Abstract:
A fluorescence detection device includes: a light source that emits excitation light in a first direction; a base unit (30) to which the light source is attached; an opening (30a) that is provided on a side in the first direction of the base unit (30) with respect to the light source; a cantilever (31) that is cantilevered to the base unit (30) to extend from an inner edge of the opening (30a) toward a center side of the opening (30a); an optical path conversion unit (20) that is fixed to a free end of the cantilever (31), converts a traveling direction of the excitation light emitted from the light source into a second direction different from the first direction, and irradiates a measurement object with the excitation light turned in the second direction; and a photodetection element that is disposed on a side of the opening (30a) opposite to the measurement object and detects fluorescence passing through the opening (30a) in fluorescence emitted from the measurement object irradiated with the excitation light. Accordingly, a loss in the fluorescence guided to the photodetection element can be reduced, and thus fluorescence detection efficiency can be improved.
Abstract:
A detection system based on modulation of line structured laser image of glass comprises processing section (2), control system, and roller conveying mechanisms (5). Detection mechanism (6) provided over entrance of the processing section (201) comprises shell and camera (602) with laser (601) which emits beam on the surface of the glass in the gap between sliding rollers. Focal plane of the camera (602) corresponds to the beam irradiation surface, and signal output terminal of the camera (602) is connected with the control system in such a way that when glass passes the detection area, laser irradiates the glass surface and the line structured laser is modulated based on the glass to form laser modulation image with distribution of light and shade, staggered movement direction, or distorted laser lines. The camera (602) will transmit the captured glass information and parameters to the control system. In the system, the detection mechanism (6), with integral design and compact structure, can be easily fitted over the entrance of the processing section (201), has strong adaptation to other processing means, has no special requirements on incident angle of light and angle of detection surface during detection, and obtains highly accurate data through measurement.
Abstract:
Even when the distance from an objective lens to a sample differs, the distribution of light from the sample can be detected accurately.A first lens 23 for converting light from the objective lens into parallel light is composed of a concave lens part 32 having a concave curved face 32c in a center portion of a flat face 32a, and a convex lens part 33 having a convex curved face 33c around a flat face 33b. Further, the first lens 23 includes first and second regions for diverging light through the flat face 33b and the concave curved face 32c and a third region for collecting light through the convex curved face 33c and the concave curved face 32c. When the sample is placed on a sample table while being sealed in a two-dimensional electrophoresis substrate, light totally reflected by a side surface of the objective lens is caused to enter the second region. In contrast, when the sample is directly placed on the sample table, the light is caused to enter the third region. As a result, in any of the cases, the rays of light d emitted from the first lens 23 are nearly parallel to one another, and are nearly parallel to the optical axis.
Abstract:
The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.
Abstract:
A surface inspecting apparatus rotates a semiconductor wafer 100 (inspection object) as a main scan while translating the semiconductor wafer 100 as an auxiliary scan, illuminates the surface of the semiconductor wafer 100 with illuminating light 21, thereby forms an illumination spot 3 as the illumination area of the illuminating light 21, detects scattered or diffracted or reflected light from the illumination spot, and detects a foreign object existing on the surface of the semiconductor wafer 100 or in a part of the semiconductor wafer 100 in the vicinity of the surface based on the result of the detection. In the surface inspecting apparatus, the translation speed of the auxiliary scan is controlled according to the distance from the rotation center of the semiconductor wafer 100 in the main scan to the illumination spot. With this control, the inspection time can be shortened while the deterioration in the detection sensitivity and the increase in the thermal damage during the surface inspection are suppressed.
Abstract:
There is provided an optical measuring device including: plural light-receiving units; a frame to which the respective light-receiving units are mounted on a same circumference whose axial center is a predetermined position, with optical axes of the light-receiving units being directed toward the axial center, an object of measurement being disposed at an axially central portion of the circumference; a measuring section that outputs measured values corresponding to received light amounts; a reference sample disposed, instead of the object of measurement, at the axially central portion of the circumference such that a longitudinal direction of the reference sample runs along an axis of the circumference; a reference light source that illuminates light of the predetermined wavelength toward the reference sample; and a calibrating section that calibrates the sensitivities of the plural light-receiving units at a time of measuring the object of measurement.
Abstract:
The invention provides a laser microarray scanner for microarray scanning, comprising an optical system, a scanning platform, and a data processing system. During scanning, the optical system remains fixed, and the microarray placed on the scanning platform moves relative to the optical system. The microarray scanner disclosed herein has high scanning speed, high sensitivity, high resolution, and high signal-to-noise ratio, thus is ideal for use in microarray scanning
Abstract:
An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.
Abstract:
A method and apparatus is disclosed for multi-mode spectral imaging. In one embodiment, the present invention comprises the steps of illuminating an object with a modified illumination profile, producing a reflected, transmitted or fluorescence image of the illuminated object, scanning the object, and re-imaging the reflected, transmitted or fluorescence light after modifying the light's optical state. The present invention preferably works in conjunction with other imaging systems to provide both high-spectral resolution images with lower temporal resolution and multiple image acquisition with high temporal resolution.
Abstract:
A non-destructive method is provided for determining amount and distribution of a corrosion product on a metallic substrate. A value of infrared energy reflected from the metallic substrate without corrosion is determined. A value of infrared energy reflected from the metallic substrate with the corrosion product is determined. A value of infrared energy absorbed in the corrosion product is determined, and the value of the infrared energy absorbed in the corrosion product is correlated to an amount of the corrosion product.