公开(公告)号：US09202755B2

公开(公告)日：2015-12-01

申请号：US14387783

申请日：2013-03-06

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu Moriyama

IPC: H01L21/00 ,  H01L21/78 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  C09J7/00 ,  H01L21/56

CPC classification number: H01L21/78 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/11002 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27002 ,  H01L2224/27436 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10T403/479 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/0665 ,  H01L2924/207 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0532

Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

Abstract translation: 提供能够提供与相对电极的良好结合的电路连接材料，以及使用该电路连接材料的半导体器件制造方法。 本发明使用其中粘附到半导体芯片侧的第一粘合剂层和具有比第一粘合剂层更高的最低熔融粘度达到温度的第二粘合剂层的电路连接材料。 当电路连接材料被卡住的半导体芯片安装在电路板上时，第一粘合层的厚度在满足公式（1）的范围内，从而与相对电极提供良好的结合。

公开(公告)号：US20150225625A1

公开(公告)日：2015-08-13

申请号：US14428222

申请日：2013-10-01

Applicant: MITSUBISHI PLASTICS, INC.

Inventor： Kahoru Niimi ,  Makoto Inenaga ,  Takahisa Uchida ,  Ryota Yamamoto

IPC: C09J133/08 ,  B32B38/10 ,  B32B37/18 ,  B32B38/00 ,  C09J5/06 ,  B32B37/12

CPC classification number: C09J133/08 ,  B32B37/1284 ,  B32B37/18 ,  B32B38/0008 ,  B32B38/10 ,  B32B2037/1246 ,  B32B2037/1253 ,  B32B2307/42 ,  B32B2307/726 ,  B32B2457/20 ,  B32B2457/208 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2205/302 ,  C09J2433/00 ,  G02F1/13338 ,  G02F2001/133331 ,  G02F2202/28 ,  Y10T428/31935 ,  C08F2220/1825 ,  C08F218/08

Abstract: Provided is a novel double-sided pressure-sensitive adhesive sheet that can achieve both the repeelability and the reliability in the pressure sensitive adhesive surface such as the occurrence of foaming. Proposed is a repeelable double-sided pressure-sensitive adhesive sheet comprising a pressure sensitive adhesive layer containing a (meth)acrylate ester copolymer as a base polymer, in which the (meth)acrylate ester copolymer has a content of a carboxyl group-containing monomer as a copolymerization component of 2% by mass or less and the pressure sensitive adhesive layer is curable by heat or ultraviolet light and satisfies the following physical properties (1) and (2): (1) a 180° peel force is 5.0 N/cm or more when one surface of the double-sided pressure-sensitive adhesive sheet is superimposed on soda lime glass, a roller of 1 kg is reciprocated one time to crimp the two, the crimped resultant is allowed to stand for 24 hours in an environment of a temperature of 23° C. and a relative humidity of 40% RH, and then the double-sided pressure-sensitive adhesive sheet is peeled off from the soda lime glass at a temperature of 23° C. and a peel rate of 60 mm/min; and (2) a 180° peel force is 4.0 N/cm or less when one surface of the double-sided pressure-sensitive adhesive sheet is superimposed on soda lime glass, a roller of 1 kg is reciprocated one time to crimp the two, the crimped resultant is allowed to stand for 24 hours in an environment of a temperature of 23° C. and a relative humidity of 40% RH and allowed to absorb moisture by storing for 15 hours in a humidified environment of a temperature of 60° C. and 90% RH, and then the double-sided pressure-sensitive adhesive sheet is peeled off from the soda lime glass at a temperature of 23° C. and a peel rate of 60 mm/min immediately after absorbing moisture.

公开(公告)号：US20150166841A1

公开(公告)日：2015-06-18

申请号：US14413295

申请日：2013-07-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Saori Ueda ,  Toshihiro Suwa ,  Shunsuke Suzuki ,  Jun Fujita

IPC: C09J7/00 ,  B32B27/36 ,  B32B38/00 ,  C09J11/06 ,  C08K5/3492 ,  B32B37/12 ,  B32B7/12 ,  C09J4/00

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B27/36 ,  B32B37/1284 ,  B32B38/0008 ,  B32B2037/1246 ,  B32B2250/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2310/0831 ,  B32B2457/20 ,  C08J5/128 ,  C08J2367/00 ,  C08J2433/04 ,  C08K5/3492 ,  C09J4/00 ,  C09J5/06 ,  C09J7/10 ,  C09J11/06 ,  C09J133/066 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2467/006 ,  Y10T428/31797

Abstract: A transparent pressure sensitive adhesive sheet with a front surface and a back surface, fabricated by changing the intensity of the ultraviolet light irradiation between the front surface and the back surface. The transparent pressure sensitive adhesive sheet is obtained by ultraviolet light irradiation of an ultraviolet light hardening pressure sensitive adhesive sheet that contains a (meth)acrylic copolymer, a cleavage type photoinitiator, and an ultraviolet light absorber. The amount of ultraviolet light irradiation varies between the first surface and the second surface and the adhesive force varies between the first surface and the second surface.

Abstract translation: 通过改变前表面和后表面之间的紫外线照射的强度制造的具有前表面和后表面的透明压敏粘合片。 通过紫外光照射含有（甲基）丙烯酸共聚物，裂解型光引发剂和紫外线吸收剂的紫外线硬化压敏粘合片来获得透明压敏粘合片。 紫外线照射量在第一表面和第二表面之间变化，并且粘合力在第一表面和第二表面之间变化。

公开(公告)号：US20150159053A1

公开(公告)日：2015-06-11

申请号：US14403634

申请日：2013-05-15

Applicant: TESA SE

Inventor： Uwe Schümann ,  Kirstin Weiland ,  Hermann Neuhaus-Steinmetz ,  Dennis Perlbach ,  Arne Koops ,  Thomas Schubert ,  Olga Kirpicenok ,  Sarah Reich

IPC: C09J7/02 ,  B32B38/00 ,  B32B37/18

CPC classification number: C09J7/10 ,  B32B37/182 ,  B32B38/0008 ,  C08G18/12 ,  C08G18/3206 ,  C08G18/4812 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/6674 ,  C08G18/755 ,  C08G2170/20 ,  C08L23/02 ,  C08L23/14 ,  C08L2205/02 ,  C09J5/02 ,  C09J7/00 ,  C09J7/35 ,  C09J7/38 ,  C09J7/385 ,  C09J123/02 ,  C09J123/14 ,  C09J133/08 ,  C09J175/04 ,  C09J175/08 ,  C09J177/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2423/00 ,  C09J2423/10 ,  C09J2433/00 ,  C09J2467/005 ,  C09J2475/00 ,  C09J2477/00 ,  Y10T428/249983 ,  Y10T428/2826 ,  C08G18/758

Abstract: The invention relates to a double-sided adhesive tape having a first outer impact-adhesive side and a second outer side that can be heat activated, comprising an at least two-layer product structure comprising the layers A and B. Layer A is an impact-adhesive layer chemically cross-linked by means of thermal initiation or an impact-adhesive carrier layer chemically cross-linked by means of thermal initiation. Layer B is a layer on the basis of a thermoplastic plastic. Layer A and layer B are in direct contact with each other, and the surface of layer B that is in direct contact with layer A has been corona- or plasma-pretreated. The double-sided adhesive tape is characterized in that the corona or plasma pretreatment is performed in an atmosphere comprising nitrogen, carbon dioxide, or a noble gas or a mixture of at least two of said gases.

Abstract translation: 本发明涉及一种具有第一外部冲击粘合剂侧和可以热活化的第二外侧的双面胶带，其包括包含层A和B的至少两层产品结构。层A是冲击 通过热引发化学交联的粘合层或通过热引发化学交联的冲击粘合剂载体层。 层B是基于热塑性塑料的层。 层A和层B彼此直接接触，并且与层A直接接触的层B的表面已进行电晕或等离子体预处理。 双面胶带的特征在于，电晕或等离子体预处理在包括氮气，二氧化碳或惰性气体或至少两种所述气体的混合物的气氛中进行。

公开(公告)号：US20150140738A1

公开(公告)日：2015-05-21

申请号：US14387783

申请日：2013-03-06

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu Moriyama

IPC: H01L21/78 ,  H01L23/00

CPC classification number: H01L21/78 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/11002 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27002 ,  H01L2224/27436 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10T403/479 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/0665 ,  H01L2924/207 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0532

Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.

Abstract translation: 提供能够提供与相对电极的良好结合的电路连接材料，以及使用该电路连接材料的半导体器件制造方法。 本发明使用其中粘附到半导体芯片侧的第一粘合剂层和具有比第一粘合剂层更高的最低熔融粘度达到温度的第二粘合剂层的电路连接材料。 当电路连接材料被卡住的半导体芯片安装在电路板上时，第一粘合层的厚度在满足公式（1）的范围内，从而与相对电极提供良好的结合。

公开(公告)号：US20140370221A1

公开(公告)日：2014-12-18

申请号：US14302870

申请日：2014-06-12

Applicant: Nitto Denko Corporation ,  Nitto Denko America, Inc. ,  Nitto Denko Automotive New Jersey, Inc.

Inventor： Yu-chu Chen ,  Shigeki Muta

IPC: C09J7/02 ,  C09J7/04

CPC classification number: C09J7/22 ,  C08K5/0066 ,  C09J7/21 ,  C09J7/26 ,  C09J7/30 ,  C09J7/38 ,  C09J11/02 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2203/314 ,  C09J2205/102 ,  C09J2400/143 ,  C09J2400/243 ,  C09J2400/283 ,  C09J2421/00 ,  Y10T428/1405 ,  Y10T428/24942 ,  Y10T428/249983 ,  Y10T442/209

Abstract: A lightweight two-sided adhesive tape containing a porous substrate interposed between a first adhesive layer and a second adhesive layer capable of being removed from a surface without leaving significant amounts of adhesive residue on the surface. The first adhesive layer contains one or more adhesives, and one or more powders. The second adhesive layer contains one or more adhesives, and optionally, one or more powders.

Abstract translation: 一种轻质的双面胶带，其包含介于第一粘合剂层和能够从表面除去的第二粘合剂层之间的多孔基材，而不会在表面上留下大量的粘合剂残留物。 第一粘合剂层含有一种或多种粘合剂和一种或多种粉末。 第二粘合剂层含有一种或多种粘合剂，以及任选的一种或多种粉末。

公开(公告)号：US20140251537A1

公开(公告)日：2014-09-11

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke SATO ,  Junichi NISHIMURA ,  Ryosuke ODAKA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。

公开(公告)号：US20140193598A1

公开(公告)日：2014-07-10

申请号：US14237113

申请日：2012-08-08

Applicant: Steffen Traser ,  Jan D. Forster ,  Bernd Kuehneweg ,  Tobias Pick

Inventor： Steffen Traser ,  Jan D. Forster ,  Bernd Kuehneweg ,  Tobias Pick

IPC: C09J7/02

CPC classification number: B32B17/064 ,  C08L2312/00 ,  C09J7/10 ,  C09J133/02 ,  C09J133/06 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2433/00 ,  Y10T428/1452 ,  Y10T428/24942 ,  Y10T428/24959

Abstract: A multilayer pressure sensitive adhesive (PSA) film having a first acrylic pressure sensitive adhesive layer and an opposing second acrylic pressure sensitive adhesive layer, wherein the first pressure sensitive adhesive layer has a glass transition temperature Tg≧0° C. and a content of a strongly polar acrylate of 7.5 to 15 wt.-% in its precursor, and the second pressure sensitive adhesive layer has a Tg≦0° C. and contains 0.5 to 12 wt.-% of a strongly polar acrylate in its precursor, wherein the content of the strongly polar acrylate of the precursor of the first pressure sensitive adhesive layer exceeds the content of the strongly polar acrylate of the precursor of the second pressure sensitive adhesive layer by at least 2 wt.-% and wherein the Tg of the first pressure sensitive adhesive layer exceeds the Tg of the second pressure sensitive adhesive layer by at least 5° C.

Abstract translation: 一种具有第一丙烯酸压敏粘合剂层和相对的第二丙烯酸压敏粘合剂层的多层压敏粘合剂（PSA）膜，其中第一压敏粘合剂层的玻璃化转变温度Tg≥0℃， 其极性丙烯酸酯在其前体中为7.5至15重量％，第二压敏粘合剂层的Tg和nlE为0℃，并且在其前体中含有0.5-12重量％的极性极强的丙烯酸酯，其中 第一压敏粘合剂层的前体的强极性丙烯酸酯的含量超过第二压敏粘合剂层的前体的强极性丙烯酸酯的含量至少2重量％，并且其中第一压力的Tg 粘合剂层超过第二压敏粘合剂层的Tg至少5℃。

公开(公告)号：US20140083608A1

公开(公告)日：2014-03-27

申请号：US14114964

申请日：2012-05-04

Applicant: tesa SE

Inventor： Thomas Schubert ,  Arne Koops ,  Sarah Reich

IPC: C09J7/02

CPC classification number: C09J7/00 ,  B29B7/485 ,  B29B7/82 ,  B29B7/86 ,  B32B27/08 ,  B32B27/16 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  B32B2405/00 ,  C08G18/12 ,  C08G18/227 ,  C08G18/3206 ,  C08G18/4812 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/6674 ,  C08G18/755 ,  C08G2170/40 ,  C08J5/128 ,  C08J2323/16 ,  C09J5/02 ,  C09J7/10 ,  C09J123/16 ,  C09J175/08 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2423/00 ,  C09J2423/10 ,  C09J2433/00 ,  C09J2475/00 ,  Y10T428/2826 ,  C08G18/758

Abstract: A process increases adhesion between a layer of pressure-sensitive adhesive and a substrate, wherein the layer of pressure-sensitive adhesive has a first surface facing away from the substrate and a second surface facing toward the substrate and a third surface of the substrate. The process treats (i) the second surface of the layer of pressure-sensitive adhesive that faces toward the substrate and (ii) the third surface of the substrate with atmospheric-pressure plasma, and adhesive bonds the layer of pressure-sensitive adhesive to the third surface of the substrate.

Abstract translation: 一种方法增加了一层压敏粘合剂和基材之间的粘合性，其中压敏粘合剂层具有背离基材的第一表面和面向基材的第二表面和基材的第三表面。 该方法处理（i）面向基板的压敏粘合剂层的第二表面和（ii）具有大气压等离子体的基板的第三表面，并且粘合剂将压敏粘合剂层粘合到 基板的第三表面。

公开(公告)号：US20140023861A1

公开(公告)日：2014-01-23

申请号：US13945030

申请日：2013-07-18

Applicant: NITTO DENKO CORPORATION

Inventor： Masaaki SATOU ,  Yoshikazu SOEDA ,  Hiroshi WADA

IPC: C09J7/02

CPC classification number: C09J7/22 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/266

Abstract: A pressure-sensitive adhesive sheet including a plastic substrate having a thickness of more than 0 μm and less than 2.0 μm and a pressure-sensitive adhesive layer on at least one side of the plastic substrate. The pressure-sensitive adhesive layer contains an acrylic polymer or a rubber-based polymer in an amount of 50 wt % or more relative to a total amount of the pressure-sensitive adhesive layer. The acrylic polymer is formed of a monomer mixture containing the specific alkyl (meth)acrylate monomer in an amount of 50.0 to 99.8 wt % relative to a total amount of monomer components and a polar group-containing monomer in an amount of 0.01 to 20 wt % relative to the total amount of monomer components.

Abstract translation: 一种压敏粘合片，其包括厚度大于0μm且小于2.0μm的塑料基材和在所述塑料基材的至少一侧上的压敏粘合剂层。 压敏粘合剂层含有相对于压敏粘合剂层的总量为50重量％以上的丙烯酸系聚合物或橡胶系聚合物。 丙烯酸类聚合物由单体混合物形成，该单体混合物相对于单体组分和极性基团单体的总量为50重量％至99.8重量％，含量为0.01-20重量％的（甲基）丙烯酸烷基酯单体 ％相对于单体组分的总量。