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公开(公告)号：JP2010017858A
公开(公告)日：2010-01-28
申请号：JP2008177665
申请日：2008-07-08
Inventor： URAGAMI HIROSHI , AMAKAWA TAKESHI , TAKAHASHI MASANOBU
Abstract: PROBLEM TO BE SOLVED: To provide a resin molding device capable of keeping the parallelism of molding molds, which are opposed to each other, excellently.
SOLUTION: The resin molding device 1 includes a base table 2, a fixing plate 3 opposed to the base table 2, four guide members 4 for connecting the base table 2 to the fixing plate 3, a movable plate 5 provided to freely slide on each guide part 4, a driving mechanism 6 provided between the base table 2 and the movable plate 5 and for moving the movable plate 5 back and forth, an upper mold 14 fixed to the fixing plate 3 and a lower mold 15 fixed to the movable plate 5, a cavity 16 provided in the lower mold 15, a dispenser 17 for ejecting the flowable resin to the cavity 16, rack and pinion mechanisms 9 provided two on the side surface of each guide member 4, a rotary shaft 11 for connecting pinions 8 provided in each of the adjacent rack and pinion mechanisms 9 to each other and a bearing 12 for attaching a rotary shaft 11 to the movable plate 5. A rack 7 of each rack and pinion mechanism 9 is integrally provided on the guide member 4 along the same plane as that of the rack 7 of the adjacent rack and pinion mechanism 9.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供能够保持彼此相对的成型模具的平行性的树脂成型装置。 解决方案：树脂模制装置1包括基台2，与基台2相对的固定板3，用于将基台2连接到固定板3的四个引导构件4，自由地设置的可动板5 在每个引导部分4上滑动，设置在基台2和可移动板5之间并且用于使可动板5前后移动的驱动机构6，固定到固定板3的上模具14和固定到 可移动板5，设置在下模15中的空腔16，用于将可流动树脂喷射到空腔16的分配器17，设置在每个引导构件4的侧表面上的齿条和小齿轮机构9，用于 每个相邻的齿条齿轮机构9中设置的连接小齿轮8彼此相连，以及用于将旋转轴11附接到可动板5的轴承12.每个齿条齿轮机构9的齿条7一体地设置在引导构件 4沿着与机架7相同的平面 相邻齿条齿轮机构9.版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2010010506A
公开(公告)日：2010-01-14
申请号：JP2008169786
申请日：2008-06-30
Inventor： IWATA YASUHIRO
IPC: H01L21/50
CPC classification number: H01L21/67271 , H01L21/67144 , H01L24/97 , H01L2924/01004 , H01L2924/14 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To efficiently produce packages 4 by efficiently and excellently setting an array state of trays 5 containing cut substrates 3 (individual packages 4) formed by cutting a molded substrate 2 by a cutting apparatus 1 for the substrate. SOLUTION: In a package storage unit D of the cutting device 1 for the substrate, tray placing members 27 (tray placing means 19) placed with trays 5 are revolved individually in one way and a tray 6 (7) stored with packages 4 is moved from a package storage position 15 to a stored tray placing position 34 in an annular movement area 37 including an upper-end movement area 36 and a lower-end movement area 35 where the tray placing members 27 placed with the trays 5 are moved. At the same time, a standby tray 5 detected at a tray detection position 16 is moved to the package storing position 15. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：通过有效地并且极好地设置包含通过用于基板的切割装置1切割模制基板2而形成的切割基板3（单独的封装4）的托盘5的阵列状态来有效地生产封装4。 解决方案：在用于基板的切割装置1的包装存储单元D中，放置有托盘5的托盘放置构件27（托盘放置装置19）以单向方式单独旋转，托盘6（7）以包装 4从包装存储位置15移动到存储的托盘放置位置34到包括上部移动区域36和下端移动区域35的环形移动区域37中，托盘放置构件27放置在托盘5中的是 移动。 同时，在托盘检测位置16处检测到的备用托盘5移动到包装存储位置15.（C）2010，JPO＆INPIT
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244.发明专利
公开(公告)号：JP2009302323A
公开(公告)日：2009-12-24
申请号：JP2008155555
申请日：2008-06-13
Inventor： AZUMA HIDEKAZU , MORISAWA TADASHI
IPC: H01L21/56
CPC classification number: H01L21/561 , H01L24/97
Abstract: PROBLEM TO BE SOLVED: To provide a separating device for separating a sealed substrate to manufacture electronic components, wherein assembly, alteration, extension, and removal of an separating part are attained in a short period of time according to requirement specifications of users. SOLUTION: The separating device S1 for electronic component includes a reception part A, separating parts B1 and B2, and a delivery part C. The separating parts B1 and B2 each have a cutting mechanism and a rotary blade 7, and are provided detachably for the separating parts B1 and B2 and reception portions A and delivery parts C as other components, According to user's requirement specifications, they are suitably selected and assembled, altered, extended, or removed. The cutting mechanisms that the separating parts B1 and B2 have each includes a rotary blade 7, a water jet, laser light, a wire saw, or a hand saw. The cutting mechanisms of the separating parts B1 and B2 may be different in type. For example, the cutting mechanism of the separating part B1 may be a water jet and the cutting mechanism of the separating part B2 may be a rotary blade 7. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供用于分离密封基板以制造电子部件的分离装置，其中根据用户的要求规格在短时间内获得分离部件的组装，改变，延伸和移除 。 解决方案：用于电子部件的分离装置S1包括接收部分A，分离部分B1和B2以及传送部分C.分离部分B1和B2各自具有切割机构和旋转叶片7，并且设置 可分离部分B1和B2以及接收部分A和传送部分C作为其他部件。根据用户要求规格，它们被适当地选择和组装，改变，扩展或移除。 分离部分B1和B2各自包括旋转叶片7，水射流，激光，线锯或手锯的切割机构。 分离部分B1和B2的切割机构的类型可以不同。 例如，分离部B1的切断机构可以是水射流，分离部分B2的切割机构可以是旋转叶片7.版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009266850A
公开(公告)日：2009-11-12
申请号：JP2008110827
申请日：2008-04-22
Inventor： YAMAJI SHUZO , AZUMA HIDEKAZU
IPC: H01L21/301
Abstract: PROBLEM TO BE SOLVED: To efficiently and smoothly move two cutting mechanisms 28 and 29 in a cutting device 9 for substrate by guide members 43 and 50 (individually).
SOLUTION: The two cutting mechanisms 28 and 29 for cutting a substrate 1 after formation are provided, and the guide members which guides the cutting mechanisms 28 and 29 are individually provided corresponding to the two cutting mechanisms 28 and 29. When the substrate 1 after formation, which is mounted on cutting tables 17 (17a, 17b), is cut, ball screw mechanisms 46 and 53 guide and move the two cutting mechanisms 28 and 29 individually along the guide members 43 and 50; and in a state in which the interval between blades 47 and 54 provided individually to the two cutting mechanisms 28 and 29 is set to a necessary interval 60, the substrate 1 after formation is cut along cutting lines 4 to form cut substrates 1c (individual packages 5).
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：通过引导构件43和50（单独地）有效地并且平稳地将用于基板的切割装置9中的两个切割机构28和29移动。 解决方案：设置用于在形成之后切割基板1的两个切割机构28和29，并且引导切割机构28和29的引导部件对应于两个切割机构28和29分别设置。当基板 导向构件43和50分别引导并移动两个切割机构28和29，其中，安装在切割台17（17a，17b）上的一个成形装置被切割，滚珠丝杠机构46和53引导并移动两个切割机构28和29。 并且在分别设置到两个切割机构28和29的叶片47和54之间的间隔被设定为必要间隔60的状态下，沿着切割线4切割成形后的基板1，以形成切割基板1c（单独的包装 5）。 版权所有（C）2010，JPO＆INPIT
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Patent Agency Ranking246.发明专利Low-adhesive material and its manufacturing method, molding mold and its manufacturing method, antifouling material and its manufacturing method 有权低粘度材料及其制造方法，成型模具及其制造方法，防爆材料及其制造方法
公开(公告)号：JP2009226775A
公开(公告)日：2009-10-08
申请号：JP2008075781
申请日：2008-03-24
Applicant: Japan Fine Ceramics Center , Towa Corp , Towa株式会社 , 財団法人ファインセラミックスセンター
Inventor： KUNO KOKI , AZUMA DAISUKE , KISHIMOTO TOMOKO , NOGUCHI YOSHINORI , FUJIWARA KUNIHIKO , KITAOKA SATOSHI , KAWASHIMA NAOKI , NAKAHIRA KENJI
IPC: B29C33/38
Abstract: PROBLEM TO BE SOLVED: To provide a low-adhesive material having low adhesion to a substance with basicity or thermosetting resin, a molding mold having high mold releasability, and an antifouling material having antifouling property against smudge with basicity or smudge comprising thermosetting resin.
SOLUTION: The molding mold 8 which is used for forming curable resin 14, 15 by setting fluid resin 13 with basicity is composed of a low adhesive material 7 having low adhesion to a substance with basicity or thermosetting resin. The low-adhesive material 7 has a base material 3 composed of Y
2 O
3 and a functional layer 9 provided near the surface of that base material 3 and containing nitrogen, and is manufactured by making nitrogen contained near the surface of the base material 3 using an ion implantation method. The content of the nitrogen is in excess of 10
18 atoms/cm
3 and less than 10
22 atoms/cm
3 .
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：为了提供对具有碱性或热固性树脂的物质具有低粘合性的低粘合性材料，具有高脱模性的成型模具和具有抗碱性或污迹的防污性的防污材料，其包含热固性 树脂。 解决方案：通过将流体树脂13设定为碱性而形成固化性树脂14,15的成型用模具8由对具有碱性的物质或热固性树脂具有低粘附性的低粘合剂材料7组成。 低粘性材料7具有由Y 2 SB 3 O 3 / SB 3构成的基材3和在该基材3的表面附近设置且含有氮的功能层9， 是通过使用离子注入法在基材3的表面附近包含氮而制造的。 氮的含量超过10原子/ cm 3，而小于10原子/ cm 3 / SP>。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009226474A
公开(公告)日：2009-10-08
申请号：JP2008078094
申请日：2008-03-25
Applicant: Okayama Univ , Towa Corp , Towa株式会社 , 国立大学法人 岡山大学
Inventor： KITADA RYOJI , UNO YOSHIYUKI , OKAMOTO YASUHIRO , DOI HIROYUKI , HARAGUCHI SHIN
Abstract: PROBLEM TO BE SOLVED: To improve appearance quality of an article after processing when processing a workpiece by irradiating laser beam to the workpiece.
SOLUTION: A resin sealing body 1 is cut by irradiating the resin sealing body 1 with the laser beam 15 generated by a laser beam generating means 8 comprising a fiber laser oscillator. Low temperature gas 28 is supplied as assist gas. The laser beam 15 is irradiated toward a part 21 to be irradiated while jetting the low temperature gas 28 standardized with the assist gas toward the part 21 to be irradiated, so that the effect of cooling the part 21 to be irradiated is increased. Accordingly, the effect of suppressing roughing, burning or the like of a surface to be processed due to heat influence is increased. Moisture condensation preventing gas 30 is supplied to a space 31 arranged closer to the laser beam generating means 8 than a part through which the low temperature gas 28 flows, so that generation of moisture condensation in an optical system 9 is prevented.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：通过将激光束照射到工件来处理工件时，通过加工后改善制品的外观质量。 解决方案：通过用包括光纤激光振荡器的激光束产生装置8产生的激光束15照射树脂密封体1来切割树脂密封体1。 作为辅助气体供给低温气体28。 向被照射的部分21照射激光束15，同时向被照射的部分21喷射由辅助气体标准化的低温气体28，从而提高对被照射部21的冷却效果。 因此，由于热影响而抑制待加工表面的粗加工，燃烧等的效果增加。 防潮凝结气体30被供给到比低温气体28流过的部分更靠近激光束产生装置8的空间31，从而防止在光学系统9中产生湿气冷凝。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP4336499B2
公开(公告)日：2009-09-30
申请号：JP2003002949
申请日：2003-01-09
Applicant: Towa株式会社
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
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公开(公告)号：JP2009202311A
公开(公告)日：2009-09-10
申请号：JP2008049048
申请日：2008-02-29
Inventor： YAMAMOTO MASAYUKI , NAKAGAWARA SHUJI , NAKAMOTO YOKO , AZUMA HIDEKAZU , NAKAJIMA SHINYA
CPC classification number: B24B55/06 , B23Q11/005 , B28D5/0076
Abstract: PROBLEM TO BE SOLVED: To prevent a swarf generated by cutting a material to be cut from sticking on an article which has been cut. SOLUTION: A plurality of grooves 13, 14 each superposed on boundary lines 4 of plural grid-like areas 5 arranged on a resin sealing body 1 are disposed on an upper surface of a suction jig 6 to which the resin sealing body 1 to be the material to be cut is sucked. When a rotary blade 17 cuts the resin sealing body 1 at a line 20 to be cut, the circumferential end of the rotary blade 17 is stored in a groove 21 of a cutting part superposed on the line 20 to be cut. Cleaning liquid 23 is injected from a nozzle 22 for cleaning water at the front of the suction jig 6 toward the groove 21 of the cutting part in the extending direction of the groove 21 of the cutting part that is also the discharging direction (-Y direction) of the swarf. The cleaning liquid 23 is injected from another nozzle 24 for the cleaning water at the front of the suction jig 6 toward a groove 26 superposed on a boundary line 25 which is cut immediately before the line 20 to be cut in the -Y direction. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了防止通过切割要切割的材料而产生的切屑粘附在已经被切割的物品上。 解决方案：叠置在布置在树脂密封体1上的多个格子状区域5的边界线4上的多个槽13,14设置在吸附夹具6的上表面上，树脂密封体1 要被切割的材料被吸。 当旋转叶片17将切割线20切割树脂密封体1时，旋转叶片17的周向端部被存储在重叠在待切割线20上的切割部分的凹槽21中。 清洗液23从吸附夹具6的前方的清洗用喷嘴22向切割部的槽21沿着也是排出方向（-Y方向）的切断部的槽21的延伸方向喷出 ）的切屑。 清洗液23从吸引夹具6的前方的清洗用水的另一个喷嘴24朝着重叠在边界线25上的凹槽26喷射，该边界线25在紧接在-Y方向上被切割的线20之前被切割。 版权所有（C）2009，JPO＆INPIT
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