公开(公告)号：US20230273024A1

公开(公告)日：2023-08-31

申请号：US18136088

申请日：2023-04-18

Applicant: STMicroelectronics, Inc.

Inventor： Deyou FANG ,  Chao-Ming TSAI ,  Milad ALWARDI ,  Yamu HU ,  David MCCLURE

IPC: G01C19/5726 ,  G01C25/00 ,  G01C19/5733

CPC classification number: G01C19/5726 ,  G01C19/5733 ,  G01C25/005

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

公开(公告)号：US11664415B2

公开(公告)日：2023-05-30

申请号：US17373586

申请日：2021-07-12

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. Zhang

IPC: H01L21/02 ,  H01L21/28 ,  H01L49/02 ,  H01L27/108 ,  H01L27/11507

CPC classification number: H01L28/56 ,  H01L21/02197 ,  H01L27/108 ,  H01L27/10805 ,  H01L27/10844 ,  H01L27/11507 ,  H01L28/55 ,  H01L28/60 ,  H01L28/65 ,  H01L29/40111

Abstract: An interconnect structure for use in coupling transistors in an integrated circuit is disclosed, including various configurations in which ferroelectric capacitors exhibiting negative capacitance are coupled in series with dielectric capacitors. In one embodiment, the negative capacitor includes a dielectric/ferroelectric bi-layer. When a negative capacitor is electrically coupled in series with a conventional dielectric capacitor, the series combination behaves like a stable ferroelectric capacitor for which the overall capacitance can be measured experimentally, and tuned to a desired value. The composite capacitance of a dielectric capacitor and a ferroelectric capacitor having negative capacitance coupled in series is, in theory, infinite, and in practice, very large. A series combination of positive and negative capacitors within a microelectronic interconnect structure can be used to make high capacity DRAM memory cells.

公开(公告)号：US11664239B2

公开(公告)日：2023-05-30

申请号：US17317818

申请日：2021-05-11

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Talledo

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/562 ,  H01L24/29

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US11657846B1

公开(公告)日：2023-05-23

申请号：US17710608

申请日：2022-03-31

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Enrico Mammei ,  Paolo Sanna ,  Dennis Hogg ,  Edoardo Contini

IPC: G11B20/10

CPC classification number: G11B20/10027

Abstract: A method to determine a relative delay between a current-overshoot signal and a write data signal for a hard disk drive preamplifier, the method including using a memory element to strobe a test current-overshoot signal with a test data signal; counting a number of strobed transitions of the test current-overshoot signal; adjusting the delay based on the number of strobed transitions; setting a phase difference between the current-overshoot signal and the write data signal according to the delay; and using the memory element to strobe the current-overshoot signal with the write data signal.

公开(公告)号：US20230079355A1

公开(公告)日：2023-03-16

申请号：US17987280

申请日：2022-11-15

Applicant: STMicroelectronics SA ,  STMicroelectronics, Inc. ,  STMicroelectronics (Research & Development) Limited

Inventor： Darin K. Winterton ,  Donald Baxter ,  Andrew Hodgson ,  Gordon Lunn ,  Olivier Pothier ,  Kalyan-Kumar Vadlamudi-Reddy

IPC: H04N5/232

Abstract: A method includes dividing a field of view into a plurality of zones and sampling the field of view to generate a photon count for each zone of the plurality of zones, identifying a focal sector of the field of view and analyzing each zone to select a final focal object from a first prospective focal object and a second prospective focal object.

公开(公告)号：US20230018529A1

公开(公告)日：2023-01-19

申请号：US17948961

申请日：2022-09-20

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. ZHANG

IPC: H01L29/51 ,  H01L21/02 ,  H01L21/28 ,  H01L29/45 ,  H01L29/49 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/285 ,  H01L21/768 ,  C23C14/04 ,  C23C14/22

Abstract: Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

公开(公告)号：US11552007B2

公开(公告)日：2023-01-10

申请号：US17185742

申请日：2021-02-25

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Aiza Marie Agudon ,  Jefferson Talledo ,  Moonlord Manalo ,  Ela Mia Cadag ,  Rammil Seguido

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

公开(公告)号：US20220333912A1

公开(公告)日：2022-10-20

申请号：US17856586

申请日：2022-07-01

Applicant: STMICROELECTRONICS, INC.

Inventor： Arnaud DELEULE ,  John E. KVAM ,  Kalyan-Kumar VADLAMUDI-REDDY

IPC: G01B11/02 ,  G01C3/02 ,  H04N5/232 ,  G06T7/521 ,  G01S17/00 ,  G01S17/89 ,  G06V40/16

Abstract: The present disclosure is directed to a system and method of controlling a facial recognition process by validating preconditions with a ranging sensor. The ranging sensor transmits a ranging signal that is reflected off of a user's face and received back at the ranging sensor. The received ranging signal can be used to determine distance between the user's face and the mobile device or to determine the reflectivity of the user's face. Comparing the distance to a range of distances corresponding to normal operation of the device or normal reflectivities associated with human skin tones can reduce the number of false positive activations of the facial recognition process. Furthermore, a multiple zone ranging sensor can produce a face depth map that can be compared to a stored face depth map or can produce a reflectivity map that can be compared to a stored face reflectivity map to further increase power efficiency and device security.

公开(公告)号：US20220237259A1

公开(公告)日：2022-07-28

申请号：US17161291

申请日：2021-01-28

Applicant: STMicroelectronics, Inc.

Inventor： Andrea Lorenzo Vitali

IPC: G06F17/14

Abstract: A method of operating a microcontroller to perform a Fast Fourier Transform, the method including receiving, by the microcontroller, N samples from a signal; and performing, by the microcontroller, a first butterfly operation of the Fast Fourier Transform before all of the N samples have been received from the signal, based on the performing of the first butterfly operation, the microcontroller performs the Fast Fourier Transform at a higher performance to power efficiency than a Fast Fourier Transform operation that begins after all of the N samples are received.

公开(公告)号：US11355423B2

公开(公告)日：2022-06-07

申请号：US16584405

申请日：2019-09-26

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron Cadag ,  Frederick Arellano ,  Ernesto Antilano, Jr.

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  B81B7/00 ,  B81C1/00

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.