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公开(公告)号:JP3679324B2
公开(公告)日:2005-08-03
申请号:JP2000343934
申请日:2000-11-10
Inventor: マリア ボルネオ アントニオ , サリナリ ランフランコ
CPC classification number: G06T5/002 , G06T5/20 , G06T5/50 , G06T2207/10016 , G06T2207/20182 , H04N5/21 , H04N19/80
Abstract: A method of filtering noise of digital pictures comprises selecting a first set of pixels (WORKING_WINDOW) constituted by the union of a pixel of the current picture to be filtered (P) and of a second set of pixels temporally and spatially near (PIXEL_NEAR) to said pixel, calculating a certain number (N) of extended sums (SUMkj) of values assumed by as many pre-established weight functions of the intensity of a selected video component (kj) on the first set of pixels (WORKING_WINDOW). The pixels of the second set of pixels near (PIXEL_NEAR) can belong to the current picture or to a preceding picture. Several noise filters for digital pictures implementing the method of the invention are also presented.
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公开(公告)号:JP3653595B2
公开(公告)日:2005-05-25
申请号:JP5274994
申请日:1994-02-24
Inventor: エンリコ・マリア・アルフォンソ・ラヴァネリ , フラヴィオ・ヴィラ
IPC: H01L21/336 , H01L29/10 , H01L29/78
CPC classification number: H01L29/7816 , H01L29/0878 , H01L29/1083 , H01L29/66659 , Y10S148/126
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公开(公告)号:JP2004134763A
公开(公告)日:2004-04-30
申请号:JP2003307928
申请日:2003-08-29
Applicant: Nokia Corp , Stmicroelectronics Srl , エスティーマイクロエレクトロニクスエス.アール.エルSTMicroelectronics S.r.l. , ノキア コーポレイションNokia Corporation
Inventor: ZERBINI SARAH , MERASSI ANGELO , SPINOLA DURANTE GUIDO , DE MASI BIAGIO
IPC: G01P21/00 , B81B3/00 , G01P1/02 , G01P15/06 , G01P15/08 , G01P15/18 , H01H1/00 , H01H35/14 , H01L29/84
CPC classification number: H01H1/0036 , G01P1/023 , G01P15/06 , G01P15/0802 , G01P15/0891 , G01P15/18 , G01P2015/0814 , H01H35/146
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an inertial sensor having a failure threshold.
SOLUTION: A process of manufacturing the inertial sensor, having a failure threshold includes the steps of: on the substrate 2 of a semiconductor wafer 1, forming at least one sample element 6 embedded in a sacrificial region 3 and 12; on the sacrificial region 3 and 12, forming a body 18 connected to the sample element 6; and etching the sacrificial region 3 and 12 to free the body 18 and the sample element 6.
COPYRIGHT: (C)2004,JPO
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