Abstract:
This invention is directed to an improvement of a field emission display architecture in which low-voltage row and column address signals control a much higher pixel activation voltage. Instead of using a pair of series-coupled transistors in the emitter node grounding path as in the original architecture (one of which is gated by a column signal and the other of which is gated by a row signal), only a single transistor is utilized in the emitter node grounding path, thus eliminating an intermediate node between the two transistors that was responsible for unwanted emissions under certain operating conditions. In a preferred embodiment of the invention, a current regulating resistor is placed in the grounding path in series with the primary grounding transistor, with the resistor being directly coupled to ground. Additionally, for the preferred embodiment of the invention, the gate of the grounding transistor is coupled via a second field-effect transistor to either a row signal or a column signal. In the case where the gate of the first transistor is coupled to a row signal, the gate of the second transistor is coupled to a column signal. Likewise, where the gate of the first transistor is coupled to a column signal, the gate of the second transistor is coupled to a row signal. Numerous other equivalent circuits are possible, and several examples of such equivalent circuits are depicted in this disclosure.
Abstract:
In one electron-emitting device, non-insulating particle bonding material (24) securely bonds electron-emissive carbon-containing particles (22) to an underlying non-insulating region (12). The carbon in each carbon-containing particle is in the form of diamond, graphite, amorphous carbon, or/and silicon carbide. In another electron-emitting device, electron-emissive pillars (22/28) overlie a non-insulating region (12). Each pillar is formed with an electron-emissive particle (22) and an underlying non-insulating pedestal (28).
Abstract:
Methods of fabricating an emitter plate 10 having titanium tungsten (Ti:W) and aluminum (Al) used in a sublayering arrangement as the metallization material for the gate electrodes 60, cathode electrodes 20, bond pads 80 and 130, lead interconnects 100, 101, 120 and 121, and integrated circuit (IC) mount pads 90 and 91. In a disclosed embodiment, titanium tungsten and aluminum sublayers are combined with niobium to provide the metallization material.
Abstract:
The object of the present invention is to provide a cold cathode field emission display whose resolution is not limited by the provision of individual ballast resistors for each pixel or by the wiring system used to deliver voltage to the cold cathodes. This has been achieved by providing additional layers beneath the cold cathodes arrays so that said resistors and voltage delivery systems are located directly below the cold cathode arrays instead of alongside of them. Six different embodiments of the invention are described.
Abstract:
A method for forming resistors for regulating current in a field emission display comprises integrating a high resistance resistor into circuitry for the field emission display. The resistor is in electrical communication with emitter sites for the field emission display and with other circuit components such as ground. The high resistance resistor can be formed as a layer of a high resistivity material, such as intrinsic polycrystalline silicon, polycrystalline silicon doped with a conductivity-degrading dopant, lightly doped polysilicon, titanium oxynitride, tantalum oxynitride or a glass type material deposited on a baseplate of the field emission display. Contacts are formed in the high resistivity material to establish electrical communication between the resistor and the emitter sites and between the resistor and the other circuit components. The contacts can be formed as low resistance contacts (e.g., ohmic contacts) or as high resistance contacts (e.g., Schottky contacts).
Abstract:
A circuit for regulating the pixel current in a field emission display so as to enhance pixel-to-pixel uniformity of pixel current. The pixel current flows through a pair of diodes connected back-to-back. A transistor circuit controls the voltage across the back-to-back diode pair, so that the voltage/current transfer characteristic of the diode pair determines the pixel current.
Abstract:
The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70, illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.
Abstract:
A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially parallel to the substrate. A layer of diamond is disposed adjacent the surface of the resistive pillar.
Abstract:
The emitter plate 60 of a field emission flat panel display device includes a layer 68 of a resistive material and a mesh-like structure 62 of an electrically conductive material. A conductive plate 78 is also formed on top of resistive coating 68 within the spacing defined by the meshes of conductor 62. Microtip emitters 70; illustratively in the shape of cones, are formed on the upper surface of conductive plate 78. With this configuration, all of the microtip emitters 70 will be at an equal potential by virtue of their electrical connection to conductive plate 78. In one embodiment, a single conductive plate 82 is positioned within each mesh spacing of conductor 80; in another embodiment, four conductive plates 92 are symmetrically positioned within each mesh spacing of conductor 90. Also disclosed is an arrangement of emitter clusters comprising conductive plates 102 having a plurality of microtip emitters 104 formed thereon, or spaced therefrom by a thin layer of resistive material, each cluster adjacent and laterally spaced from a stripe conductor 100 by a region 106 of a resistive material. The conductive stripes 100 are substantially parallel to each other, are spaced from one another by two conductive plates 102, and are joined by bus regions 110 outside the active area of the display.
Abstract:
Micropoint emissive cathode electron source and field emission-excited cathodoluminescence display means using said source. The source comprises a series of electrodes (5) acting as cathode conductors and carrying micropoints (12) and a series of electrodes (10g) acting as grids, each of the electrodes of one of the series being in contact with a resistive layer (7) and having a lattice structure, so that there are consequently tracks (5a) which intersect and define first openings (6), each of the electrodes of the other series having second openings (11) which are displaced with respect to the first openings.