公开(公告)号：US20190201674A1

公开(公告)日：2019-07-04

申请号：US16238457

申请日：2019-01-02

Applicant: MICRODERMICS INC.

Inventor： Boris STOEBER ,  Iman MANSOOR ,  Urs Otto HÄFELI

IPC: A61M37/00 ,  B81C1/00 ,  B21G1/00 ,  B05D1/36

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：US20170312489A1

公开(公告)日：2017-11-02

申请号：US15595891

申请日：2017-05-15

Applicant: MICRODERMICS INC.

Inventor： Boris STOEBER ,  Iman MANSOOR ,  Urs Otto HÄFELI

IPC: A61M37/00 ,  B21G1/00 ,  B81C1/00 ,  B05D1/36

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B05D1/36 ,  B05D2201/06 ,  B21G1/00 ,  B81C1/00111

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：EP3007841A4

公开(公告)日：2017-02-22

申请号：EP14811447

申请日：2014-06-12

Applicant: MICRODERMICS INC

Inventor： STOEBER BORIS ,  MANSOOR IMAN ,  HÄFELI URS OTTO

IPC: B22D25/02 ,  A61M37/00 ,  B21G1/00 ,  B81C1/00

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B05D1/36 ,  B05D2201/06 ,  B21G1/00 ,  B81C1/00111

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模柱; 在模柱上形成有孔导电层; 以及在导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模柱; 在模柱上沉积第一金属层以提供第一微针; 从模柱移除第一微针; 以及在模柱上沉积第二金属层以提供第二微针。

公开(公告)号：EP3600521A1

公开(公告)日：2020-02-05

申请号：EP18771355.7

申请日：2018-03-13

Applicant: Microdermics Inc.

Inventor： MANSOOR, Iman ,  RANAMUKHAARACHCHI, Sahan Anupama ,  RAEISZADEH, Mehrsa ,  STOEBER, Boris

IPC: A61M37/00 ,  A61N1/18

公开(公告)号：EP3007841A1

公开(公告)日：2016-04-20

申请号：EP14811447.3

申请日：2014-06-12

Applicant: Microdermics Inc.

Inventor： STOEBER, Boris ,  MANSOOR, Iman ,  HÄFELI, Urs Otto

IPC: B22D25/02 ,  B21G1/00 ,  A61M37/00

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B05D1/36 ,  B05D2201/06 ,  B21G1/00 ,  B81C1/00111

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

Abstract translation: 公开了制造金属微针的方法。 一种方法包括提供模柱; 在模柱上形成有孔导电层; 以及在导电层上沉积金属层以提供有孔微针。 另一种方法包括提供模柱; 在模柱上沉积第一金属层以提供第一微针; 从模柱移除第一微针; 以及在模柱上沉积第二金属层以提供第二微针。