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    Printable composition with nanostructures of first and second types
    264.
    发明申请
    Printable composition with nanostructures of first and second types 审中-公开
    具有第一类和第二类纳米结构的可印刷组合物

    公开(公告)号：US20100288534A1

    公开(公告)日：2010-11-18

    申请号：US12011353

    申请日：2008-01-24

    Applicant: Alfred I-Tsung Pan ,  Scott T. Haubrich

    Inventor： Alfred I-Tsung Pan ,  Scott T. Haubrich

    IPC: H05K1/00 ,  B05C11/00

    CPC classification number: H05K1/097 ,  H01B1/22 ,  H01B1/24 ,  H01L21/288 ,  H01L21/76801 ,  H01L29/78681 ,  H01L29/7869 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0323 ,  Y10T428/2982

    Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

    Abstract translation: 描述了通过印刷和固化形成印刷元件的可印刷组合物。 可印刷组合物包括第一类型的多个纳米结构，其在印刷和固化时形成限定中间体积的布置。 可印刷组合物还包括第二类型的多个纳米结构，其在印刷和固化时至少部分地填充中间体积以促进印刷元件中的光滑表面形貌和降低的孔隙率。

    Method for soldering electronic component and soldering structure of electronic component
    267.
    发明授权
    Method for soldering electronic component and soldering structure of electronic component 有权
    焊接电子部件的方法和电子部件的焊接结构

    公开(公告)号：US07632710B2

    公开(公告)日：2009-12-15

    申请号：US11817522

    申请日：2006-11-10

    Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488

    CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT
    268.
    发明申请
    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT 有权
    焊接电子元件的方法和电子元器件的焊接结构

    公开(公告)号：US20090233117A1

    公开(公告)日：2009-09-17

    申请号：US11817522

    申请日：2006-11-10

    Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC: B32B15/04 ,  B23K31/02 ,  B23K1/20

    CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

    CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD
    269.
    发明申请
    CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD 审中-公开
    电路板模块和制造方法

    公开(公告)号：US20090175019A1

    公开(公告)日：2009-07-09

    申请号：US12299561

    申请日：2008-02-08

    Applicant: Keiji Koyama ,  Masamichi Yamamoto ,  Katsunari Mikage ,  Jin-Joo Park

    Inventor： Keiji Koyama ,  Masamichi Yamamoto ,  Katsunari Mikage ,  Jin-Joo Park

    IPC: H05K1/14 ,  H01L21/98

    CPC classification number: H05K3/323 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/07811 ,  H05K1/147 ,  H05K1/181 ,  H05K3/361 ,  H05K2201/0248 ,  H05K2201/10378 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: [Problem]To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC.[Means for Solving the Problem]Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.

    Abstract translation: [问题]能够将要连接到FPC的PCB上的连接部分的背面的部件安装在背面。 [解决问题的方法]连接部件设置成使得第一电路板的导体布线和第二电路板的导体布线与各向异性导电粘合剂连接，所述各向异性导电粘合剂由包括针状或线性的绝缘树脂制成 在厚度方向上取向的链状金属粉末，即粘附方向，一部分安装在第一和第二电路板中的至少一个中，该部分安装在与表面相对的背面的背面上 其中连接部分形成。

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