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    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES
    258.
    发明申请
    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20210191458A1

    公开(公告)日：2021-06-24

    申请号：US17192722

    申请日：2021-03-04

    Applicant: Apple Inc.

    Inventor： Lucy Elizabeth Browning ,  Benjamin J. Pope ,  Paul U. Leutheuser ,  Scott A. Myers ,  Richard Hung Minh Dinh ,  Edward S. Huo

    IPC: G06F1/16 ,  H03K17/96 ,  H03K17/975 ,  G06F3/01 ,  G06F3/16 ,  G06K9/00

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    Circuit board interposer
    259.
    发明授权
    Circuit board interposer 有权

    公开(公告)号：US11006524B2

    公开(公告)日：2021-05-11

    申请号：US15875886

    申请日：2018-01-19

    Applicant: Apple Inc.

    Inventor： Scott A. Myers ,  James B. Smith ,  Dale T. Morgan ,  Shayan Malek

    IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/20

    Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

    Electronic devices with sidewall displays
    260.
    发明授权
    Electronic devices with sidewall displays 有权

    公开(公告)号：US10936136B2

    公开(公告)日：2021-03-02

    申请号：US16720257

    申请日：2019-12-19

    Applicant: Apple Inc.

    Inventor： Scott A. Myers ,  Stephen Brian Lynch ,  Anthony S. Montevirgen

    IPC: G06F3/044 ,  H04M1/02 ,  G06F1/16 ,  G06F3/0481 ,  G06F3/0488 ,  G06F3/041 ,  H04M1/23

    Abstract: Electronic devices may be provided that contain flexible displays that are bent to form displays on multiple surfaces of the devices. Bent flexible displays may be bent to form front side displays and edge displays. Edge displays may be separated from front side displays or from other edge displays using patterned housing members, printed or painted masks, or by selectively activating and inactivating display pixels associated with the flexible display. Edge displays may alternately function as virtual buttons, virtual switches, or informational displays that are supplemental to front side displays. Virtual buttons may include transparent button members, lenses, haptic feedback components, audio feedback components, or other components for providing feedback to a user when virtual buttons are activated.

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