面向微结构3的第一和第二支撑件4,5，与第一支撑件4连接的转板7 通过V形弹性接头6以能够转动和浮动在基座2上的方式，设置在转板7的边缘处的梳形可动电极组11，通过弹簧部分8连接到第二支撑件5的固定部分9 固定在基座2上，设置在固定部9的边缘并与可动电极组11接合的梳状电极组10以及定位基座2和微结构3的定位部14.固定部9包括固定电极 组10比第二支撑件5薄，通过其自重和弹簧部分8的变形而移动到具有可移动电极组11的转板7的位置下方并且固定到基座2上。可动电极组11 AR e高于固定电极组10.版权所有（C）2010，JPO＆INPIT
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