Abstract:
PROBLEM TO BE SOLVED: To realize a power supply circuit for plasma generation, and a plasma generator capable of smoothly obtaining a plenty of generated plasma without having the device larger-sized, as well as a plasma treatment device capable of putting a plenty of treated objects under plasma treatment at low cost and a target item having target quality passing the plasma treatment, with the use of such a plasma generator. SOLUTION: An LC series circuit serially connecting a capacitor C and a coil L is provided between one of the outputs of an alternate high-voltage generating circuit generating alternate high voltage to be impressed between each electrode for discharge generation consisting of two or more first electrodes and one or more second electrodes and the above first electrodes. When discharge is generated at one of the electrode pairs, voltage fall is restrained by the coil even if discharge of the capacitor is progressed, and discharge by the other electrode pair is induced without being intervened, so that a plenty of plasma can be smoothly generated with a common use of the alternate high-voltage generating circuit. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma-generating electrode capable of stably and surely generating discharge between opposing electrodes and continuously generating plasma with ease, and to provide a plasma generator and a plasma treatment device. SOLUTION: On the plasma-generating electrode 4 for generating plasma between electrodes 4a, 4b, sharp protrusions 4g facing each other are formed at least on one electrode 4a of the electrode A so as to generate a discharge between the protrusion 4g and the electrode 4b at another side, and to generate a plasma. The sharp protrusions 4g may be formed in any shape. If only any fluid is made to flow from a flow feeder 7, required air plasma or liquid plasma can be generated. If a matter to be treated is treated with the plasma, a plasma device such as a film-forming device, a processing device, and a powder treatment device can be constituted. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To thickly and uniformly deposit a DLC (Diamond Like Carbon) film on the surface of a base material such as a low melting point alloy, copper, brass or the like with high adhesion while suppressing the increase of the temperature rise in the base material itself. SOLUTION: A high frequency power source 11 for plasma generation and a power source 12 for high voltage pulse generation are connected to a superimposition apparatus 9. Further, the superimposition apparatus 9 is connected to a base material 1 in a chamber 2 via a common feed through 8, a high frequency pulse is applied to the base material 1 from a high frequency power source 11 for plasma generation, and a negative high voltage pulse is applied to the base material 1 from the power source 12 for high voltage pulse generation in the plasma or afterglow plasma. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a submerged plasma generating method, a submerged plasma generating device, a processed liquid purifying device, and an ion containing liquid creating device which highly efficiently create submerged plasma.SOLUTION: A porous dielectric 2 having numerous continuous holes 24 is provided. A mixed liquid containing a liquid or an operation gas is supplied from a conductivity introduction part 14 to the continuous holes 24 of the porous dielectric 2, and a voltage is applied to the porous dielectric 2 to generate electric discharge within the numerous continuous holes 24. Thus, plasma generates within the numerous continuous holes 24 to create liquid derived plasma and/or operation gas derived plasma.
Abstract:
PROBLEM TO BE SOLVED: To provide a powder solubilization method in which surface modification treatment of slightly soluble powder such as a CNM is accelerated, and thereby which can perform a lot of surface modification treatment by low cost, and to provide a powder solubilization apparatus which can perform powder solubilization treatment based on the powder solubilization method.SOLUTION: A termination part 5 of a stirring member 4 is made a counter electrode of an electrode 14 in liquid, and a synthetic voltage V of a high voltage high frequency pulse generator 17 is impressed between both electrodes. A CNT at a vicinity of a water surface 32 or a CNT 11 which floats on a water surface 32 serves as a powder electrode by impression of the synthetic voltage V, and makes a plasma discharge 27 in liquid generate with the electrode 14 in liquid. A circumference of the electrode 14 in liquid reaches a boiling status by the plasma discharge 27 in liquid, an active water steam 28 containing radicals such as Hand OHarises. The floating CNT powder is made hydrophilic in such that a hydration layer is formed at a CNT circumference by contacting with the active water steam 28 and the plasma in liquid.
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma treatment device and a treatment method for preventing damages by plasma on conductive/semi-conductive treated surface or a conductive/semi-conductive treated thin film by efficiently applying a plasma treatment on the surface or the thin film in an atmospheric pressure. SOLUTION: The plasma formation device 2 is composed of a plasma generation part 4 with a gliding arc electrode pair 18 with a distance between the electrodes becoming larger toward a working gas moving direction and an emission port 20 emitting plasma to the plasma generation part 4, with a tip of the electrode pair 18 located inside the emission port 20. The working gas 14 above or near an atmospheric pressure is to be supplied between the electrodes by a working gas supply means and arc 4a generated between the electrodes at impression of voltage produces gliding arc moving toward a wider opening of the electrodes to form plasma. The plasma formation device 2 radiates this plasma from the emission port 20. COPYRIGHT: (C)2007,JPO&INPIT