公开(公告)号：US08480298B2

公开(公告)日：2013-07-09

申请号：US13123566

申请日：2009-10-05

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: G01K1/08 ,  G01K1/00

CPC classification number: G01R1/06733 ,  G01R1/06705 ,  G01R1/073 ,  H01L21/76897 ,  H01L24/75

Abstract: A device for positioning and contacting test contacts on a contact carrier for producing a test contact arrangement includes at least one contact head having at least one transmission channel for transmitting thermal energy. The contact head being equipped with a equipped with a test contact receptacle. The test contact receptacle includes a positioning device with at least two positioning faces for the positioned abutment against a test contact and the positioning of the test contact with an absorption region for absorbing the thermal energy in the channel mouth.

Abstract translation: 用于在接触载体上定位和接触测试触点以产生测试接触装置的装置包括具有至少一个用于传输热能的传输通道的至少一个接触头。 接触头装有一个配有测试接触插座的接头。 测试接触插座包括定位装置，该定位装置具有至少两个定位面，用于定位的抵靠测试接触点的位置以及测试接触件与用于吸收通道口中的热能的吸收区域的定位。

公开(公告)号：US08330076B2

公开(公告)日：2012-12-11

申请号：US12668508

申请日：2008-06-10

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: B23K26/06

CPC classification number: B23K1/018 ,  B23K3/029 ,  B23K26/1476

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract translation: 本发明涉及一种用于将焊料材料沉积物（12）从衬底（10）分离的方法和装置，其中具有接收开口（22）的接收套筒（19）定位成与焊料材料沉积物重叠 以基本上密封的方式使接收开口的开口边缘（21）与基板抵接的方式布置在基板上，焊料材料沉积物经受热能和套管腔（23），套管腔 由接收套筒限定并且横向于接收套筒的纵向轴线（30）设置的受到接收套筒的输出装置（29）的空气流（28）的限制。

公开(公告)号：US08256131B2

公开(公告)日：2012-09-04

申请号：US10582421

申请日：2004-12-22

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: F26B3/30

CPC classification number: H01L21/67034 ,  F26B3/30

Abstract: Method and device for drying circuit substrates (13), in particular semiconductor substrates, in which a circuit surface (30) of the circuit substrate is flushed using a flushing liquid (10) in a flushing step and the circuit surface is dried in a subsequent drying step, the circuit substrate being moved in the flushing step in the direction of its planar extension transversely and in relation to a liquid level (28) of the flushing liquid in such a way that a liquid meniscus forms at a transition area between the circuit surface and the liquid level, which changes because of the relative movement, and thermal radiation (36) is applied to the transition area wetted by the liquid meniscus in the drying step.

Abstract translation: 用于干燥电路基板（13）的方法和装置，特别是在冲洗步骤中使用冲洗液（10）冲洗电路基板的电路表面（30）的电路基板（13），并且电路表面随后被干燥 干燥步骤，电路基板在冲洗步骤中沿其平面延伸方向横向移动并相对于冲洗液体的液面（28）移动，使得液体弯液面在电路之间的过渡区域处形成 表面和由于相对运动而变化的液面，并且在干燥步骤中将热辐射（36）施加到由液体弯液面润湿的过渡区域。

公开(公告)号：US08087163B2

公开(公告)日：2012-01-03

申请号：US12092806

申请日：2006-11-17

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: H05K3/34

CPC classification number: B23K1/0056 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16105 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75253 ,  H01L2224/75743 ,  H01L2224/75822 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required in the connecting areas is achieved by exposing the back of the component to laser energy, a mechanical connecting contact (23) is formed between opposing connecting surfaces (17, 18) of the component and the carrier substrate, and at least one electrically conducting connecting contact (22) is formed between terminal faces (13, 15) of the carrier substrate and of the component arranged at an angle to one another by t least partially melting solder material, whereby the assembly unit manufactured by this method has at least one contact arrangement.

Abstract translation: 本发明涉及一种用于制造微电子部件（11）和载体基板（12）之间的接触装置（10）和通过该方法制造的组装单元（24）的方法，由此在连接区域中所需的热能是 通过将部件的背面暴露于激光能量来实现，在部件和载体基板的相对的连接表面（17,18）之间形成机械连接接触件（23），并且至少一个导电连接接头（22）是 通过至少部分地熔化焊料材料而形成在载体基板的端子面（13,15）和通过至少部分熔融焊料材料彼此成角度配置的部件之间，由此通过该方法制造的组装单元具有至少一个接触装置。

公开(公告)号：US07717316B2

公开(公告)日：2010-05-18

申请号：US11787896

申请日：2007-04-18

Applicant: Ghassem Azdasht ,  Lars Titerle

Inventor： Ghassem Azdasht ,  Lars Titerle

IPC: B23K31/02 ,  B23K3/06

CPC classification number: H05K3/3478 ,  B23K3/0607 ,  B23K3/0623 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/074 ,  H05K2203/086

Abstract: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Abstract translation: 通过将焊料定位在固态中，将焊料施加到基板上的方法，将其熔化，然后通过压缩气体的作用将其冲击到基板上。 该方法使用具有毛细管孔的保持器，其直径在基底端具有其直径（D2）小于焊球的直径（D3），连接到毛细管的能量源和压缩气体 源连接到毛细管。

公开(公告)号：US20080302863A1

公开(公告)日：2008-12-11

申请号：US11666188

申请日：2005-09-26

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: B23K31/02 ,  B23K3/06

CPC classification number: B23K3/0623 ,  H05K3/3478 ,  H05K2201/10734 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum impingement (27) by the isolation unit (12).

Abstract translation: 用于将具有多个焊料沉积物的焊料沉积物配置转移到衬底（36）的接触表面的端子表面构造上的方法和装置，其使用从容纳在焊料沉积容器单元中的焊料沉积物储存器（25）去除多个焊料沉积物 （11），其被实现为模板并且位于焊料沉积物储存器上方，以实现对应于端子表面构造实施的焊料沉积配置，并且使用随后的焊料沉积配置的转移 在衬底的端子表面结构上，焊料沉积储存器通过隔离单元的模板开口（15）通过部分真空冲击，以将焊料沉积物从焊料沉积储存器转移到隔离单元中，焊料沉积储存器（25） 通过位于与隔离单元直径相对的地板壁（20）通风 通过隔离单元（12）引起部分真空冲击（27）。

公开(公告)号：US20080260370A1

公开(公告)日：2008-10-23

申请号：US10583864

申请日：2004-12-22

Applicant: Elke Zakel ,  Ghassem Azdasht

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: G03B15/03

CPC classification number: G02B27/143 ,  G02B27/144

Abstract: Optical system (40) for observing multiple objects (61, 63) positioned distal from one another, having a camera unit (42) comprising a first prism unit (43) positioned on the optical axis (41) and/or in the beam path (47) of the camera unit for producing two partial beam paths (48, 49) as well as two object prism units (51, 52), each of which is situated in a partial beam path and assigned to an object.

Abstract translation: 用于观察彼此远离定位的多个物体（61,63）的光学系统（40），具有相机单元（42），该照相机单元包括位于光轴（41）和/或光束路径中的第一棱镜单元（43） 用于产生两个部分光束路径（48,49）的相机单元（47）以及两个物镜棱镜单元（51,52），每个物镜棱镜单元位于部分光束路径中并被分配给物体。

公开(公告)号：US20080142576A1

公开(公告)日：2008-06-19

申请号：US12036449

申请日：2008-02-25

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: B23K31/02

CPC classification number: H01L24/81 ,  B23K1/0056 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L2224/75611 ,  H01L2224/811 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/111 ,  H01L2924/00

Abstract: A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.

Abstract translation: 一种用于在焊接装置（21）的至少两个接触对接体（22,23）之间生产焊接接头的方法，其中形成的焊料材料（27）布置成与接合装置一段距离。 成形的焊料材料至少部分熔化掉。 至少部分熔化的成形的焊料材料片以这样一种方式推压接合装置，使得两个粘合伙伴在接合区域中被润湿以建立导电接合。

公开(公告)号：US07106599B2

公开(公告)日：2006-09-12

申请号：US10432651

申请日：2001-11-14

Applicant: Ghassem Azdasht

Inventor： Ghassem Azdasht

IPC: H05K7/02

CPC classification number: G06K19/07752 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention pertains to a chip module 20 and a method for producing a chip card module that comprises a chip module with a chip carrier 21 and a chip 22 that is contacted with strip conductors 25, 26 of the chip carrier, wherein the chip carrier comprises a flexible carrier material and the strip conductors respectively extend over the length of the carrier substrate, and wherein the chip carrier 21 contains two longitudinal regions 35, 36 of identical length which are offset relative to one another in the longitudinal direction of the chip carrier and respectively assigned to one strip conductor 25, 26.

Abstract translation: 本发明涉及芯片模块20和芯片卡模块的制造方法，该芯片卡模块包括具有芯片载体21的芯片模块和与芯片载体的带状导体25,26接触的芯片22，其中芯片载体包括 柔性载体材料和带状导体分别在载体基底的长度上延伸，并且其中芯片载体21包含两个相同长度的纵向区域35,36，它们在芯片载体的纵向方向上相对于彼此偏移， 分别分配给一个带状导体25,26。

公开(公告)号：US07087442B2

公开(公告)日：2006-08-08

申请号：US09962553

申请日：2001-09-24

Applicant: Hans-Hermann Oppermann ,  Elke Zakel ,  Ghassem Azdasht ,  Paul Kasulke

Inventor： Hans-Hermann Oppermann ,  Elke Zakel ,  Ghassem Azdasht ,  Paul Kasulke

IPC: G01R31/26 ,  H01L21/66 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L25/0657 ,  H01L25/0652 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to assigned conducting paths (23) of a conducting-path structure (24, 25) arranged on at least one carrier substrate (21, 22) by the chips being arranged transverse to the longitudinal extent of the carrier substrate.

Abstract translation: 用于形成具有布置在多个平面中并彼此电连接的多个芯片（32,36,37,38,39）的空间芯片布置的工艺，其中芯片经由其外围连接表面（33）连接到分配 通过所述芯片布置在至少一个载体基板（21,22）上的导电通路结构（24,25）的导电路径（23）横向于所述载体基板的纵向延伸。