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公开(公告)号：JP2009184236A
公开(公告)日：2009-08-20
申请号：JP2008026756
申请日：2008-02-06
Inventor： MAEDA KEIJI , KITADA RYOJI , AMAYA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To restore a resin mold in which a mold release layer on the surface of the mold is worn and peeled to a resin mold in which a mold release layer of a constant film thickness is formed, without removal of the resin mold from the resin molding apparatus.
SOLUTION: A plasma torch 21 is arranged outside and between the lower mold 1 and the upper mold 2 in a freely forward/backward movable way, and the plasma torch 21 is connected with an Ar gas source 23, a fluorine gas source 24 and a RF power source 22. The method includes closing the lower mold 1 and the upper mold 2, injecting a fluid resin into a cavity 8 and hardening the resin to form a molding 18, opening the lower mold 1 and the upper mold 2, causing the plasma torch 21 to enter the gap between the lower mold 1 and the upper mold 2 and restoring a state of the molds in which a mold release layer 26 is worn and peeled in the mold surface SB before treatment to a state in which a mold release layer 27 of an even film thickness is formed in the mold surface SA after treatment by moving the plasma torch 21, while making plasma jet 25 to be discharged from the plasma torch 21 onto the surface of the mold 20, in an atmospheric-pressure atmosphere.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：为了恢复其中模具表面上的脱模层磨损并剥离到形成有恒定膜厚度的脱模层的树脂模具的树脂模具，而不去除 来自树脂成型装置的树脂模具。 解决方案：等离子体喷枪21以自由前进/后退移动的方式布置在下模具1和上模具2的外部和下部之间，等离子体喷枪21与Ar气体源23，氟气源 24和RF电源22.该方法包括关闭下模具1和上模具2，将流体树脂注入空腔8并使树脂硬化以形成模制件18，打开下模具1和上模具2 ，使等离子体焰炬21进入下模具1和上模具2之间的间隙，并且将处理前的脱模层26磨损并在模具表面SB中剥离的模具的状态恢复到其中 通过移动等离子体焰炬21，在使等离子体射流25从等离子体焰炬21排出到模具20的表面上的大气中，在处理后在模具表面SA中形成均匀膜厚度的脱模层27 压力气氛。 版权所有（C）2009，JPO＆INPIT
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252.发明专利Metallic mold for molding optical molded article and optical molded article 审中-公开用于模制光学模制和光学模型的金属模具
公开(公告)号：JP2009154353A
公开(公告)日：2009-07-16
申请号：JP2007333747
申请日：2007-12-26
Inventor： MATSUO MAKOTO , TAKAHASHI KAZUHIRO , ONISHI HISAYOSHI
Abstract: PROBLEM TO BE SOLVED: To provide an optical molded article 10 which can be efficiently made to be uniform in brightness, and to provide a metallic mold for molding the optical molded article 10 (a metallic mold 1 for injection molding of the optical molded article and a metallic mold for press-molding the molding).
SOLUTION: At first, a transfer surface 4 in a metallic mold cavity surface 8a (the cavity top surface member 6 of a division mold 5) of a metallic mold 1(2, 3) for the injection molding of the optical molded article 10 is formed in a state that the desired number of strip-like members 9 with desired widths 13 are connected with one another in a row. Then a resin material melt by heating is supplied into a metallic mold cavity 8 and solidified by cooling. Thereby, the desired shape of the metallic mold cavity surface 8a (the surface 9c of the strip-like member 9) is transferred to a surface 10a of the optical molded article 10 in the metallic mold cavity 8. Thus the optical molded article 10 is formed.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种有效地制造成具有均匀亮度的光学成型品10，并且提供一种用于模制光学成型制品10的金属模具（用于注射成型光学的金属模具1 模制品和用于模压成型的金属模具）。 解决方案：首先，将金属模具1（2,3）的金属模腔表面8a（分模5的腔顶表面构件6）中的转印表面4用于光学模制的注射成型 制品10形成为具有期望数量的具有期望宽度13的条状构件9彼此连续连接的状态。 然后通过加热将树脂材料熔融供给到金属模腔8中，并通过冷却固化。 由此，金属模腔表面8a（带状构件9的表面9c）的期望形状被转印到金属模腔8中的光学模制品10的表面10a上。因此，光学模制品10 形成。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP4287090B2
公开(公告)日：2009-07-01
申请号：JP2002006295
申请日：2002-01-15
Applicant: Towa株式会社
IPC: H01L21/301
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公开(公告)号：JP2009130342A
公开(公告)日：2009-06-11
申请号：JP2007307391
申请日：2007-11-28
Inventor： IWATA YASUHIRO , YAMAJI SHUZO , NAKAJIMA SHINYA , KASHIWAMURA JUNKO , MORISAWA TADASHI
CPC classification number: G01N21/95 , H01L21/56 , H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a high quality and highly reliable product 5 when cutting a molded substrate 1 to form a package (product) 5, and to efficiently improve the productivity of the product 5.
SOLUTION: First, individual package 5 (1c) which is fastened by a first package fastening mechanism 11 is transferred to a package placement surface (upper surface) 12a of a reverse locking plate 12, and the reverse locking plate 12 is reversed to make the package placement surface 12a an lower surface side. Inspection is performed by a first inspection mechanism 13 from a lower position. Next, a first inspected package 5 (1c) on the reverse locking plate 12 is inherited and transferred to a package placement surface 14a of the placement plate 14, and the first inspected package 5 (1c) is inspected by a second inspection mechanism 15 from an upper position. Then, a second inspected package 5 (1c) is transferred to a placement table 17 at a package placement position 18a by a second package fastening mechanism 16.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：为了在切割模制基材1以形成包装（产品）5时提供高质量和高可靠性的产品5，并且有效地提高产品5的生产率。解决方案：首先 由第一包装紧固机构11紧固的单个包装5（1c）被转移到反向锁定板12的包装放置表面（上表面）12a，并且反向锁定板12反转以使包装放置表面 12a表示下表面。 通过第一检查机构13从较低位置进行检查。 接下来，逆向锁定板12上的第一被检查的包装5（1c）被继承并传送到放置板14的包装放置表面14a，并且第一检查包装5（1c）由第二检查机构15 上位 然后，第二被检查的包装5（1c）通过第二包装紧固机构16在包装放置位置18a被转移到放置台17.版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009117536A
公开(公告)日：2009-05-28
申请号：JP2007287546
申请日：2007-11-05
Inventor： KAWAKUBO KAZUTERU
CPC classification number: H01L33/642 , B29C43/18 , B29C70/70 , B29L2011/0016 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive LED package which is superior in light emission efficiency and reliability. SOLUTION: The LED package formed by separating a sealed body 14 containing a substrate 15 having a plurality of regions 16 into individual pieces includes an LED chip 3 mounted on a recessed part in an upper surface of a substrate 2, a sealing resin 4 to cover an entire surface of the region 16, a setting pattern 5 provided on a bottom surface of the recessed part to set the LED chip 3, a wiring pad 8 provided on the bottom surface of the recessed part, a wiring pattern 10 provided on a slanted surface 9 of the recessed part and serving as a light reflection part, a wire 13 to connect an electrode of the LED chip 3 to the wiring pad 8, an external terminal 12 provided on an under surface of the substrate 2, a connection part 11 to connect the wiring pattern 10 connected to the wiring pad 8 to the external terminal 12, and a heat radiating pattern 7 provided on an under surface to radiate a heat generated in the LED chip 3 outside the LED package 1. The setting pattern 5 is connected to the heat radiating pattern 7 through the connection part 6. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种廉价的发光效率和可靠性的LED封装。 解决方案：通过将包含多个区域16的基板15的密封体14分离成单独的片而形成的LED封装包括安装在基板2的上表面的凹部的LED芯片3，密封树脂 如图4所示，覆盖区域16的整个表面，设置在凹部的底面上以设置LED芯片3的设置图案5，设置在凹部的底面上的布线垫8，设置有布线图案10 在凹部的倾斜面9上作为光反射部，将LED芯片3的电极与配线焊盘8连接的导线13，设置在基板2的下表面的外部端子12， 连接部分11将连接到布线焊盘8的布线图案10连接到外部端子12，以及设置在下表面上的散热图案7，以辐射在LED封装1外部的LED芯片3中产生的热量。设置 模式5连接 通过连接部分6到散热图案7.版权所有：（C）2009，JPO＆INPIT
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Patent Agency Ranking
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公开(公告)号：JP2008207450A
公开(公告)日：2008-09-11
申请号：JP2007046348
申请日：2007-02-27
Inventor： KAWAKUBO KAZUTERU
CPC classification number: B29C43/021 , B29C33/0022 , B29C43/18 , B29C2043/3438 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To efficiently prevent resin burr 91 from being stuck and formed on a frame 5 mounting an LED chip (light-emitting element) 4.
SOLUTION: First, a tape application frame 13 is formed by applying the tape 12 for preventing the resin burr on a surface 5a not mounted with a light-emitting element of the frame 5 mounting the LED chip 4, the tape application frame 13 is supplied to set on a set part 7 of an upper mold 2 in such a state that the LED chip 4 side is directed downward, and requirement of a liquid resin material 10 having transparency is supplied by dropping in a large cavity 8 including a small cavity 9 with a dispenser 11. Next, the LED chip 4 is respectively separately immersed in the resin 10 of the small cavity 9 in the cavity 8 by clamping the both upper and lower molds 1 (a fixed upper mold 2, a movable lower mold 3) with a required mold clamping pressure, and compression molded to obtain a molded frame 61 (a light-emitting body 65).
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：有效地防止树脂毛刺91粘附并形成在安装LED芯片（发光元件）4的框架5上。解决方案：首先，通过以下方式形成带施加框架13： 在没有安装有安装LED芯片4的框架5的发光元件的表面5a上施加用于防止树脂毛刺的带12，供带子施加框架13设置在上模具2的固定部分7上 在LED芯片4侧朝向下方的状态下，通过用分配器11落在具有小型腔体9的大型空腔8内供给具有透明性的液态树脂材料10的要求。接下来，LED芯片4为 通过以所需的模具夹紧压力夹紧上模2和下模2（固定上模2，可动下模3），分别浸入空腔8中的小腔9的树脂10中，并压缩成型 模制框架61（发光体65）。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008162040A
公开(公告)日：2008-07-17
申请号：JP2006351235
申请日：2006-12-27
Inventor： MAEDA KEIJI , AMAYA SATOSHI , KITADA RYOJI
IPC: B29C59/02 , B29C33/38 , B81C99/00 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To efficiently release a resin molding (47) from a mold 13 during hot embossing (imprint) when the mold (die) 13 having a minute pattern shape (recess 11) for hot embossing is processed. SOLUTION: First, by dry-etching (arrow 2) a silicon substrate 1 by a deep reactive ion etching (RIE) method, a recess 5 having an opening 4 in a minute pattern shape in an etching treatment surface and a wall surface in a reverse taper shape is formed, and a silicon base 6 is stuck on the etching treatment surface 3 by diffused junction by heat treatment to close the opening 4 of the etching treatment surface. Next, by grinding a non-etching treated surface 7 to be its opposite surface is ground with a grinding roller 8 to be removed, an opening 10 having the minute pattern shape is made to appear on the surface 7, and the mold in which the recess 11 having the opening 10 in the minute pattern shape and a wall surface in a normal taper shape are formed is processed. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：当处理具有微小图案形状的模具（模具）13（用于热压花的凹部11））时，在热压花（压印）期间，有效地从模具13释放树脂模制件（47）。 解决方案：首先，通过深反应离子蚀刻（RIE）方式通过干法蚀刻（箭头2）硅衬底1，在蚀刻处理表面中具有微小图案形状的开口4的凹部5和壁 形成反锥形的表面，通过热处理通过扩散接合将硅基底6粘附在蚀刻处理表面3上，以封闭蚀刻处理表面的开口4。 接下来，通过研磨作为其相对表面的非蚀刻处理表面7被研磨辊8除去，使具有微小图案形状的开口10出现在表面7上，并且其中 处理具有微小图案形状的开口10和形成正常锥形形状的壁面的凹部11。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008153565A
公开(公告)日：2008-07-03
申请号：JP2006342180
申请日：2006-12-20
Inventor： AMAKAWA TAKESHI
IPC: H01L21/56
CPC classification number: H01L21/67092 , G01N21/956 , H01L21/67207 , Y10T29/53087 , Y10T83/364
Abstract: PROBLEM TO BE SOLVED: To provide an individualizing apparatus for individualizing a sealed substrate to manufacture an electronic component, capable of shortening delivery period, reducing footprint and reducing cost while accepting a requirement specification of users. SOLUTION: An individualizing apparatus S2 for an electronic component has a basic unit including an acceptor A and an individualizing part B and a delivery part C, a cleaner D equipped between the individualizing part B and the delivery part C, and an inspector E equipped to the cleaner D. The individualizing part B is arbitrarily selected depending on a requirement specification of users. A cutting-off mechanism used in the individualizing part B has a rotary blade 7, a waterjet, laser light, a wire saw, a band saw and the like. In addition, the cleaner D and the inspector E equipped to the basic unit are arbitrarily selected and equipped depending on the requirement specification of users, respectively. By equipping the cleaner D and the inspector E to the basic unit having the individualizing part B depending on the requirement specification of users, the individualizing apparatus S2 for an electronic component is configured. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种个性化装置，用于个性化密封基板以制造电子部件，能够缩短交货周期，减少占用面积并降低成本，同时接受用户的需求规格。 解决方案：用于电子部件的个性化装置S2具有包括受体A和个体化部分B和输送部分C的基本单元，设置在个体化部分B和输送部分C之间的清洁器D以及检查器 E装备到清洁器D.个性化部分B根据用户的要求规格任意选择。 在个性化部件B中使用的切断机构具有旋转刀片7，水刀，激光，线锯，带锯等。 此外，根据用户的需求规格，清洁器D和配备到基本单元的检验员E分别任意选择和配备。 通过将清洁器D和检查器E装配到具有个性化部分B的基本单元，根据用户的要求规格，配置电子部件的个性化装置S2。 版权所有（C）2008，JPO＆INPIT
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