Abstract:
An electronically tuned, wavelength-dependent optical detector is provided. The electronically tuned, wavelength-dependent optical detector is a modified metal-semiconductor-metal photodetector including a comb-like metal electrode at a common voltage and metal electrodes each supplied with a control voltage by a voltage means. The wavelength to be detected in an optical input illuminating the detector is selected based on the set of control voltages applied to the metal electrodes. In another embodiment of the invention, the wavelength to be detected with the electronically tuned, wavelength-dependent optical detector is also selected using a standing wave generator, such as an interferometer, to produce a spatially varying light intensity on the surface of the electronically tuned, wavelength-dependent optical detector. Electronic wavelength demultiplexing is also provided. Design flexibility can be obtained by providing two or more optical patterns at a detector surface, each pattern having a different wavelength dependence.
Abstract:
A pre-stored digital word generator, more particularly, a digital word generator for providing multiple digital words. The pre-stored digital word generator includes a edge memory used to store a primary preset information; an edge address counter used to point to an address of the edge memory; a reloadable down counter used to count according to the primary preset information and trigger the edge address counter; and multiple word generating circuits having a secondary preset information. Therein, the word generating circuits compare the primary and secondary preset information and then produce the digital words according to a comparison result.
Abstract:
A cleaning container and method for using the same for chemically cleaning elongated members including quartz thermocouple sleeves including a first body member and a second body member said first body member and second body member respectively forming a first containing space and a second containing space including a first means for reversibly compressively sealing the first body member and the second body member to a form a combined containing space for sealably holding a cleaning solution level; a cap member disposed at a distal end of the first body member said cap member including a second means for reversibly compressively sealing a first opening in communication with the first containing space; and, a second opening centrally disposed in a distal end of the second containing space said second opening including a third means for reversibly compressively sealing around at least one elongated member penetrating through said second opening.
Abstract:
An apparatus and a method for evacuating a process chamber by a dry pump and then shutting down the pump without back steam and high pressure safety problems are disclosed. In the apparatus, a conduit is provided for connecting in fluid communication between a process chamber and a dry pump, two gate valves are provided in the conduit with one mounted adjacent to the process chamber and the other adjacent to the dry pump. A pressure relief valve is provided and mounted to bridge over an inlet and an outlet of the second gate valve such that any pressure build-up in the conduit upstream of the second gate valve can be avoided for preventing injury to a machine operator. The back steam problem can be effectively prevented when the dry pump is shut down simultaneously with the closing of the first and the second gate valves. The pressure relief valve may be pre-set to operate automatically when a differential pressure larger than 0.33 psi is detected. The apparatus is further provided with a manual venting valve installed in the section of the conduit between the two gate valves such that the conduit may be manually vented to the atmosphere when the pressure relief valve malfunctions and fails to automatically vent.
Abstract:
An apparel system can include: a body, the body including a first side, a second side, a first neck hole, and a second neck hole; a first elongated section coupled to the first neck hole, the first elongated section including a first elongated inner side, a first elongated outer side, and a first elongated section edge, the first elongated inner side defining a first elongated section inner cavity; and a second elongated section coupled to the second neck hole, the second elongated section including a second elongated inner side, a second elongated outer side, and a second elongated section edge, the second elongated inner side defining a second elongated section inner cavity.
Abstract:
The present invention provides a system and methods for automated rehabilitation. The system and methods could provide the automated coordination training and assessment.
Abstract:
An integrated circuit/substrate interconnect apparatus and method are provided. Included is an integrated circuit including a plurality of bond pads, and a substrate including a plurality of landing pads and a mask. Such mask is spaced from the landing pads for defining areas therebetween. Further provided is a plurality of interconnects connected between the bond pads of the integrated circuit and the landing pads of the substrate. The interconnects include metal projections extending from the bond pads and a solder material for connecting the metal projections and the landing pads of the substrate.
Abstract:
A device is provided which includes a transparent substrate. An opaque layer is disposed on the transparent substrate. A conductive layer disposed on the opaque layer. The opaque layer and the conductive layer form a handling layer, which may be used to detect and/or align the transparent wafer during fabrication processes. In an embodiment, the conductive layer includes a highly-doped silicon layer. In an embodiment, the opaque layer includes a metal. In embodiment, the device may include a MEMs device.
Abstract:
An integrated circuit/substrate interconnect apparatus and method of manufacture are provided. Included is a substrate with a plurality of wells and a landing pad formed in each of the wells. The substrate further includes a seed layer deposited in each of the wells over the landing pad, and a metalized layer deposited in each of the wells over the seed layer. Before assembly, an upper surface of the metalized layer forms a well.