公开(公告)号：US20180066136A1

公开(公告)日：2018-03-08

申请号：US15676187

申请日：2017-08-14

Applicant: Keki Hormusji GHARDA

Inventor： Keki Hormusji Gharda ,  Prakash D. Trivedi ,  Tushar R. Parida ,  Amitkumar Biradar

IPC: C08L79/04 ,  C08L101/12 ,  C08G73/10 ,  C08G73/18 ,  C08L61/16 ,  C08L71/00 ,  C08L79/08 ,  C08L81/04 ,  C08L81/06 ,  B29C43/00 ,  B29L7/00 ,  B29L23/00 ,  B29L31/06 ,  B29L31/00 ,  B29K79/00 ,  B29K471/00

CPC classification number: C08L79/04 ,  B29C43/003 ,  B29K2079/00 ,  B29K2471/00 ,  B29L2007/00 ,  B29L2023/00 ,  B29L2031/06 ,  B29L2031/7728 ,  C08G73/1046 ,  C08G73/18 ,  C08G2650/40 ,  C08L61/16 ,  C08L71/00 ,  C08L79/08 ,  C08L81/04 ,  C08L81/06 ,  C08L101/12 ,  C08L2201/08

Abstract: The present disclosure provides a polymeric composition resistant to temperatures comprising Poly 2,5rBenzimidazole having intrinsic viscosity (I.V.) between 1.0 and 2.5; and at least one binder having a glass transition temperature less than the glass transition temperature of Poly2,5-Benzimidazole and intrinsic viscosity ranging between 0.2 and 1.5. The present disclosure also provides a process for preparing the polymeric composition resistant to temperatures.

公开(公告)号：US20180057664A1

公开(公告)日：2018-03-01

申请号：US15250726

申请日：2016-08-29

Applicant: WEIR SLURRY GROUP, INC.

Inventor： Francisco A. Gozalo ,  Sanford W. Clark

IPC: C08L7/00 ,  B02C17/22

CPC classification number: C08L7/00 ,  B02C17/225 ,  B02C2210/02 ,  C08L9/00 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/06

Abstract: This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10−5 moles/cm3.

公开(公告)号：US09907166B2

公开(公告)日：2018-02-27

申请号：US15501995

申请日：2016-02-19

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi Kobayashi ,  Kentaro Takano

IPC: B32B27/38 ,  C08G59/50 ,  H05K1/03 ,  B32B15/14 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  D06M15/55 ,  H05K3/00 ,  C08J5/24 ,  C08G61/02 ,  C08L65/00 ,  C08L63/00 ,  D06M101/00

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2457/08 ,  C08G14/12 ,  C08G59/40 ,  C08G61/02 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/65 ,  C08G2261/74 ,  C08G2261/76 ,  C08J5/24 ,  C08J2361/14 ,  C08J2361/34 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2461/14 ,  C08J2461/34 ,  C08J2463/00 ,  C08J2465/00 ,  C08K3/36 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L65/00 ,  C08L2201/02 ,  C08L2201/08 ,  D06M15/55 ,  D06M2101/00 ,  H05K1/0366 ,  H05K3/007 ,  H05K2201/0209

Abstract: The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

公开(公告)号：US09896579B2

公开(公告)日：2018-02-20

申请号：US15322304

申请日：2015-07-06

Applicant: UMG ABS, LTD.

Inventor： Takashi Iwanaga ,  Kousaku Tao ,  Nobutaka Hase

IPC: C08L33/12 ,  C08L51/04 ,  C08L51/06 ,  C08F291/02

CPC classification number: C08L33/12 ,  C08F212/08 ,  C08F220/14 ,  C08F283/124 ,  C08F285/00 ,  C08F291/02 ,  C08L33/04 ,  C08L51/085 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2207/04 ,  C08F220/44 ,  C08F222/40 ,  C08F2222/402 ,  C08L25/12 ,  C08L83/04 ,  C08L51/006

Abstract: A thermoplastic resin composition of the present invention contains a graft copolymer (B) obtained by polymerizing a vinyl-based monomer component (m1) in the presence of a composite rubber polymer (A) formed from a polyorganosiloxane (Aa) and a poly(meth)acrylate ester (Ab), and a (meth)acrylate ester resin (C) obtained by polymerizing a vinyl-based monomer component (m2), wherein the amount of the polyorganosiloxane (Aa) relative to the total mass (100% by mass) of the composite rubber polymer (A) is from 1 to 20% by mass, the volume average particle size of the composite rubber polymer (A) is from 0.05 to 0.15 μm, and relative to the total mass (100% by mass) of the vinyl-based monomer component (m2), the amount of the maleimide-based compound is from 1 to 30% by mass, and the amount of the aromatic vinyl compound is from 5.5 to 15% by mass.

公开(公告)号：US20180030264A1

公开(公告)日：2018-02-01

申请号：US15554858

申请日：2016-03-04

Applicant: Huntsman Advanced Materials Americas LLC

Inventor： Dong Wang ,  Bradley Rechichar ,  Derek S. Kincaid ,  Ronald C. Smith

IPC: C08L61/34 ,  C08G14/06 ,  C09D161/34 ,  C08J5/24 ,  C07D265/16 ,  C09J161/34

CPC classification number: C08L61/34 ,  C07D265/14 ,  C07D265/16 ,  C07D413/14 ,  C08G14/06 ,  C08G73/22 ,  C08J5/04 ,  C08J5/043 ,  C08J5/24 ,  C08J2361/34 ,  C08J2379/00 ,  C08J2461/06 ,  C08J2463/04 ,  C08K5/34 ,  C08L61/06 ,  C08L2201/08 ,  C09D161/06 ,  C09D161/34 ,  C09J161/06 ,  C09J161/34 ,  C09J2461/00 ,  C09J2463/00

Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

公开(公告)号：US09870970B2

公开(公告)日：2018-01-16

申请号：US15035903

申请日：2015-01-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Jae Ho Jung ,  Bum Gyu Choi ,  Min Kyoun Kim

IPC: C08G77/12 ,  H01L23/29 ,  C08G77/20 ,  C09J183/04 ,  C08G77/00 ,  C08G77/08 ,  H01L33/56 ,  C08G77/38 ,  C08L83/04 ,  C08K5/5435 ,  C08L83/06 ,  C08K5/5419 ,  C08G77/14

CPC classification number: H01L23/296 ,  C08G77/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C08G77/48 ,  C08G77/80 ,  C08G2170/00 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08K2201/008 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/206 ,  C08L2205/025 ,  C09J183/04 ,  C09J2203/318 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

公开(公告)号：US20180002518A1

公开(公告)日：2018-01-04

申请号：US15536786

申请日：2015-12-17

Applicant: Lubrizol Advanced Materials, Inc.

Inventor： Christopher D. Zook ,  Mark D. Julius

IPC: C08L27/24 ,  C08F8/22 ,  F16L9/127

CPC classification number: C08L27/24 ,  C08F8/22 ,  C08L2201/08 ,  C08L2203/18 ,  C08L2205/025 ,  C08L2205/06 ,  F16L9/127 ,  C08F14/06

Abstract: The disclosed technology relates to a plastic compound suitable for preparing articles, such as pipe, with good physical properties, such as impact strength, and resistance to environmental stress cracking (ESC). In particular, the technology relates to a vinyl chloride resin, which includes chlorinated polyvinyl chloride (“CPVC”) homopolymer. Further-more, the invention relates to vinyl chloride homopolymer compounds containing the vinyl chloride homopolymer resin, and articles made from such compounds, which compounds meet 23447 cell classifications under ASTM D1784.

公开(公告)号：US20170342266A1

公开(公告)日：2017-11-30

申请号：US15534135

申请日：2015-12-02

Applicant: RHODIA OPERATIONS

Inventor： Jin-Kyung JUNG ,  Elodie SEIGNOBOS

IPC: C08L77/06

CPC classification number: C08L77/06 ,  C08K3/014 ,  C08K3/16 ,  C08K5/098 ,  C08K7/14 ,  C08L97/02 ,  C08L2201/08 ,  C08L2205/025

Abstract: The present invention provides a polyamide composition comprising (a) at least one polyamide mixture formed from (i) at least one polyamide 6,6, the amount of amine end groups (AEG) being greater than the amount of carboxylic acid end groups (CEG); and (ii) at least one high chain-length polyamide; (b) at least one reinforcing filler; (c) at least one heat stabilizer; (d) aluminum stearate; and optionally (e) at least one additive. The polyamide composition can be advantageously used to produce articles exhibiting enhanced chemical resistance, notably CaCl2 salt crack resistance, such as radiator end tank in an automobile.

公开(公告)号：US20170342251A1

公开(公告)日：2017-11-30

申请号：US15678289

申请日：2017-08-16

Applicant: Dow Global Technologies LLC

Inventor： Charles F. Diehl ,  Andy C. Chang ,  Ashish Batra ,  Suzanne M. Guerra ,  Jill M. Martin

IPC: C08L23/16 ,  C08K5/00 ,  C08K3/00 ,  C08L23/08

CPC classification number: C08L23/16 ,  C08K3/013 ,  C08K3/20 ,  C08K5/0008 ,  C08L23/0815 ,  C08L23/142 ,  C08L51/06 ,  C08L2201/08 ,  C08L2203/16

Abstract: Compositions are provided that comprise: (1) a polymer selected from the group consisting of: (A) an ethylene/α-olefin multiblock interpolymer; (B) a propylene based plastomer or elastomer; and (C) a mixture of (A) and (B); (2) from about 1 to about 75 weight percent filler based on the weight of the composition; and (3) an effective amount of tackifier.

公开(公告)号：US20170335097A1

公开(公告)日：2017-11-23

申请号：US15520337

申请日：2015-10-29

Applicant: KANEKA CORPORATION

Inventor： Kenji TAKAMIZU

IPC: C08L51/00 ,  C08L27/06

CPC classification number: C08L51/003 ,  C08F220/32 ,  C08L27/06 ,  C08L33/068 ,  C08L51/04 ,  C08L63/00 ,  C08L101/00 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2205/06 ,  C08L2207/53 ,  C08F2220/325 ,  C08F220/14 ,  C08F212/08

Abstract: The present invention relates to resin-modifying particles, each of which contains a glycidyl group-containing polymer (B) and a core-shell copolymer (C) at a composite state, and a vinyl chloride resin composition containing a vinyl chloride resin (A) and the resin-modifying particles, and the like.