公开(公告)号：JP2010087193A

公开(公告)日：2010-04-15

申请号：JP2008254042

申请日：2008-09-30

Applicant: Towa Corp ,  Towa株式会社

Inventor： MORISAWA TADASHI

IPC: H01L21/301

Abstract: PROBLEM TO BE SOLVED: To provide a segmenting device efficiently segmenting a sealed substrate and small in an installation area. SOLUTION: A cutting module 1 is provided with: turning mechanisms 3L, 3R movable in the Y-direction by moving mechanisms for tables 2L, 2R and eccentrically turning, respectively; tables 4L, 4R fixed to the turning mechanisms 3L, 3R, respectively; rotation mechanisms 8L, 8R movable in the X-direction; and a plurality of rotation blades 10L, 10R mounted to the rotation mechanisms 8L, 8R, respectively. The plurality of rotation blades 10L, 10R cut resin sealing bodies 5L, 5R respectively fixed to the tables 4L, 4R along boundary lines 6, 7. The interval P of the boundary lines 6 along a short-side direction is equal to the interval of the rotation blades 10L, and the interval Q of the boundary lines 7 along a long-side direction is equal to the interval of the plurality of rotation blades 10R. The resin sealing body 5L (5R) is cut along the boundary line 6 by the rotation blade 10L, and cut along the boundary line 7 by the rotation blade 10R after the table 4L (4R) turns by -90° (+90°). COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种分段装置，有效地分割密封的基板并且在安装区域中小。 解决方案：切割模块1设置有：分别通过用于台2L，2R和偏心转动的移动机构在Y方向上移动的转动机构3L，3R; 台4L，4R分别固定在转动机构3L，3R上; 旋转机构8L，8R可沿X方向移动; 以及分别安装到旋转机构8L，8R的多个旋转叶片10L，10R。 多个旋转叶片10L，10R分别沿着边界线6,7分别固定在台面4L，4R上的树脂密封体5L，5R。边界线6沿短边方向的间隔P等于 沿着长边方向的旋转叶片10L和边界线7的间隔Q等于多个旋转叶片10R的间隔。 树脂密封体5L（5R）通过旋转叶片10L沿着边界线6切割，并且在台4L（4R）转动-90°（+ 90°）之后，通过旋转叶片10R沿边界线7切割， 。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009302323A

公开(公告)日：2009-12-24

申请号：JP2008155555

申请日：2008-06-13

Applicant: Towa Corp ,  Towa株式会社

Inventor： AZUMA HIDEKAZU ,  MORISAWA TADASHI

IPC: H01L21/56

CPC classification number: H01L21/561 ,  H01L24/97

Abstract: PROBLEM TO BE SOLVED: To provide a separating device for separating a sealed substrate to manufacture electronic components, wherein assembly, alteration, extension, and removal of an separating part are attained in a short period of time according to requirement specifications of users. SOLUTION: The separating device S1 for electronic component includes a reception part A, separating parts B1 and B2, and a delivery part C. The separating parts B1 and B2 each have a cutting mechanism and a rotary blade 7, and are provided detachably for the separating parts B1 and B2 and reception portions A and delivery parts C as other components, According to user's requirement specifications, they are suitably selected and assembled, altered, extended, or removed. The cutting mechanisms that the separating parts B1 and B2 have each includes a rotary blade 7, a water jet, laser light, a wire saw, or a hand saw. The cutting mechanisms of the separating parts B1 and B2 may be different in type. For example, the cutting mechanism of the separating part B1 may be a water jet and the cutting mechanism of the separating part B2 may be a rotary blade 7. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供用于分离密封基板以制造电子部件的分离装置，其中根据用户的要求规格在短时间内获得分离部件的组装，改变，延伸和移除 。 解决方案：用于电子部件的分离装置S1包括接收部分A，分离部分B1和B2以及传送部分C.分离部分B1和B2各自具有切割机构和旋转叶片7，并且设置 可分离部分B1和B2以及接收部分A和传送部分C作为其他部件。根据用户要求规格，它们被适当地选择和组装，改变，扩展或移除。 分离部分B1和B2各自包括旋转叶片7，水射流，激光，线锯或手锯的切割机构。 分离部分B1和B2的切割机构的类型可以不同。 例如，分离部B1的切断机构可以是水射流，分离部分B2的切割机构可以是旋转叶片7.版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009130342A

公开(公告)日：2009-06-11

申请号：JP2007307391

申请日：2007-11-28

Applicant: Towa Corp ,  Towa株式会社

Inventor： IWATA YASUHIRO ,  YAMAJI SHUZO ,  NAKAJIMA SHINYA ,  KASHIWAMURA JUNKO ,  MORISAWA TADASHI

IPC: H01L21/56 ,  H01L23/12

CPC classification number: G01N21/95 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a high quality and highly reliable product 5 when cutting a molded substrate 1 to form a package (product) 5, and to efficiently improve the productivity of the product 5.
SOLUTION: First, individual package 5 (1c) which is fastened by a first package fastening mechanism 11 is transferred to a package placement surface (upper surface) 12a of a reverse locking plate 12, and the reverse locking plate 12 is reversed to make the package placement surface 12a an lower surface side. Inspection is performed by a first inspection mechanism 13 from a lower position. Next, a first inspected package 5 (1c) on the reverse locking plate 12 is inherited and transferred to a package placement surface 14a of the placement plate 14, and the first inspected package 5 (1c) is inspected by a second inspection mechanism 15 from an upper position. Then, a second inspected package 5 (1c) is transferred to a placement table 17 at a package placement position 18a by a second package fastening mechanism 16.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了在切割模制基材1以形成包装（产品）5时提供高质量和高可靠性的产品5，并且有效地提高产品5的生产率。解决方案：首先 由第一包装紧固机构11紧固的单个包装5（1c）被转移到反向锁定板12的包装放置表面（上表面）12a，并且反向锁定板12反转以使包装放置表面 12a表示下表面。 通过第一检查机构13从较低位置进行检查。 接下来，逆向锁定板12上的第一被检查的包装5（1c）被继承并传送到放置板14的包装放置表面14a，并且第一检查包装5（1c）由第二检查机构15 上位 然后，第二被检查的包装5（1c）通过第二包装紧固机构16在包装放置位置18a被转移到放置台17.版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2005252114A

公开(公告)日：2005-09-15

申请号：JP2004063267

申请日：2004-03-05

Applicant: Towa Corp ,  Towa株式会社

Inventor： MORISAWA TADASHI ,  NITTA KAZUNORI ,  KAGEYAMA HIDEO ,  AZUMA HIDEKAZU

IPC: C09J7/00 ,  C09J5/00 ,  H01L21/52 ,  H01L21/68

CPC classification number: C09J5/00 ,  C09J7/00 ,  H01L21/52 ,  H01L21/68 ,  H01L24/743 ,  H01L2224/743 ,  H01L2924/14 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive tape sticking method capable of efficiently shortening operation time by quickly and accurately sticking an adhesive tape for die bonding to a prescribed position of a substrate. SOLUTION: On a first step in the sticking method, the temporary application processes of a sticking means 13 and an imaging means can be independently and approximately simultaneously performed by independently driving the sticking means 13 and the imaging means 14 which are used for temporarily applying an adhesive film 10 (individual piece 12) cut from an adhesive tape 3 to a prescribed position 2 on a substrate 1 in a state that the adhesive film 10 is stuck by the sticking means 13. On a second step, a peeling film 11 and an adhesive tape 17 which are used for removing the peeling film 11 from the adhesive film 10 by sticking the peeling film 11 to the adhesive tape 17 are individually colored so that one color is a complementary color to the other color. On a third step, a die bonding process for mounting a chip 40 on the film 10 stuck to the substrate 1 is performed continuously after the completion of a sticking process for leaving only the film 10 by removing the peeling film 11 from the substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 解决的问题：提供一种能够通过快速且准确地将用于芯片接合的胶带粘贴到基板的规定位置来有效缩短操作时间的粘合带粘贴方法。 解决方案：在粘贴方法的第一步骤中，粘贴装置13和成像装置的临时应用处理可以通过独立地驱动粘贴装置13和成像装置14独立地并且大致同时进行，所述粘贴装置13和成像装置14用于 在粘合膜10被粘贴装置13粘贴的状态下，将从粘合带3切割的粘合膜10（单独片12）临时施加到基板1上的规定位置2.在第二步骤中， 11和用于通过将剥离膜11粘贴到粘合带17上而从粘合膜10上除去剥离膜11的粘合带17被单独着色，使得一种颜色与另一种颜色互补。 在第三步骤中，在通过从基板1去除剥离膜11完成仅留下膜10的粘贴处理之后，连续地进行用于将芯片40安装在粘贴到基板1上的薄膜10上的芯片接合工艺。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003282612A

公开(公告)日：2003-10-03

申请号：JP2002081478

申请日：2002-03-22

Applicant: Towa Corp ,  Towa株式会社

Inventor： IWATA YASUHIRO ,  MORISAWA TADASHI

IPC: H01L21/56

Abstract: PROBLEM TO BE SOLVED: To cut a sealed substrate 1 formed by resin sealing at once surely and effectively by means of a cutting blade 13.
SOLUTION: At first, a sealed substrate 1 formed by resin sealing at once is sucked and fixed to an upper surface of a suction part 14 of a platform 9 with a resin molded item 3 side of the substrate 1 downward. The cutting blade 13 is brought into contact with the upper surface of a reference block 18 for setting a cutting blade reference board in the same plane as an upper surface of the suction part 14 of the platform 9, and a reference position is thereby set to the cutting blade 13. A required cutting amount 19 is set in a control mechanism and then the sealed substrate 1 is cut by the cutting blade 13 by the required cutting amount 19 along a cutting portion 4 set in the substrate 1. Thereby, the substrate 1 is cut and separated into each package 5.
COPYRIGHT: (C)2004,JPO

Abstract translation: 解决方案：通过切割刀片13可靠且有效地切割通过树脂密封形成的密封基板1。解决方案：首先，一次通过树脂密封形成的密封基板1是 在基板1的树脂成形品3侧向下方吸附固定在平台9的吸引部14的上表面。 切割刀片13与参考块18的上表面接触，用于将切割刀片参考板设置在与平台9的抽吸部分14的上表面相同的平面中，并且由此将基准位置设置为 切割刀片13.在控制机构中设置所需的切割量19，然后沿着设置在基板1中的切割部分4，通过切割刀片13将密封基板1切割成所需的切割量19.由此，基板 1被切割并分离成每个包装5。版权所有（C）2004，JPO

公开(公告)号：JP2005279857A

公开(公告)日：2005-10-13

申请号：JP2004098000

申请日：2004-03-30

Applicant: Sodick Co Ltd ,  Towa Corp ,  Towa株式会社 ,  株式会社ソディック

Inventor： ARAYA ICHIRO ,  KAWADA SHUICHI ,  HIRATA SHIGERU ,  MORISAWA TADASHI

IPC: B23Q1/70 ,  H01L21/301

Abstract: PROBLEM TO BE SOLVED: To provide a cutting apparatus which does not deteriorate the positional precision of a cutting portion due to the displacement caused by the thermal expansion, and due to the deformation cause by the inclination and deflection due to the weight of components themselves, with the trend for enlarging a spindle. SOLUTION: The spindle 8 is hung from and supported by Z-axis movable body 3 by means of a mounting and fixing member 50 and a supporting member 60. The mounting and fixing member 50 and the supporting member 60 support a spindle housing 40 at two points on the front end side and the rear end side of the spindle 8 such that the spindle 8 does not move in the radial direction. The mounting and fixing member 50 mounts and fixes the spindle 8 at the position in the neighborhood of a rotary blade 70 as near as possible on the front end side of the spindle 8. The supporting member 60 supports the spindle 8 at a position in the neighborhood of a motor 30 on the rear end side of the spindle 8 in the state that the longitudinal (Y-axis direction) displacement of the spindle 8 is allowed. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种切割装置，其不会由于热膨胀引起的位移而导致切割部的位置精度劣化，并且由于由于由于热膨胀引起的倾斜和偏转引起的变形， 组件本身，扩大主轴的趋势。 解决方案：主轴8通过安装固定部件50和支撑部件60悬挂在Z轴可移动体3上并由其支撑。安装固定部件50和支撑部件60支撑主轴壳体 40在主轴8的前端侧和后端侧的两点处，使得主轴8不沿径向移动。 安装固定构件50将主轴8安装并固定在旋转叶片70附近的位置，尽可能靠近主轴8的前端侧。支撑构件60将主轴8支撑在主轴8的位置 在主轴8的纵向（Y轴方向）位移被允许的状态下，在主轴8的后端侧的马达30附近。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2003059865A

公开(公告)日：2003-02-28

申请号：JP2001249187

申请日：2001-08-20

Applicant: Towa Corp ,  Towa株式会社

Inventor： MORISAWA TADASHI ,  IWATA YASUHIRO

IPC: B24B27/06 ,  H01L21/301 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a cutting device and a cutting method, which can cut a molded article after a chip is resin-sealed and can remove a resin flashes and metal burrs in the same process. SOLUTION: The cutting device is provided with a rotating table 1, an adhesive tape 2 bonded onto the rotating table 1 and a blade 11 and a rotary grind stone 12, which are fitted to rotary shafts 9 and 10. The rotary grind atone 12 is fitted, so that a peripheral face is brought into contact with the non-sealing face of a lead frame 4 including two edge lines in an opening 13, formed by cutting immodiately after the blade 11 cuts the molded article 3. The blade 11 cuts the molded article 3 fixed to the rotating table 1 by the adhesive tape 2, and the rotary grind stone 12 polishes the non-sealing face. Thus, the rotary grind stone 12 polishes and removes resin flash 6 and the metal burrs generated at cutting. Consequently, the resin flash 6 and the metal burrs can be removed in the same process as cutting, without having to install the removing process of the burrs.

Abstract translation: 要解决的问题：提供切割装置和切割方法，其可以在芯片被树脂密封之后切割成型制品，并且可以在相同的工艺中去除树脂闪光和金属毛刺。 解决方案：切割装置设置有旋转台1，粘合到旋转台1上的粘合带2和安装到旋转轴9和10的叶片11和旋转研磨石12.旋转研磨机12是 使得周边面与包括在开口13中的两条边缘线的引线框架4的非密封面接触，在叶片11切割模制品3之后，通过切割不均匀地形成。刀片11切割 通过胶带2固定在旋转台1上的模制品3，旋转研磨石12抛光非密封面。 因此，旋转磨石12抛光并除去树脂刷6和切割时产生的金属毛刺。 因此，可以在与切割相同的过程中除去树脂刷6和金属毛刺，而不必安装毛刺的去除过程。

公开(公告)号：MY169601A

公开(公告)日：2019-04-22

申请号：MYPI2010002472

申请日：2008-11-20

Applicant: TOWA CORP

Inventor： YAMAJI SHUZO ,  IWATA YASUHIRO ,  NAKAJIMA SHINYA ,  KASHIMURA JUNKO ,  MORISAWA TADASHI

Abstract: The present invention aims at, in forming packages (products) (5) by cutting a molded substrate (1), obtaining high-quality and reliable products and enhancing the productivity of the products. First, individual packages (5(1c)) fastened by a first package fastening mechanism (11) are transferred onto the package placing side (upper side) (12a) of an invertible attachment plate (12). Then the invertible attachment plate is inverted so that the package placing side will be the lower side, and the packages are examined from below by a first examination mechanism (13). Next, the first-examined packages held on the invertible attachment plate are passed and transferred onto the package placing side (14a) of a placing plate (14), and the first-examined packages are examined from above by a second examination mechanism (15). After that, the second-examined packages are transferred to a placing table (17) at a package placing position (18a) by a second package fastening mechanism (16).

公开(公告)号：SG125246A1

公开(公告)日：2006-09-29

申请号：SG200605373

申请日：2005-02-23

Applicant: TOWA CORP

Inventor： MORISAWA TADASHI ,  NITTA KAZUNORI ,  KAGEYAMA HIDEO ,  AZUMA HIDEKAZU

IPC: C09J7/00 ,  C09J5/00 ,  H01L21/52 ,  H01L21/68

Abstract: First, a prescribed position (2) on a substrate (1) is recognized by an image pickup mechanism (14).Then, a piece (12) including an adhesive film (10) is held by a holding mechanism (13). Thereafter,the holding mechanism (13) is moved to affix t he adhesive film (10) to the prescribed position (2) based on a result of recognition of the prescribed position (2). In the above- described step, the holding mechanism

公开(公告)号：JPH11340275A

公开(公告)日：1999-12-10

申请号：JP15855698

申请日：1998-05-22

Applicant: TOWA CORP

Inventor： URAGAMI HIROSHI ,  KAGEYAMA HIDEO ,  NITTA KAZUNORI ,  MORISAWA TADASHI ,  YOSHIMOTO KATSUNOBU ,  IWATA NOBUSUKE ,  KUNO KOUKI

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To highly efficiently produce semiconductor products provided with high quality and high reliability, by filling a tape-like resin material between a substrate and a semiconductor LSI chip by a simple means. SOLUTION: By heat-sticking the tape-like resin layer 13 of tape-like resin 4 automatically supplied for a prescribed length by a tape supply mechanism to the substrate 1 through a guide part 18 and a heating mechanism 19, the resin material is filled between the substrate 1 to which the tape-like resin layer 13 is stuck and the semiconductor LSI chip press-fitted to the surface of the substrate 1 in a face-down state.