Abstract:
PROBLEM TO BE SOLVED: To detect accumulation of ice particles, and to detect ice particles that are present in sufficient concentration for a sufficient time period.SOLUTION: Systems and methods for detecting ice particle accumulation are disclosed herein. In one exemplary implementation, a method for detecting ice is described in which a parameter within an interior volume of a heated conduit is measured. The method also includes detecting the presence of an accumulation of ice particles based on the parameter measured within the interior volume of the heated conduit.
Abstract:
PROBLEM TO BE SOLVED: To provide a measurement system and sensor allowing real-time measurement and detection of exhaust emissions which can endure hostile environments in an emission duct in a gas turbine engine.SOLUTION: A probe assembly 10 for measuring the concentration of exhaust emissions in an emission duct 110 in a turbine engine 100 includes a first probe member configured and operable to passively generate a light beam with a wavelength contingent upon a configuration of the first probe member. A second probe member is positioned in the probe assembly to receive the light beam generated by the first probe member, and is configured and operable to attenuate the light passively generated from the first probe member contingent upon gaseous chemical species present in the exhaust emissions from the turbine engine.
Abstract:
PROBLEM TO BE SOLVED: To provide a high temperature-resistant sealing assembly for optical sensors. SOLUTION: In the sealing assembly for optical sensors used in high temperature environment, the sealing assembly includes an elongated metal guide tube 40 with both an open end and an end portion demarcating inside rear wall surface, and a sapphire window 50 arranged inside the end portion of the metal guide tube 40. The sapphire window 50 includes a rear end surface contacting the inside rear wall surface on the end portion of the metal guide tube 40, while a platinum mounting sleeve 60 for securing the sapphire window 50 to the metal guide tube 40 includes one portion joined with the guide tube 40 of the sleeve 60 and another portion joined with the sapphire window 50. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a power distribution architecture for an ice protection system so as to effectively distribute by-product dissipation power between a plurality of power distribution units in a manner that optimizes wire weight. SOLUTION: In a power distribution structure, an ice protection system includes a plurality of de-ice power distribution units 116a-116c positioned proximate to a leading edge surface of a transport means that is susceptible to ice accretion, at least two anti-ice power distribution units 112a, 112b located within the transport means, spaced from the de-ice power distribution units 116a-116c, and a point of power regulation 126 located within the transport means, spaced from the power distribution units, from which power is fed to the power distribution units 112a, 112b, 116a-116c through independent feeder wire bundles 128a, 128b, 128c so as to distribute line current across the ice protection system in a manner that optimizes wire weight. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature measurement apparatus which measures the temperature of continuous cast metal, while maintaining sufficient accuracy. SOLUTION: The temperature measurement apparatus includes a temperature sensor 118 and a biasing member 120 which biases the temperature sensor 118 in the direction of the strand 104, in response to receiving thermal energy from the strand 104. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a tablet interface module for aircraft avionics.SOLUTION: An aircraft avionics system 102 includes an aircraft interface device 104 configured to communicate with an aircraft avionics system, and a tablet interface module 106 configured to communicate with the aircraft interface device and with one or more tablets 108. The aircraft avionics system includes a plurality of sensors for an aircraft, and the tablet interface module provides the one or more tablets with information received from the aircraft interface device.
Abstract:
PROBLEM TO BE SOLVED: To provide a capacitor which is novel and useful for use in a sensor.SOLUTION: A capacitor 100 for use in a sensor includes first and second capacitor plates 102, 104 which face each other, and the second capacitor plate 104 is mounted on the first capacitor plate 102 with a flexible fitting part 106. The flexible fitting part 106 is configured and adapted to make change of a space between the first capacitor plate 102 and the second capacitor plate 104 so that bending of the fitting part 106 changes the capacitance across the bending.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of mitigating packaging stress in a MEMS pressure sensor.SOLUTION: A MEMS pressure sensor 100 may be manufactured to include a backing substrate 104 having a diaphragm backing portion 106 and a pedestal portion 110. A diaphragm substrate 102 may be manufactured to include a pedestal portion 110 and a diaphragm 112 that is mounted to the diaphragm backing portion 106 of the backing substrate 104 to form a stress isolated MEMS die 101. The pedestal portions of the backing substrate 104 and the diaphragm substrate 102 form a pedestal 116 of the stress isolated MEMS die 101. The pedestal 116 is configured for isolating the diaphragm 112 from stress including packaging stress and mounting stress imparted on the stress isolated MEMS die 101.
Abstract:
PROBLEM TO BE SOLVED: To provide a package structure to mitigate packaging stress which is caused by mechanical mounting, thermal expansion etc. and makes pressure measurement problematic in terms of accuracy in a sensor package.SOLUTION: An unattached contained semiconductor device includes a semiconductor die 102, for example, a MEMS pressure sensor die. The semiconductor die 102 is unattached from the interior cavity of a surrounding containment body 104 so that the semiconductor die 102 is free of adherence to the containment body 104, thereby mitigating packaging stress and strain between the containment body 104 and the semiconductor die 102.
Abstract:
PROBLEM TO BE SOLVED: To provide an extremely robust and high-performance triaxial accelerometer including both of an in-plane accelerometer and an out-of-plane accelerometer fabricated on a single chip by using a MEMS manufacturing technology.SOLUTION: A structure of the accelerometer includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass 102 formed from an integrally molded material and movably positioned at predetermined distance above the substrate 104. The proof mass 102 includes a plurality of electrode protrusions 116 extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass 102 is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes 108, 110 when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.