公开(公告)号：US4367217A

公开(公告)日：1983-01-04

申请号：US221834

申请日：1980-12-31

Applicant: Peter Gruber ,  Rolf Brickl ,  Gerhard Bozler ,  Herbert Stricker

Inventor： Peter Gruber ,  Rolf Brickl ,  Gerhard Bozler ,  Herbert Stricker

IPC: A61K9/16 ,  A61K9/22 ,  A61K9/24 ,  A61K9/48 ,  A61K9/50 ,  A61K9/52 ,  A61K9/54 ,  A61K9/56 ,  A61K31/505 ,  A61P9/08 ,  A61P9/10 ,  A61K9/26

CPC classification number: A61K9/5042 ,  A61K31/505 ,  A61K9/1617 ,  A61K9/5026 ,  A61K9/5078

Abstract: This invention relates to a composition for the sustained release of dipyridamole which comprises (i) spheroid particles comprised of dipyridamole or crystallized salts thereof and pharmacologically acceptable acid or acid substance, and (ii) a coating surrounding said spheroid particles, said coating being comprised of from about 50 to 100 percent by weight of acid-insoluble lacquers soluble in intestinal juices and from about 0 to 50 percent by weight of lacquers insoluble in gastric and intestinal juices and said coating being present in an amount of from about 3 to 30 percent by weight, based on the weight of the spheroid particles, and to the preparation of such a composition.

Abstract translation: 本发明涉及用于缓释双嘧达莫的组合物，其包括（i）由双嘧达莫或其结晶盐和药理学上可接受的酸或酸性物质组成的球状颗粒，和（ii）围绕所述球状颗粒的涂层，所述涂层由 约50至100重量％的可溶于肠液的酸不溶性漆和约0至50重量％不溶于胃肠和肠液的漆，并且所述涂层以约3至30重量％的量存在， 重量，基于球状颗粒的重量，以及这种组合物的制备。

公开(公告)号：US4339589A

公开(公告)日：1982-07-13

申请号：US175593

申请日：1980-08-05

Applicant: Wolfgang Steglich ,  Rudolf Hurnaus ,  Peter Gruber ,  Boerries Kuebel

Inventor： Wolfgang Steglich ,  Rudolf Hurnaus ,  Peter Gruber ,  Boerries Kuebel

IPC: C07D263/42 ,  C07D265/10

CPC classification number: C07D263/42

Abstract: Manufacture of 4-substituted oxazolinone-(5) compounds, which are intermediates for substituted aminoacids, by alkylation of 2-substituted or 3,4-disubstituted oxazolinone-(5) compounds in an aprotic solvent in the presence of a tertiary amine.

Abstract translation: 通过在非质子溶剂中在叔胺存在下，通过2-取代或3,4-二取代的恶唑啉酮 - （5）化合物的烷基化制备4-取代的恶唑啉酮 - （5）化合物，它们是取代的氨基酸的中间体。

公开(公告)号：USD693710S1

公开(公告)日：2013-11-19

申请号：US29441551

申请日：2013-01-07

Applicant: Thomas Bachel ,  Matthias Droll ,  Peter Gruber

Designer： Thomas Bachel ,  Matthias Droll ,  Peter Gruber

公开(公告)号：US20100035937A1

公开(公告)日：2010-02-11

申请号：US12443446

申请日：2007-08-30

Applicant: Peter Gruber ,  Peter Kraahs

Inventor： Peter Gruber ,  Peter Kraahs

IPC: A61K31/192 ,  A61K31/196 ,  A61K31/44 ,  A61K31/405 ,  A61K31/381 ,  A61P29/00

CPC classification number: A61K9/143 ,  A61K9/1611 ,  A61K31/192

Abstract: A process for producing a solubilized non-steroidal anti-inflammatory drug (NSAID) the process comprising the steps of: providing a mixture comprising solid NSAID and a first base which is selected from the group of bases which have a pH of at least 11 as 0.1 molar aqueous solution or dispersion, and reacting the NSAID and the first base in essentially dry state, solubilized NSAID obtainable by this process and pharmaceutical compositions comprising the same.

Abstract translation: 一种生产溶解的非甾体抗炎药（NSAID）的方法，该方法包括以下步骤：提供包含固体NSAID和选自pH至少为11的碱基的第一碱的混合物 0.1摩尔水溶液或分散体，并使NSAID和第一碱基基本上干燥状态，通过该方法获得的可溶性NSAID和包含该NSAID的药物组合物。

公开(公告)号：US20090270515A1

公开(公告)日：2009-10-29

申请号：US12441629

申请日：2007-09-14

Applicant: Peter Gruber ,  Dirk Spickermann

Inventor： Peter Gruber ,  Dirk Spickermann

IPC: A61K47/12 ,  A61K47/02 ,  A61K47/26 ,  A61P43/00

CPC classification number: A61K9/2009 ,  A61K9/1611

Abstract: The invention relates to solid medicinal forms containing at least one active ingredient and at least one pharmaceutically compatible, water soluble drying agent which is selected from the group consisting of trimagnesium dicitrate and/or calcium chloride, the solid medicinal form having a drying loss of at most 6% and a relative equilibrium moisture content of 25% or less. The invention also relates to solid medicinal forms containing a moisture-sensitive active ingredient and trimagnesium dicitrate.

Abstract translation: 本发明涉及含有至少一种活性成分和至少一种药学上相容的水溶性干燥剂的固体药物形式，其选自氯化三钙和/或氯化钙，固体药物形式具有干燥损失 最多6％，相对平衡含水量25％以下。 本发明还涉及含有湿敏性活性成分和十六酸镁的固体药物形式。

公开(公告)号：US20070246515A1

公开(公告)日：2007-10-25

申请号：US11409232

申请日：2006-04-21

Applicant: Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

Inventor： Steven Cordes ,  Peter Gruber ,  John Knickerbocker ,  James Speidell

IPC: B23K31/02 ,  B23K1/08 ,  B23K35/12

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20060289607A1

公开(公告)日：2006-12-28

申请号：US11168182

申请日：2005-06-28

Applicant: Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

Inventor： Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

IPC: B23K35/12

CPC classification number: B23K35/3613

Abstract: A method for constructing a composite solder transfer moldplate for flip chip wafer bumping of a substrate, comprising the steps of coating at least one polymer layer onto a first side of a transparent plate, the plate having a thermal expansion coefficient similar to that of the substrate; and forming a multiplicity of cavities in a polymer layer on one side of the plate, each cavity being for receiving solder. A moldplate made by the method. The structure has required behavior through temperature excursions between room temperature and various solder molten temperatures.

Abstract translation: 一种用于构造用于衬底的倒装芯片晶片凸起的复合焊料传递模板的方法，包括以下步骤：将至少一个聚合物层涂覆到透明板的第一侧上，该板具有与衬底的热膨胀系数相似的热膨胀系数 ; 并且在该板的一侧上的聚合物层中形成多个空腔，每个空腔用于接收焊料。 通过该方法制成的模板。 该结构通过室温和各种焊料熔融温度之间的温度偏移需要行为。

公开(公告)号：US20060118604A1

公开(公告)日：2006-06-08

申请号：US11005557

申请日：2004-12-05

Applicant: Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

Inventor： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

IPC: B23K35/12

CPC classification number: H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

公开(公告)号：US20060035454A1

公开(公告)日：2006-02-16

申请号：US11048578

申请日：2005-02-01

Applicant: Luc Belanger ,  Peter Gruber ,  Valerie Oberson ,  Christopher Tessler

Inventor： Luc Belanger ,  Peter Gruber ,  Valerie Oberson ,  Christopher Tessler

IPC: B23K35/12 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/128 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/05099

Abstract: Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.

Abstract translation: 公开了一种允许从注射成型焊料（IMS）产生的焊料特征从模板向焊料接收衬底的转移和回流而不使用焊剂的新方法。 几种实施方式分别产生焊料转移和回流，或者在一起并且在氮气中使用甲酸蒸气或部分浓度的氢作为氧化物还原气氛。 最终实施例通过在焊料填充的模具板和焊料接收衬底之间使用超声波振动，仅在氮气中产生无磁通转移和回流。

公开(公告)号：US20050263571A1

公开(公告)日：2005-12-01

申请号：US10857988

申请日：2004-05-30

Applicant: Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

Inventor： Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

IPC: B23K3/06 ,  B23K31/02 ,  H05K3/34

CPC classification number: B23K3/0623 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338 ,  H05K2203/1121

Abstract: A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.

Abstract translation: 一种用于通过熔融焊料沉积形成焊料凸块的方法和装置，紧接在熔融焊料的固化之后，立即在形成的焊料凸块阵列中实现空腔体积的精确复制。 各种焊料填充问题，例如由表面张力和氧化作用引起的焊料填充问题，都是通过组合窄熔融焊料分配槽和分散的熔融焊料的固化来克服的。