Abstract:
L' invention concerne un dispositif microfluidique, comportant un réseau microfluidique, comportant: a) deux plaques (2, 4) parallèles chacune munie d'une ou plusieurs électrodes (3, 13), b) au moins un canal (9), disposé entre les deux plaques, en un matériau obtenu par solidification ou durcissement du matériau d'un premier fluide (6), c) des moyens pour faire varier un paramètre physique du matériau constitutif des parois du canal afin de le faire passer au moins de l'état liquide à l'état solide.
Abstract:
The invention relates to the production of segmented nanowires and components having said segmented nanowires. A template-based method is preferably used for producing the nanowire structural element, wherein electrochemical deposition of the nanowires takes place in nanopores. A plurality of nanowires thus is generated in the template foil. For the electrochemical deposition of the nanowires, an alternating sequence of cathodic deposition pulses and anodic counterpulses is performed. Segmented nanowires can be produced thereby.
Abstract:
A microfluidics package (1) comprising a substrate (6) having a top surface, said top surface comprises at least one fluid channel (11, 12), at least one fluidic chip (2) having a top surface, a bottom surface, at least one side surface, and at least one passage to allow a fluid to traverse from the top surface or any side surface to the bottom surface of the chip; and a sheet (4) of which both sides are adhesive, wherein the first adhesive side of the sheet (4) is secured to the substrate (6), and the at least one fluidic chip (2) is secured by the second adhesive side of the sheet (4), said fluidic chip (2) being arranged such that the at least one passage of the fluidic chip is in fluid communication with the at least one fluid channel (11, 12) of the substrate.
Abstract:
L'invention concerne un micro-système destiné à recevoir des billes et à obtenir une localisation précise desdites billes a des endroits déterminés dans le micro-système. Ce micro-système comporte un réservoir (3) présentant une cavité (4), ladite cavité (4) munie d'éléments bloquants (5) permettant d'ordonner et d'empiler les billes dans les interstices entre les éléments bloquants (5), les interstices constituant lesdits endroits déterminés. Il comporte également un capot (7) fixé hermétiquement au réservoir (3) et des moyens d'entrée (8) et des moyens de sortie (9) permettant la circulation d'un fluide dans la cavité (4). L’invention concerne également la réalisation et l’utilisation dudit micro-système remplie de billes.
Abstract:
Microfluidic devices capable of efficiently mixing one or more fluids are described. Two or more microfluidic channels within the device meet at an overlap region. The overlap region may be in fluid communication with an outlet channel. The inlet channels are disposed within different layers of a three dimension device. Microfluidic separators for separating multiphase fluids are also described. In this case, a multiphase fluid flows through an inlet channel into an overlap region from where the separated phases can be withdrawn through outlet channels. Also provided are methods for mixing and separating fluids in such devices.
Abstract:
PROBLEM TO BE SOLVED: To prevent a resistor material and an electrode material from being diffused, and to suppress a variation in electric resistance.SOLUTION: In a device including a first structure with a plurality of metal layers different in composition on a substrate and a second structure formed of a material such as glass paste requiring a firing process when being formed, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.