公开(公告)号：US20070160855A1

公开(公告)日：2007-07-12

申请号：US11309611

申请日：2006-08-31

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: B32B5/16

CPC classification number: C08L83/08 ,  C08K3/10 ,  C08K3/22 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2982 ,  Y10T428/31663 ,  C08L83/00

Abstract: A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.

Abstract translation: 热界面材料包括100重量份的基础油，包括氨基改性的硅氧烷流体和甲基苯基硅酮流体和氟硅酮流体中的至少一种，以及填充在基础油中的800至1200重量份的填料。 填料的平均粒径为0.1-5μm，选自氧化锌粉末，氧化铝粉末和金属铝粉末。

公开(公告)号：US20060207751A1

公开(公告)日：2006-09-21

申请号：US11292253

申请日：2005-12-01

Applicant: Chu-Wan Hong ,  Ching-Tai Cheng ,  Jung-Yuan Wu ,  Chang-Ting Lo

Inventor： Chu-Wan Hong ,  Ching-Tai Cheng ,  Jung-Yuan Wu ,  Chang-Ting Lo

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: A heat pipe includes a hollow tube, a working medium filled in the tube, and a wick structure disposed in and contacting with the tube. The wick structure is formed by weaving first wires and second wires together. The second wires each have two opposite major surfaces. A portion of one of the two major surfaces contacts with an interior wall of the tube.

Abstract translation: 热管包括中空管，填充在管中的工作介质和设置在管中并与管接触的芯结构。 芯结构通过将第一线和第二线编织在一起而形成。 第二根导线各有两个相对的主表面。 两个主表面中的一个的一部分与管的内壁接触。

公开(公告)号：US20060198753A1

公开(公告)日：2006-09-07

申请号：US11306061

申请日：2005-12-15

Applicant: Chu-Wan Hong ,  Chang-Ting Lo ,  Ching-Tai Cheng ,  Jung-Yuan Wu

Inventor： Chu-Wan Hong ,  Chang-Ting Lo ,  Ching-Tai Cheng ,  Jung-Yuan Wu

IPC: B22F5/00 ,  B22F3/10

CPC classification number: B22F1/0014 ,  B22F3/1035 ,  B22F3/1103 ,  F28D15/046

Abstract: A method is disclosed to produce a wick structure for a heat pipe. The wick structure is a sintered powder wick and is produced by sintering process. A group of powders is firstly provided. The group of powders is then classified into many sub-groups in terms of powder size. At least one sub-group of the powders is selected to form the wick structure via the sintering process. Thus, the powders used to construct the wick structure are confined to powders having a relatively narrower range of powder size in relative to the group of powders as originally provided. This has greatly reduced the complexity involved in the sintering process, and as a result, the required sintering temperature and the required time for the sintering process are easier to be determined.

Abstract translation: 公开了一种制造用于热管的芯结构的方法。 芯结构是烧结粉末芯，通过烧结工艺制造。 首先提供一组粉末。 然后根据粉末尺寸将该组粉末分成许多亚组。 选择粉末的至少一个子组以通过烧结工艺形成芯组织。 因此，用于构造芯结构的粉末被限制为相对于最初提供的粉末组具有相对较窄的粉末尺寸范围的粉末。 这大大降低了烧结过程中的复杂性，因此，烧结过程所需的烧结温度和所需的时间更容易确定。

公开(公告)号：US20060197245A1

公开(公告)日：2006-09-07

申请号：US11306192

申请日：2005-12-19

Applicant: Ching-Tai Cheng ,  Jung-Yuan Wu ,  Chu-Wan Hong ,  Chang-Ting Lo

Inventor： Ching-Tai Cheng ,  Jung-Yuan Wu ,  Chu-Wan Hong ,  Chang-Ting Lo

IPC: F27D1/16 ,  E04B1/16 ,  B29C63/06

CPC classification number: F27D1/16 ,  F16L9/10 ,  F16L9/14

Abstract: A method is disclosed to produce a heat pipe with a sintered powder wick formed inside the heat pipe. The method employs tape-casting technology to firstly produce thin sheets of powder and then these sheets are sintered to form the wick. In the tape casting procedure, a slurry of the powders necessary to construct said wick is cast onto a moving surface to form a slurry layer and then the slurry layer is dried to form a green tape. The green tape is rolled onto a mandrel and then is inserted into a hollow casing and sintered to cause the powders in the green tape to diffusion-bond together. Thus, the sintered powder wick is constructed.

Abstract translation: 公开了一种制造热管的方法，该热管具有在热管内形成的烧结粉末芯。 该方法采用胶带铸造技术首先生产薄片粉末，然后将这些片材烧结形成芯片。 在胶带铸造过程中，将构成所述芯的必要粉末的浆料浇铸到移动表面上以形成浆料层，然后将浆料层干燥以形成生带。 将生胶带卷在心轴上，然后插入中空壳体中并烧结，使生胶带中的粉末扩散粘合在一起。 因此，构造了烧结的粉末灯芯。

公开(公告)号：US20060162907A1

公开(公告)日：2006-07-27

申请号：US11291879

申请日：2005-12-01

Applicant: Jung-Yuan Wu ,  Chu-Wan Hong ,  Chang-Ting Lo ,  Ching-Tai Cheng

Inventor： Jung-Yuan Wu ,  Chu-Wan Hong ,  Chang-Ting Lo ,  Ching-Tai Cheng

IPC: F28D15/02

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a casing (12) and a sintered powder wick (14) arranged at an inner surface of the casing. The sintered powder wick is in the form of a multi-layer structure of at least three layers and each layer has an average powder size different from that of the other layers, wherein the layer (143) with large-sized powders is capable of reducing the flow resistance to the condensed liquid to flow back while the layer (141) with small-sized powders is still capable of providing a relatively large capillary force for the wick.

Abstract translation: 热管（10）包括壳体（12）和布置在壳体的内表面处的烧结粉末灯芯（14）。 烧结的粉末芯是至少三层的多层结构形式，并且每个层的平均粉末尺寸与其它层的平均粉末尺寸不同，其中具有大尺寸粉末的层（143）能够减少 当具有小尺寸粉末的层（141）仍然能够为芯提供相对较大的毛细管力时，对冷凝液体的流动阻力回流。

公开(公告)号：US20080123023A1

公开(公告)日：2008-05-29

申请号：US11468363

申请日：2006-08-30

Applicant: TRUNG DOAN ,  Wen-Huang Liu ,  Jui-Kang Yen ,  Yung-Wei Chen ,  Ching-Tai Cheng

Inventor： TRUNG DOAN ,  Wen-Huang Liu ,  Jui-Kang Yen ,  Yung-Wei Chen ,  Ching-Tai Cheng

IPC: G02F1/1335 ,  F21V9/16

CPC classification number: G02B6/0068 ,  G02B6/0073 ,  G02F1/133603 ,  G02F2001/133614

Abstract: A white light source using solid state technology, as well as general backlight units and liquid crystal displays (LCDs) that may incorporate such a white light source, are provided. The white light source described herein utilizes a monochrome light-emitting diode (LED) and a wavelength-converting layer having fluorescent materials to produce a substantially uniform broadband optical spectrum visible as white light. Being constructed on a metal substrate, the white light source may also provide for an improved heat transfer path over conventional solid state white light sources.

Abstract translation: 提供了使用固态技术的白光源以及可并入这种白光源的通用背光单元和液晶显示器（LCD）。 本文所述的白光源使用具有荧光材料的单色发光二极管（LED）和波长转换层，以产生可视为白光的基本均匀的宽带光谱。 在金属基板上构造，白光源也可以提供比常规固态白光源更好的传热路径。

公开(公告)号：US20070167564A1

公开(公告)日：2007-07-19

申请号：US11309251

申请日：2006-07-20

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: C08L83/04 ,  B32B27/00

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00

Abstract: A heat conductive silicone composition comprises: (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups therein, (C) a filler of aluminum powder or metal oxide powder, and (D) a coupling agent selected from titanate-based or aluminate-based coupling agent.

Abstract translation: 导热硅氧烷组合物包括：（A）含有烯基的有机聚硅氧烷，（B）其中具有至少两个Si-H基团的有机氢聚硅氧烷，（C）铝粉末或金属氧化物粉末的填料，和（D） 选自钛酸酯基或铝酸酯基偶联剂的偶联剂。

公开(公告)号：US20070161517A1

公开(公告)日：2007-07-12

申请号：US11309914

申请日：2006-10-27

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C10M169/04 ,  B01D19/04

CPC classification number: C10M169/06 ,  C10M169/04 ,  C10M2201/0606 ,  C10M2201/0626 ,  C10M2227/09 ,  C10M2229/025 ,  C10N2210/03 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2230/60 ,  C10N2250/10

Abstract: A silicone grease composition includes approximately 5 to 50% by weight of liquid organopolysiloxane, 45 to 94.9% by weight of a thermally conductive filler, and 0.1 to 5% by weight of a coupling agent chosen from at least one of a titanate-based coupling agent and an aluminate-based coupling agent. Due to the presence of the coupling agent, the silicone grease composition has a relatively lower viscosity and thus is capable of containing a larger amount of the filler whereby the thermally conductive efficiency of the composition is accordingly improved.

Abstract translation: 硅油润滑脂组合物包括约5至50重量％的液体有机基聚硅氧烷，45至94.9重量％的导热填料和0.1至5重量％的偶联剂，其选自至少一种钛酸酯基偶联剂 助剂和铝酸盐基偶联剂。 由于偶联剂的存在，硅脂润滑脂组合物具有相对较低的粘度，因此能够含有更多量的填料，由此相应地提高了组合物的导热效率。

公开(公告)号：US20070151416A1

公开(公告)日：2007-07-05

申请号：US11309463

申请日：2006-08-10

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: C22C1/05

CPC classification number: B22F1/0059 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 100 parts by weight of alkenyl groups-containing organopolysiloxane, and Si—H groups-containing compound selected from the group consisting of organo-hydrogenpolysiloxane and polyorganohydrogensiloxane, and 800 to 1200 parts by weight of fillers consisting of aluminum powder having a mean particle size of 0.1 to 1 um and zinc oxide powder having a mean particle size of 1 to 5 um in a weight ratio of from 1/1 to 10/1 .

Abstract translation: 半导体装置（10）包括热源（12），用于散热由热源产生的热量的散热部件（13）和填充在热源和热源之间的空间中的热界面材料（14） 消散部件。 热界面材料包括100重量份的含烯基的有机聚硅氧烷和选自有机 - 氢聚硅氧烷和聚有机氢硅氧烷的含Si-H基团的化合物，以及800至1200重量份的由具有 平均粒径为0.1〜1μm，平均粒径为1〜5μm的氧化锌粉末的重量比为1/1〜10/1。

公开(公告)号：US20070131897A1

公开(公告)日：2007-06-14

申请号：US11521918

申请日：2006-09-15

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C09K3/18 ,  F28F7/00

CPC classification number: H01L23/42 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

Abstract translation: 热界面材料用于施加到接触表面以消除散热装置和电子部件之间的空气间隙，以便改善电子部件的散热。 热界面材料包括作为基础油的季戊四醇油酸酯和填充在油酸季戊四醇酯中的填料，用于改善热界面材料的导热性。 油酸季戊四醇用于保持其中的填料并填充空气间隙以实现散热装置和电子部件之间的紧密接触。 填料包括铝粉，氧化锌粉和氧化锌纳米颗粒。