Abstract:
An integrated optical package comprises an integrated optical device in a substantially planar form and a supporting structure, the device being held by the supporting structure in a plurality of fixing regions, the fixing regions being elongate and serving to secure the device in each of the two dimensions of the planar form, at least one edge of the planar form being unfixed. Thus, either two or three edges of the planar form are unfixed, assuming that the device is rectangular. This ensures that one or two edges are free, allowing the device to accommodate stresses by slight relaxation. The device can be held by a heat curable composition, ideally adapted to cure at about the operating temperature of the device. Thus, when the device is operating, the adhesive is substantially at or near its cure temperature. The composition should cure at a temperature within 20null C. of the operating temperature of the device. Given the normal operating temperatures of AWG devices, suitable cure temperatures are between 60 and 90null C., more preferably between 70 and 80null C. or 70 to 75null C. The composition is preferably resilient after curing to assist further in reducing stresses in the device. The application also relates to an integrated optical package comprising an integrated optical device in a substantially planar form, a supporting structure, controlled heating apparatus to elevate the temperature of the device to within a selected temperature range, the device being attached to the supporting structure by a curable composition with a curing temperature within about 20null C. of the selected temperature range.
Abstract:
A device comprises a tapered semiconductor optical waveguide which tapers, at an angle of taper with respect to a longitudinal axis of the waveguide, from a relatively wide region to a relatively narrow region, wherein the angle of taper varies along the length of the tapered waveguide such that at all points along the taper it is no greater than, and within a substantially constant angular separation of, the adiabatic limit of the fundamental mode of the waveguide at that point along the taper.
Abstract:
A wavelength-dispersive device for processing a multi-channel optic signal, the device including an optic chip defining first and second diffraction gratings coupled via a first free propagation region, the second diffraction grating coupled at its output end to an array of light-receiving elements via a second free propagation region, each light-receiving element positioned to selectively receive a respective channel of the multi-channel signal, and wherein the first free propagation region includes a spatial filter defined by selective doping of the optic chip so as to preferentially transmit a selected portion of the output from the first diffraction grating to the second diffraction grating and thereby reduce cross-talk at the array of light-receiving elements.
Abstract:
A method for holding an end of at least one optic fibre in alignment for optical communication with an end of a respective optic element at a side edge of an optic chip; the method including the steps of: providing a fibre support supporting at least one optic fibre; assembling the fibre support and the optic chip so as to align the end of the at least one optic fibre with the end of the respective optic element at the side edge of the optic chip, wherein the fibre support includes a first portion that is configured to extend beyond the side edge over the optic chip when the end of the at least one optic fibre is aligned with the end of the respective optic element at the side edge; and then bonding said first portion of the fibre support to the optic chip to secure the fibre support to the optic chip.
Abstract:
An optical chip (10;110) has a surface (3;103) with an edge (7;107), an optical component (5;105) disposed on the surface spaced from the edge and an optically conductive element (33;133) extending from the optical component to the edge through which the optical component is able to be optically coupled with an optical fiber (25).
Abstract:
A device 102 incorporating a sensor 106 for sensing a temperature of the device and/or a local heater 106 for the provision of heat to a minority area within the device, wherein the sensor and/or the local heater comprises at least one semiconductor element 302,804 which is fabricated as part of the device. The present invention provides a temperature sensor and/or local heater which is fabricated as an integral part of a device. This provides the advantages of a saving of in-device package space, and allows greater versatility in sensor/local heater location.
Abstract:
An optical coupling between first and second optical components 1, 8 in which an input face 2A through which light is to pass of the first component 1 being directly bonded to an output face 8C through which light is to pass of the second component 8. Such a coupling may be provided, for example, between a rib waveguide 2 and an optical fibre 7.
Abstract:
An electro-optic device is disclosed for altering the density of charge carriers within an integrated optical waveguide. The device includes a substrate, and an integrated optical waveguide extending across the substrate with two doped regions being provided such that an electrical signal can be applied across the doped regions to alter the density of charge carriers within the waveguide. The doped regions can each include a plurality of doped areas spaced apart from each other along the length of the waveguide.
Abstract:
An isolation device that can be used for providing optical and electrical isolation between areas of an integrated chip. The isolation device includes three doped elongate regions which form diodes which can be connected in series. The isolation device can be used in optical devices or optical attenuators.
Abstract:
A dispersive optical waveguide device comprising an array of curved silicon rib waveguides providing optical paths in parallel between a first optical coupler at one end of the array and a second optical coupler at an opposite end of the array. The ends of the array waveguides adjacent to the second coupler are distributed around a first arcuate edge of the second coupler forming part of a first circle. A plurality of connecting waveguides terminating at a second arcuate edge of the second coupler face the first arcuate edge of the second coupler. The second arcuate edge forms part of a second circle having a radius of curvature which is half the radius of curvature of the first circle and has its perimeter coincident with the perimeter of the first circle adjacent the ends of the array waveguides.