Corrugated membrane MEMS actuator fabrication method
    232.
    发明授权
    Corrugated membrane MEMS actuator fabrication method 有权
    波纹膜MEMS致动器制造方法

    公开(公告)号:US08835195B2

    公开(公告)日:2014-09-16

    申请号:US13552721

    申请日:2012-07-19

    Abstract: A MEMS device fabrication method includes providing a substrate and a chamber wall material layer on a first surface of the substrate, the chamber wall material layer including a chamber cavity having a sacrificial material located therein. A mask material is deposited on the chamber wall material layer and the sacrificial material and patterned to form a mask pattern including a plurality of discrete portions. The mask material and some of the sacrificial material are removed to transfer the mask pattern including the plurality of discrete portions to the sacrificial material. A membrane material layer is deposited on the chamber wall material layer and the sacrificial material that includes the transferred mask pattern including the plurality of discrete portions. Some of the substrate and the sacrificial material are removed to release the membrane material layer using at least one process initiated from a second surface of the substrate.

    Abstract translation: MEMS器件制造方法包括在衬底的第一表面上提供衬底和室壁材料层,室壁材料层包括具有位于其中的牺牲材料的腔室腔。 掩模材料沉积在室壁材料层和牺牲材料上并被图案化以形成包括多个离散部分的掩模图案。 去除掩模材料和一些牺牲材料以将包括多个离散部分的掩模图案转移到牺牲材料。 膜材料层沉积在室壁材料层和牺牲材料上,该牺牲材料包括包含多个离散部分的转印掩模图案。 使用从衬底的第二表面引发的至少一种工艺,去除一些衬底和牺牲材料以释放膜材料层。

    Electromechanical transducer device and method of forming a electromechanical transducer device
    233.
    发明授权
    Electromechanical transducer device and method of forming a electromechanical transducer device 有权
    机电换能器装置及形成机电换能装置的方法

    公开(公告)号:US08445978B2

    公开(公告)日:2013-05-21

    申请号:US13128035

    申请日:2009-11-25

    CPC classification number: B81B3/0072 B81B2201/032 H01L41/0933 H01L41/094

    Abstract: A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.

    Abstract translation: 形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构,其被布置成响应于致动结构的致动而是可移动的。 可移动结构包括机械结构,其包括具有第一热响应特性和第一机械应力响应特性的至少一个机械层,所述致动结构的至少一层,所述至少一层具有与 第一热响应特性和与第一机械应力响应特性不同的第二机械应力响应特性,具有第三热响应特性和第三机械应力特性的第一补偿层,以及具有第四热响应特性的第二补偿层和 第四机械应力响应特性。 第一和第二补偿层布置成补偿由机械结构和致动结构的至少一个层的不同的第一和第二热响应特性产生的热效应,使得可移动结构的移动基本上与 并且调节由所述机械结构和所述致动结构的所述至少一个层的不同的第一和第二应力响应特性产生的应力效应,使得当所述机电换能器装置 处于非活动状态。

    FABRICATION OF ROBUST ELECTROTHERMAL MEMS WITH FAST THERMAL RESPONSE
    234.
    发明申请
    FABRICATION OF ROBUST ELECTROTHERMAL MEMS WITH FAST THERMAL RESPONSE 有权
    制造具有快速热响应的稳定电热MEMS

    公开(公告)号:US20120319226A1

    公开(公告)日:2012-12-20

    申请号:US13311693

    申请日:2011-12-06

    Abstract: Embodiments of the invention provide robust electrothermal MEMS with fast thermal response. In one embodiment, an electrothermal bimorph actuator is fabricated using aluminum as one bimorph layer and tungsten as the second bimorph layer. The heating element can be the aluminum or the tungsten, or a combination of aluminum and tungsten, thereby providing a resistive heater and reducing deposition steps. Polyimide can be used for thermal isolation of the bimorph actuator and the substrate. For MEMS micromirror designs, the polyimide can also be used for thermal isolation between the bimorph actuator and the micromirror.

    Abstract translation: 本发明的实施例提供了具有快速热响应的稳健的电热MEMS。 在一个实施例中,使用铝作为一个双晶片层和钨作为第二双晶片层制造电热双压电晶片致动器。 加热元件可以是铝或钨,或铝和钨的组合,从而提供电阻加热器并减少沉积步骤。 聚酰亚胺可用于双压电晶片致动器和基板的热隔离。 对于MEMS微镜设计,聚酰亚胺也可用于双压电晶片致动器和微镜之间的热隔离。

    METHOD FOR FABRICATING LATERAL-MOVING MICROMACHINED THERMAL BIMORPH
    236.
    发明申请
    METHOD FOR FABRICATING LATERAL-MOVING MICROMACHINED THERMAL BIMORPH 有权
    用于制备横向移动微孔板热二聚体的方法

    公开(公告)号:US20090219128A1

    公开(公告)日:2009-09-03

    申请号:US12357826

    申请日:2009-01-22

    Abstract: A method of making a Lateral-Moving Micromachined Thermal Bimorph which provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present invention employs a novel fabrication process to allow the fabrication of a lateral bimorph in a fundamentally planar set of processes. In addition, the invention incorporates special design features that allow the bimorph to maintain material interfaces.

    Abstract translation: 一种制造横向移动微机械加热双压电晶片的方法,其提供了在微芯片上实现面内热感应运动的能力,而不是在许多器件中看到的更常见的平面外或垂直运动。 本发明采用新颖的制造工艺,以允许在基本平面的工艺集合中制造横向双压电晶片。 此外,本发明还包含允许双压电晶体保持材料界面的特殊设计特征。

    Micromechanical Actuators Comprising Semiconductors on a Group III Nitride Basis
    237.
    发明申请
    Micromechanical Actuators Comprising Semiconductors on a Group III Nitride Basis 有权
    包含第III组氮化物基础上的半导体的微机械致动器

    公开(公告)号:US20090174014A1

    公开(公告)日:2009-07-09

    申请号:US12300831

    申请日:2007-05-16

    Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

    Abstract translation: 半导体致动器包括基板,弯曲结构,其连接到基板基底并且可相对于基板基底至少部分地偏转。 该弯曲结构基于主要III族元素的氮化物和至少两个给弯曲结构施加电压或施加电压的电流的电源触点而具有半导体化合物。 至少两个电源触点分别设置在弯曲结构上和/或与后者集成在一起的彼此间隔开。

    Actuator and method of manufacturing actuator module

    公开(公告)号:US07449817B2

    公开(公告)日:2008-11-11

    申请号:US11604688

    申请日:2006-11-28

    Abstract: An object of the present invention is to provide a thin and light-weight actuator module structure comprising a multi-layer structure such as a bimorph or unimorph structure that can be formed in an arbitrary shape and deformed in an arbitrary direction, which is high in safety and durability and can be easily fabricated, as well as a method of manufacturing the same.An actuator has a structure such that a striped internal stress distribution is induced within a plane of a bending type actuator of a laminate structure, thereby allowing the actuator to bend so as to constitute a part of a cylindrical shape whose central axis is parallel to the striped direction.

    Mechanical Structure Including a Layer of Polymerised Liquid Crystal and Method of Manufacturing Such
    239.
    发明申请
    Mechanical Structure Including a Layer of Polymerised Liquid Crystal and Method of Manufacturing Such 有权
    包含聚合液晶层的机械结构及其制造方法

    公开(公告)号:US20080259253A1

    公开(公告)日:2008-10-23

    申请号:US10597569

    申请日:2005-01-27

    Abstract: A mechanical structure comprises an element which is moveable by nonmechanical means, such as heat or radiation, between a first state having a first shape and a second state having a second shape different. To this end, the element includes a layer of oriented polymerized liquid crystal which exhibits an anisotropic expansion when subjected to such means. In order to facilitate manufacture the element is positioned on a substrate which has a region of high adhesiveness and a region of low adhesiveness for polymerized liquid crystal. To manufacture such structures a layer of oriented polymerizable liquid crystal is formed on a substrate (201) which is provided with a patterned surface that provides adhesive regions (204) with high adhesiveness to polymerized liquid crystal and nonadhesive regions (203) with low adhesiveness to polymerized liquid crystal. After polymerization, for example a thermal shock is applied which causes the layer of polymerized liquid crystal to delaminate at the non-adhering region while remaining fixed to the adhesive regions. Thus, the method does not require time-consuming under-etching steps.

    Abstract translation: 机械结构包括可在诸如热或辐射之间的非机械装置在具有第一形状的第一状态和具有第二形状的第二状态之间移动的元件。 为此,元件包括定向聚合的液晶层,当经受这种方法时,其呈现各向异性膨胀。 为了便于制造,元件位于具有高粘合性区域的基底和聚合液晶的低粘合性区域。 为了制造这样的结构,在基板(201)上形成定向聚合性液晶层,该基板(201)设置有图案化表面,该图案表面向聚合液晶和非粘合区域(203)提供对粘合性高的粘合性区域(204) 聚合液晶。 聚合后,例如进行热冲击,使得聚合液晶层在非粘附区域分层,同时保持固定在粘合剂区域上。 因此,该方法不需要耗时的蚀刻下步骤。

    Process for manufacturing a microsystem
    240.
    发明授权
    Process for manufacturing a microsystem 失效
    微系统制造工艺

    公开(公告)号:US07356913B2

    公开(公告)日:2008-04-15

    申请号:US10949800

    申请日:2004-09-24

    Applicant: Yves Fouillet

    Inventor: Yves Fouillet

    Abstract: A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element attached, at opposite ends, to the substrate so that there is a natural deflection without stress with respect to a surface of the substrate opposite it, this natural deflection determining the first state of functioning, the second state of functioning being caused by the thermal sensor which, under the influence of temperature variation, induces a deformation of the deformable element which diminishes the deflection by subjecting it to a compressive force which shifts it in a direction opposite to its natural deflection by buckling.

    Abstract translation: 一种制造微型开关或微型阀的方法,由基板组成,用于通过双金属效应热传感器在第一功能状态和第二功能状态之间移动。 该传感器包括一可变形元件,该可变形元件在相对端附接到基底,使得相对于与其相反的基底的表面存在无应力的自然变形,该自然偏转确定第一功能状态,第二功能状态 由热传感器引起,其在温度变化的影响下引起可变形元件的变形,该变形元件通过使其具有通过弯曲而在与其自然偏转相反的方向上移动它的压缩力而减小偏转。

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