公开(公告)号：WO2013019425A3

公开(公告)日：2013-04-04

申请号：PCT/US2012047439

申请日：2012-07-19

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  SASAGAWA TERUO

Inventor： SASAGAWA TERUO

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/3244 ,  H01J37/32477

Abstract: This disclosure provides systems, methods and apparatus for fabricating electromechanical system devices within a plasma-etch reaction chamber. In one aspect, a plasma-etch system includes a plasma-etch reaction chamber, an inlet in fluid communication with the reaction chamber, a cathode positioned within the reaction chamber and a non-hollow anode positioned within the reaction chamber between the inlet and the cathode. The inlet is configured to introduce a process gas into the reaction chamber such that at least a portion of the process gas strikes an upper surface of the anode and is allowed to flow across the upper surface and around the edges of the anode. The anode can be a liner plate in place of a showerhead.

Abstract translation: 本公开提供了用于在等离子体蚀刻反应室内制造机电系统装置的系统，方法和装置。 在一个方面，等离子体蚀刻系统包括等离子体蚀刻反应室，与反应室流体连通的入口，位于反应室内的阴极和位于入口和入口之间的反应室内的非空心阳极 阴极。 入口构造成将工艺气体引入反应室，使得至少一部分工艺气体撞击阳极的上表面并允许流过阳极的上表面和周围。 阳极可以是衬板代替喷头。

公开(公告)号：WO2013019425A2

公开(公告)日：2013-02-07

申请号：PCT/US2012/047439

申请日：2012-07-19

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  SASAGAWA, Teruo

Inventor： SASAGAWA, Teruo

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/3244 ,  H01J37/32477

Abstract: This disclosure provides systems, methods and apparatus for fabricating electromechanical system devices within a plasma-etch reaction chamber. In one aspect, a plasma-etch system includes a plasma-etch reaction chamber, an inlet in fluid communication with the reaction chamber, a cathode positioned within the reaction chamber and a non-hollow anode positioned within the reaction chamber between the inlet and the cathode. The inlet is configured to introduce a process gas into the reaction chamber such that at least a portion of the process gas strikes an upper surface of the anode and is allowed to flow across the upper surface and around the edges of the anode. The anode can be a liner plate in place of a showerhead.

Abstract translation: 本公开提供了用于在等离子蚀刻反应室内制造机电系统装置的系统，方法和设备。 在一个方面中，等离子体蚀刻系统包括等离子体蚀刻反应室，与反应室流体连通的入口，位于反应室内的阴极和位于反应室内的非空心阳极， 阴极。 入口构造成将工艺气体引入反应室，使得工艺气体的至少一部分撞击阳极的上表面并且允许流过上表面并围绕阳极的边缘流动。 阳极可以是衬垫板来代替喷头。

公开(公告)号：WO2012067826A2

公开(公告)日：2012-05-24

申请号：PCT/US2011/058983

申请日：2011-11-02

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  BITA, Ion ,  LI, Kebin ,  RAO, Rashmi ,  SASAGAWA, Teruo ,  ARBUCKLE, Brian, W. ,  CUMMINGS, William

Inventor： BITA, Ion ,  LI, Kebin ,  RAO, Rashmi ,  SASAGAWA, Teruo ,  ARBUCKLE, Brian, W. ,  CUMMINGS, William

IPC: G02B6/00 ,  F21V8/00

CPC classification number: G02B26/001 ,  G02B6/005 ,  Y10T29/49826

Abstract: This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, a passivation layer is attached to the light guide of an illumination device. The passivation layer may be an optically transparent moisture barrier and may have a thickness and refractive index which allows it to function as an anti-reflective coating. The passivation layer may protect moisture-sensitive underlying features, such as metallized light turning features that may be present in the light guide. The light turning features may be configured to redirect light out of the light guide. In some implementations, the redirected light may be applied to illuminate a display.

Abstract translation: 本公开提供了通过使用光导来分配光来提供照明的系统，方法和装置。 在一个方面，钝化层附着到照明装置的光导。 钝化层可以是光学透明的水分屏障，并且可以具有允许其用作抗反射涂层的厚度和折射率。 钝化层可以保护水分敏感的底层特征，例如可能存在于光导中的金属化的光转动特征。 光转向特征可以被配置为将光重定向到光导中。 在一些实施方案中，可以应用重定向的光来照亮显示器。

公开(公告)号：WO2009036215A2

公开(公告)日：2009-03-19

申请号：PCT/US2008/076077

申请日：2008-09-11

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  YAN, Xiaoming ,  HO, Chok ,  HEALD, David ,  GOUSEV, Evgeni ,  HERTZLER, Benjamin, W. ,  FLOYD, Philip ,  SASAGAWA, Teruo ,  LONDERGAN, Ana ,  BITA, Ion ,  ZION, Todd

Inventor： YAN, Xiaoming ,  HO, Chok ,  HEALD, David ,  GOUSEV, Evgeni ,  HERTZLER, Benjamin, W. ,  FLOYD, Philip ,  SASAGAWA, Teruo ,  LONDERGAN, Ana ,  BITA, Ion ,  ZION, Todd

IPC: H01L21/311 ,  H01L21/3213 ,  B01D53/68

CPC classification number: H01L21/32135 ,  B01D53/002 ,  B01D2257/11 ,  B01D2257/2027 ,  H01L21/31116

Abstract: The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.

Abstract translation: 可以以各种方式增加蚀刻工艺的效率，并且可以降低蚀刻工艺的成本。 未蚀刻的蚀刻剂可以在蚀刻过程中被隔离并再循环。 蚀刻副产物可以在蚀刻过程中从蚀刻系统中收集和去除。 蚀刻剂的组分可以被分离并用于一般的另外的蚀刻剂。 蚀刻剂或被蚀刻的层中的任一个或两者也可以针对特定的蚀刻工艺进行优化。

公开(公告)号：WO2009020801A2

公开(公告)日：2009-02-12

申请号：PCT/US2008071498

申请日：2008-07-29

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  SASAGAWA TERUO

Inventor： SASAGAWA TERUO

IPC: B81B7/00

CPC classification number: B81B7/0006 ,  B81B2201/047

Abstract: A microelectromechanical systems (MEMS) device includes a substrate (20), an array region (ARRAY), and a peripheral region (INTERCONNECT). The array region (ARRAY) includes a lower electrode (16A, 16B), a movable upper electrode (14), and a cavity (19) between the lower electrode (16A, 16B) and the upper electrode (14). The peripheral region (INTERCONNECT) includes a portion of a layer forming the upper electrode (14) in the array region (ARRAY) and an electrical interconnect (58). The electrical interconnect (58) includes a conductive material (50) electrically connected to at least one of the lower electrode (16A, 16B) and the upper electrode (14). The electrical interconnect (58) is formed of a layer separate from and below the layer forming the upper electrode (14) in the array region (ARRAY). The conductive material (50) is selected from the group consisting of nickel, chromium, copper, and silver.

Abstract translation: 微机电系统（MEMS）器件包括衬底（20），阵列区（ARRAY）和外围区（INTERCONNECT）。 阵列区域（ARRAY）包括下电极（16A，16B），可动上电极（14）以及下电极（16A，16B）和上电极（14）之间的空腔（19）。 外围区域（INTERCONNECT）包括在阵列区域（ARRAY）中形成上电极（14）的层的一部分和电互连（58）。 电互连（58）包括电连接到下电极（16A，16B）和上电极（14）中的至少一个的导电材料（50）。 电互连（58）由在阵列区域（ARRAY）中与形成上电极（14）的层分开且在其下方的层形成。 导电材料（50）选自由镍，铬，铜和银组成的组。

公开(公告)号：WO2009006122A1

公开(公告)日：2009-01-08

申请号：PCT/US2008/068065

申请日：2008-06-24

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  SASAGAWA, Teruo ,  KOGUT, Lior ,  TUNG, Ming-hau

Inventor： SASAGAWA, Teruo ,  KOGUT, Lior ,  TUNG, Ming-hau

IPC: G02B26/00 ,  B81B3/00 ,  G09G3/34 ,  H01L31/075

CPC classification number: G02B26/001 ,  H01L27/142 ,  H01L31/072 ,  H01L31/0725 ,  Y02E10/50

Abstract: Embodiments of the present invention relate to interferometric display devices comprising an interferometric modulator and a solar cell and methods of making thereof. In some embodiments, the solar cell is configured to provide energy to the interferometric modulator. The solar cell and the interferometric modulator may be formed above the same substrate. A layer of the solar cell may be shared with a layer of the interferometric modulator.

Abstract translation: 本发明的实施例涉及包括干涉式调制器和太阳能电池的干涉式显示装置及其制造方法。 在一些实施例中，太阳能电池被配置为向干涉式调制器提供能量。 太阳能电池和干涉式调制器可以形成在相同基板上方。 一层太阳能电池可以与干涉式调制器的一层共享。

公开(公告)号：WO2007120886A3

公开(公告)日：2008-05-22

申请号：PCT/US2007009274

申请日：2007-04-12

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  SASAGAWA TERUO ,  KOGUT LIOR

Inventor： SASAGAWA TERUO ,  KOGUT LIOR

IPC: B81B3/00 ,  G02B26/00

CPC classification number: B81B3/001 ,  B81B2201/047 ,  B81C2201/0115 ,  G02B26/001

Abstract: A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator 80 that includes a transparent electrode 81 having a first surface 81a; and a movable reflective electrode 82 with a second surface 82a facing the first surface 81a. The movable reflective electrode 82 is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer 83 which has a porous surface 83a. The porous surface 83a, in the actuated position, decreases contact area between the electrodes 81 and 82, thus reducing stiction.

Abstract translation: 公开了一种利用多孔电极表面降低静摩擦力的微机电装置（MEMS）。 在一个实施例中，微机电装置是干涉式调制器80，其包括具有第一表面81a的透明电极81; 以及具有面向第一表面81a的第二表面82a的可移动反射电极82。 可移动反射电极82可在松弛和致动（折叠）位置之间移动。 在第一或第二表面上提供铝层。 然后将铝层阳极氧化以提供具有多孔表面83a的氧化铝层83。 处于致动位置的多孔表面83a减小了电极81和82之间的接触面积，从而减小了静电。

公开(公告)号：WO2007123871A1

公开(公告)日：2007-11-01

申请号：PCT/US2007/009267

申请日：2007-04-12

Applicant: QUALCOMM INCORPORATED ,  SASAGAWA, Teruo ,  KOGUT, Lior

Inventor： SASAGAWA, Teruo ,  KOGUT, Lior

IPC: G02B26/00

CPC classification number: G02B26/001 ,  B81B3/001

Abstract: A microelectromechanical device (MEMS) utilizing nanoparticles for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator (80) that includes a transparent electrode assembly (81) having a first surface (81a); and a movable reflective electrode assembly (82) with a second surface (82a) facing the first surface (81a). The movable reflective electrode assembly (82) is movable between a relaxed and actuated (collapsed) position. Particles are deposited over the transparent electrode assembly (81) or over a sacrificial layer separating the two electrode assemblies. The particles lead to dimples (83) in the reflective surface (82a) of the movable reflective electrode assembly (82). The particles can be removed with the sacrificial layer or remain in final devices.

Abstract translation: 公开了一种利用纳米颗粒降低静电的微机电装置（MEMS）。 在一个实施例中，微机电装置是干涉式调制器（80），其包括具有第一表面（81a）的透明电极组件（81）; 以及具有面向第一表面（81a）的第二表面（82a）的可移动反射电极组件（82）。 可移动反射电极组件（82）可在松弛和致动（折叠）位置之间移动。 颗粒沉积在透明电极组件（81）上方，或者沉积在分离两个电极组件的牺牲层上。 颗粒导致可动反射电极组件（82）的反射表面（82a）中的凹坑（83）。 颗粒可以用牺牲层去除或保留在最终的装置中。

公开(公告)号：WO2007123820A2

公开(公告)日：2007-11-01

申请号：PCT/US2007/008564

申请日：2007-04-05

Applicant: QUALCOMM INCORPORATED ,  SASAGAWA, Teruo ,  KOGUT, Lior ,  TUNG, Ming-Hau

Inventor： SASAGAWA, Teruo ,  KOGUT, Lior ,  TUNG, Ming-Hau

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。 在一个实施例中，非平面表面形成在牺牲层上。 形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。 牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2007014022A1

公开(公告)日：2007-02-01

申请号：PCT/US2006/028342

申请日：2006-07-20

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  CHUI, Clarence ,  CHUNG, Wonsuk ,  GANTI, Surya, Prakash ,  KOTHARI, Manish ,  MILES, Mark, W. ,  SAMPSELL, Jeffrey, B. ,  SASAGAWA, Teruo

Inventor： CHUI, Clarence ,  CHUNG, Wonsuk ,  GANTI, Surya, Prakash ,  KOTHARI, Manish ,  MILES, Mark, W. ,  SAMPSELL, Jeffrey, B. ,  SASAGAWA, Teruo

IPC: B81B3/00 ,  G02B26/00

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或者由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。