公开(公告)号：US20130071629A1

公开(公告)日：2013-03-21

申请号：US13634549

申请日：2011-03-17

Applicant: Sujeet Kumar Sinha ,  Jonathan Yonghui Leong ,  Satyanarayana Nalam ,  Hongbin Yu ,  Harikumar Vijayan ,  Guangya Zhou

Inventor： Sujeet Kumar Sinha ,  Jonathan Yonghui Leong ,  Satyanarayana Nalam ,  Hongbin Yu ,  Harikumar Vijayan ,  Guangya Zhou

IPC: B05D5/00 ,  B05C5/00 ,  C10M107/32

CPC classification number: B05D5/00 ,  B05C5/00 ,  B81B3/0005 ,  B81C1/00984 ,  B81C2201/0197 ,  B81C2201/112 ,  C10M107/32 ,  Y10T428/24793 ,  Y10T428/24802

Abstract: According to an embodiment of the present invention, a method of applying a lubricant to a micromechanical device is provided. The method includes: positioning a dispensing portion of a lubricant liquid dispenser over a surface portion of a micromechanical device; and controlling the dispenser such that a single lubricant liquid droplet of a predefined volume is forced out of the dispensing portion and impinges onto the surface portion.

Abstract translation: 根据本发明的一个实施例，提供了一种向微机械装置施加润滑剂的方法。 该方法包括：将润滑剂液体分配器的分配部分定位在微机械装置的表面部分上; 并且控制分配器，使得预定体积的单个润滑剂液滴被迫离开分配部分并撞击到表面部分上。

公开(公告)号：US20120181180A1

公开(公告)日：2012-07-19

申请号：US13356398

申请日：2012-01-23

Applicant: Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC: C25D5/48 ,  C25D21/12 ,  C25D5/02

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

公开(公告)号：US20120114861A1

公开(公告)日：2012-05-10

申请号：US13253856

申请日：2011-10-05

Applicant: Adam L. Cohen ,  Uri Frodis ,  Michael S. Lockard ,  Ananda H. Kumar ,  Gang Zhang ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Uri Frodis ,  Michael S. Lockard ,  Ananda H. Kumar ,  Gang Zhang ,  Dennis R. Smalley

IPC: B05D3/12 ,  B05D1/36 ,  C25D5/48

CPC classification number: C25D1/003 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885

Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb). Some embodiments provide for reducing tool wear when using difficult-to-machine materials by (1) depositing difficult to machine materials selectively and potentially with little excess plating thickness and/or (2) pre-machining depositions to within a small increment of desired surface level (e.g. using lapping) and then using diamond fly cutting to complete the process, and/or (3) forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

Abstract translation: 用于形成单层和多层中尺度和微结构结构的电化学制造方法包括使用金刚石加工（例如飞切或车削）来平坦化层。 一些实施例侧重于牺牲和结构材料的系统，其可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn以及Au和Sn-Pb）进行金刚石加工， 。 一些实施例提供了通过（1）选择性地沉积难以加工的材料并且潜在地以很少的镀层厚度沉积和/​​或（2）预加工沉积到期望表面的小增量内，以便在使用难加工材料时减少刀具磨损 （例如使用研磨），然后使用金刚石飞切切割来完成该过程，和/或（3）从硬质材料的薄壁区域形成与结构材料的宽固体区域相反的结构或部分结构。

公开(公告)号：US20100264037A1

公开(公告)日：2010-10-21

申请号：US12789704

申请日：2010-05-28

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20100209318A1

公开(公告)日：2010-08-19

申请号：US12769366

申请日：2010-04-28

Applicant: William J. Grande ,  Gary A. Fino

Inventor： William J. Grande ,  Gary A. Fino

IPC: B01J19/00

CPC classification number: B29C66/1122 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C33/3878 ,  B29C33/428 ,  B29C65/48 ,  B29C65/52 ,  B29C66/232 ,  B29C66/5326 ,  B29C66/5346 ,  B29L2031/756 ,  B33Y10/00 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0197

Abstract: The present invention relates to a process for producing a microfluidic device which involves providing a substrate with a surface and writing a first flowable material on the surface of the substrate. The first flowable material is then solidified to form spacer elements, each with a top surface distal from the surface of the substrate, and a second flowable material is written on the surface of the substrate. A cover having a surface is provided and applied to the substrate, with the surface of the cover contacting the top surfaces of the spacer elements. The second flowable material is solidified to form walls, where the walls, the surface of the substrate, and the surface of the cover form flow channels of a microfluidic device. The resulting microfluidic device is also disclosed.

Abstract translation: 本发明涉及一种用于生产微流体装置的方法，其涉及提供具有表面的基底并将第一可流动材料写在基底的表面上。 然后将第一可流动材料固化以形成间隔元件，每个间隔元件具有远离衬底表面的顶表面，并且第二可流动材料被写在衬底的表面上。 提供具有表面的盖并将其施加到基板，其中盖的表面接触间隔元件的顶表面。 第二可流动材料被固化以形成壁，其中壁，基底的表面和盖的表面形成微流体装置的流动通道。 还公开了所得的微流体装置。

公开(公告)号：US20100038253A1

公开(公告)日：2010-02-18

申请号：US12560276

申请日：2009-09-15

Applicant: Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC: C25D5/02 ,  B32B38/04 ,  C25D5/48 ,  B32B37/00

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

公开(公告)号：US07658831B2

公开(公告)日：2010-02-09

申请号：US11306291

申请日：2005-12-21

Applicant: Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

Inventor： Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

IPC: C25D5/02

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。

公开(公告)号：US07618525B2

公开(公告)日：2009-11-17

申请号：US11927287

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US07271888B2

公开(公告)日：2007-09-18

申请号：US11029220

申请日：2005-01-03

Applicant: Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC: G01N21/88

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

公开(公告)号：US20070181430A1

公开(公告)日：2007-08-09

申请号：US11622279

申请日：2007-01-11

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。