公开(公告)号：US20080067076A1

公开(公告)日：2008-03-20

申请号：US11523135

申请日：2006-09-19

Applicant: Ming-Yuan Cheng ,  Hsien-Ping Feng ,  Hsi-Kuei Cheng ,  Kei-Wei Chen ,  Jung-Chin Tsao ,  Steven Lin ,  Ray Chuang

Inventor： Ming-Yuan Cheng ,  Hsien-Ping Feng ,  Hsi-Kuei Cheng ,  Kei-Wei Chen ,  Jung-Chin Tsao ,  Steven Lin ,  Ray Chuang

IPC: C25D3/00

CPC classification number: C25D3/02 ,  C02F3/34

Abstract: A novel method, which is suitable to substantially reduce the presence of oxygen micro-bubbles in an electroplating bath solution, is disclosed. The method includes the addition of aerobic bacteria to the electroplating bath solution to consume oxygen in the solution. Reduction of the oxygen content in the electroplating bath solution prevents oxygen micro-bubbles from forming in the solution and becoming trapped between the solution and the surface of a metal seed layer on a substrate to block the electroplating of a metal film onto the seed layer. Consequently, the presence of surface pits and other structural defects in the surface of the electroplated metal film is substantially reduced.

Abstract translation: 公开了一种适合于显着减少电镀浴液中氧微气泡存在的新方法。 该方法包括向电镀浴溶液中加入需氧细菌以消耗溶液中的氧气。 电镀浴溶液中的氧含量的降低防止溶液中形成氧微气泡并被困在溶液与基底上的金属种子层的表面之间，以阻止金属膜在种子层上的电镀。 因此，电镀金属膜的表面中存在表面凹坑等结构缺陷。

公开(公告)号：US20080043626A1

公开(公告)日：2008-02-21

申请号：US11506351

申请日：2006-08-17

Applicant: Anthony Pham ,  Steven Lin ,  Jonathan Bettino ,  David W. Hoard

Inventor： Anthony Pham ,  Steven Lin ,  Jonathan Bettino ,  David W. Hoard

IPC: H04L12/26

CPC classification number: H04L41/22 ,  H04L41/12

Abstract: In one embodiment, a networking hardware element (1100, 3100) capable of coupling computer network elements (1010) comprises a network diagnostic mechanism (2140) that is capable of mapping the computer network elements and that is also capable of determining a connection status for the computer network elements. The networking hardware element also comprises a display (2110, 3110, 5110) that is capable of communicating with the network diagnostic mechanism and that is also capable of displaying a network layout map (2111, 5111) of representations of the computer network elements and the connection status of the computer network elements.

Abstract translation: 在一个实施例中，能够耦合计算机网络元件（1010）的联网硬件元件（1100,3100）包括网络诊断机构（2140），其能够映射计算机网络元件，并且还能够确定连接状态 计算机网络元素。 网络硬件元件还包括能够与网络诊断机构通信的显示器（2110,310,5110），并且还能够显示计算机网络元件的表示的网络布局图（2111,5111）和 计算机网络元件的连接状态。

公开(公告)号：US20080041570A1

公开(公告)日：2008-02-21

申请号：US11465207

申请日：2006-08-17

Applicant: Kenneth Abels ,  W. Dennis Moss ,  Steven Lin ,  Alan Wu

Inventor： Kenneth Abels ,  W. Dennis Moss ,  Steven Lin ,  Alan Wu

IPC: F28F9/02

CPC classification number: F28F9/0221 ,  F28D1/0316 ,  F28F3/025

Abstract: A plate and fin type heat exchanger has a heat exchanger core made from a plurality of stacked, alternating first and second heat exchange plates of a generally inverted, U-shaped cross-section. Each plate has a top wall, closed peripheral sidewalls and open ends, and the open ends of the first plates are oriented at 90° to the open ends of the second plates. The sidewalls of the plates have end portions, which in adjacent plates, are aligned to form corners of the heat exchanger core. Opposed U-shaped manifold bodies are provided having open ends and lateral walls joined in a fluid tight manner to the aligned plate sidewall end portions. End plates close off the open ends of the U-shaped bodies to form manifolds. The corners formed by the aligned plate sidewall end portions allow for an improved connection between the heat exchanger core and the U-shaped manifold bodies. This helps to ensure that a fluid tight seal is created between the heat exchanger core and the manifold bodies when the components are joined together.

Abstract translation: 板翅式热交换器具有由大致倒U形横截面的多个层叠的，交替的第一和第二热交换板制成的热交换器芯。 每个板具有顶壁，封闭的外围侧壁和开口端，并且第一板的开口端与第二板的开口端成90°取向。 板的侧壁具有端部，其在相邻的板中对齐以形成热交换器芯的角部。 提供了相对的U形歧管体，其具有以流体密封的方式连接到对齐的板侧壁端部的开口端和侧壁。 端板封闭U形体的开口端形成歧管。 由对准的板侧壁端部形成的角部允许在热交换器芯和U形歧管主体之间改善连接。 这有助于确保当组件接合在一起时，在热交换器芯和歧管本体之间产生流体密封。

公开(公告)号：US20070152216A1

公开(公告)日：2007-07-05

申请号：US11687663

申请日：2007-03-18

Applicant: Steven Lin ,  Su-Ping Chiu

Inventor： Steven Lin ,  Su-Ping Chiu

IPC: H01L21/66 ,  H01L23/58

CPC classification number: H01L21/76892

Abstract: An interconnection in an insulating layer on a wafer is described herein. A wafer having a plurality of conductive lines thereon is provided. An insulating layer is formed over the conductive lines. Two via holes are formed in the insulating layer to expose two of the conductive lines waiting to be repaired. A first conductive layer is filled into the via holes to form two pattern marks. A mask is formed over the wafer to cover the insulating layer and the two pattern marks. The mask located above and between the two pattern marks is removed to form a trench exposing the two pattern marks and a portion of the insulating layer. A second conductive layer is formed over the mask to cover the two exposed pattern marks and the exposed insulating layer. The mask and the second conductive layer above the mask are removed simultaneously.

Abstract translation: 本文描述了晶片上的绝缘层中的互连。 提供其上具有多条导线的晶片。 在导线上形成绝缘层。 在绝缘层中形成两个通孔，以露出等待修理的两根导电线。 将第一导电层填充到通孔中以形成两个图案标记。 在晶片上形成掩模以覆盖绝缘层和两个图案标记。 去除位于两个图案标记之上和之间的掩模，以形成暴露两个图案标记和绝缘层的一部分的沟槽。 在掩模上形成第二导电层以覆盖两个暴露的图案标记和暴露的绝缘层。 掩模和掩模上方的第二导电层同时被去除。

公开(公告)号：US07030016B2

公开(公告)日：2006-04-18

申请号：US10812729

申请日：2004-03-30

Applicant: Hsien-Ping Feng ,  Jung-Chih Tsao ,  Hsi-Kuei Cheng ,  Chih-Tsung Lee ,  Ming-Yuan Cheng ,  Steven Lin ,  Ray Chuang ,  Chi-Wen Liu

Inventor： Hsien-Ping Feng ,  Jung-Chih Tsao ,  Hsi-Kuei Cheng ,  Chih-Tsung Lee ,  Ming-Yuan Cheng ,  Steven Lin ,  Ray Chuang ,  Chi-Wen Liu

IPC: H01L21/44

CPC classification number: H01L21/76877 ,  H01L21/2885

Abstract: A method of forming a copper interconnect in a dual damascene scheme is described. After a diffusion barrier layer and seed layer are sequentially formed on the sidewalls and bottoms of a trench and via in a dielectric layer, a first copper layer is deposited by a first ECP process at a 10 mA/cm2 current density to fill the via and part of the trench. A first anneal step is performed to remove carbon impurities and optionally includes a H2 plasma treatment. A second ECP process with a first deposition step at a 40 mA/cm2 current density and second deposition step at a 60 mA/cm2 current density is used to deposit a second copper layer-that overfills the trench. After a second anneal step, a CMP process planarizes the copper layers. Fewer copper defects, reduced S, Cl, and C impurities, and improved Rc performance are achieved by this method.

Abstract translation: 描述了在双镶嵌方案中形成铜互连的方法。 在扩散阻挡层和种子层依次形成在电介质层中的沟槽和通孔的侧壁和底部上之后，通过第一ECP工艺以10mA / cm 2 / >电流密度以填充通孔和部分沟槽。 进行第一退火步骤以除去碳杂质，并且任选地包括H 2 O 3等离子体处理。 使用在40mA / cm 2电流密度下的第一沉积步骤和以60mA / cm 2电流密度进行第二沉积步骤的第二个ECP工艺来沉积 第二铜层 - 过度填充沟槽。 在第二退火步骤之后，CMP工艺使铜层平坦化。 通过该方法可以实现更少的铜缺陷，降低的S，Cl和C杂质，以及Rc性能的提高。

公开(公告)号：US20050227479A1

公开(公告)日：2005-10-13

申请号：US10812729

申请日：2004-03-30

Applicant: Hsien-Ping Feng ,  Jung-Chih Tsao ,  Hsi-Kuei Cheng ,  Chih-Tsung Lee ,  Ming-Yuan Cheng ,  Steven Lin ,  Ray Chuang ,  Chi-Wen Liu

Inventor： Hsien-Ping Feng ,  Jung-Chih Tsao ,  Hsi-Kuei Cheng ,  Chih-Tsung Lee ,  Ming-Yuan Cheng ,  Steven Lin ,  Ray Chuang ,  Chi-Wen Liu

IPC: H01L21/311 ,  H01L21/768

CPC classification number: H01L21/76877 ,  H01L21/2885

Abstract: A method of forming a copper interconnect in a dual damascene scheme is described. After a diffusion barrier layer and seed layer are sequentially formed on the sidewalls and bottoms of a trench and via in a dielectric layer, a first copper layer is deposited by a first ECP process at a 10 mA/cm2 current density to fill the via and part of the trench. A first anneal step is performed to remove carbon impurities and optionally includes a H2 plasma treatment. A second ECP process with a first deposition step at a 40 mA/cm2 current density and second deposition step at a 60 mA/cm2 current density is used to deposit a second copper layer-that overfills the trench. After a second anneal step, a CMP process planarizes the copper layers. Fewer copper defects, reduced S, Cl, and C impurities, and improved Rc performance are achieved by this method.

Abstract translation: 描述了在双镶嵌方案中形成铜互连的方法。 在扩散阻挡层和种子层依次形成在电介质层中的沟槽和通孔的侧壁和底部上之后，通过第一ECP工艺以10mA / cm 2 / >电流密度以填充通孔和部分沟槽。 进行第一退火步骤以除去碳杂质，并且任选地包括H 2 O 3等离子体处理。 使用在40mA / cm 2电流密度下的第一沉积步骤和以60mA / cm 2电流密度进行第二沉积步骤的第二个ECP工艺来沉积 第二铜层 - 过度填充沟槽。 在第二退火步骤之后，CMP工艺使铜层平坦化。 通过该方法可以实现更少的铜缺陷，降低的S，Cl和C杂质，以及Rc性能的提高。

公开(公告)号：US06325283B1

公开(公告)日：2001-12-04

申请号：US09695230

申请日：2000-10-25

Applicant: Soy Chu ,  Edward Chu ,  Steven Lin

Inventor： Soy Chu ,  Edward Chu ,  Steven Lin

IPC: G06F1700

CPC classification number: G06F8/65

Abstract: The NYTBridge allows a user to bridge the gap between data collected by hand-held scanning devices and conventional databases used in the field of inventory management without database or procedural programming knowledge on the part of the user. The NYTBridge does this by first allowing the user to access an existing database. The user may then select data fields, such as the location of an item in inventory, from the database without writing coded database queries. The NYTBridge then allows the user to download the selected data fields as a data set along with a scanner program that will read the created data set. Both the data set and the scanner program are either saved on a PCMCIA card to be used in a scanner, or downloaded directly into the hand held scanner via either serial port communication or communication dock tethering. When the scanner program is run on the scanner, the scanner program creates a scanner file for the collected, verified and/or corrected data. After the data is collected, verified and/or corrected, NYTBridge reads the scanner file from the hand held scanner and allows the user to update the relational database. The NYTBridge utilizes a graphical user interface and does not require low level programming by the user at any stage of the inventory management process.

Abstract translation: NYTBridge允许用户弥补手持扫描设备收集的数据与库存管理领域中常用的数据库之间的差距，而不需要用户的数据库或程序编程知识。 NYTBridge首先允许用户访问现有的数据库。 然后，用户可以从数据库中选择数据字段，例如库存中的项目的位置，而不需要编写数据库查询。 NYTBridge然后允许用户将所选择的数据字段作为数据集以及将读取创建的数据集的扫描器程序一起下载。 数据组和扫描仪程序都保存在PCMCIA卡上，以便在扫描仪中使用，或者通过串行端口通信或通信基座系统直接下载到手持式扫描仪中。 当扫描仪程序在扫描仪上运行时，扫描仪程序为收集，验证和/或校正的数据创建一个扫描仪文件。 在数据收集，验证和/或更正后，NYTBridge从手持式扫描仪读取扫描仪文件，并允许用户更新关系数据库。 NYTBridge利用图形用户界面，并且不需要用户在库存管理过程的任何阶段进行低级编程。

公开(公告)号：USD372655S

公开(公告)日：1996-08-13

申请号：US28895

申请日：1994-09-26

Applicant: Steven Lin

Designer： Steven Lin

公开(公告)号：US09106506B2

公开(公告)日：2015-08-11

申请号：US12878849

申请日：2010-09-09

Applicant: Ken Kuwabara ,  Steven Lin ,  Michael Langdon

Inventor： Ken Kuwabara ,  Steven Lin ,  Michael Langdon

IPC: H04L12/701 ,  H04L12/723 ,  H04L12/741 ,  H04L29/06

CPC classification number: H04L45/00 ,  H04L45/50 ,  H04L45/54 ,  H04L69/22

Abstract: A router receives a packet at an ingress interface. The router classifies the received packet based on at least a first field value contained in the header of the packet. According to the classification of the received packet, the router associates one of the plurality of forwarding tables to the packet. The router then performs a lookup operation in the associated forwarding table according to at least a second field value contained in the header of the packet. Based on the lookup operation, the router determines an egress interface and transmits the received packet from the determined egress interface.

Abstract translation: 路由器在入口接口接收数据包。 所述路由器至少基于所述分组报头中包含的第一字段值对接收到的分组进行分类。 根据接收到的分组的分类，路由器将多个转发表中的一个与该分组相关联。 然后，路由器根据分组头部中的至少第二字段值在相关联的转发表中执行查找操作。 基于查找操作，路由器确定出口接口并从确定的出口接口发送接收的分组。

公开(公告)号：US09032095B1

公开(公告)日：2015-05-12

申请号：US10753026

申请日：2004-01-06

Applicant: Paul S. Traina ,  Manoj Leelanivas ,  Steven Lin ,  Nischal Sheth ,  Wing Eng ,  Andrew H. Heffernan

Inventor： Paul S. Traina ,  Manoj Leelanivas ,  Steven Lin ,  Nischal Sheth ,  Wing Eng ,  Andrew H. Heffernan

IPC: G06F15/173 ,  H04L12/751 ,  H04L29/06 ,  H04L12/701 ,  H04L12/24

CPC classification number: H04L45/02 ,  H04J14/0227 ,  H04J14/0241 ,  H04L12/2856 ,  H04L12/2874 ,  H04L29/06 ,  H04L41/0213 ,  H04L41/0813 ,  H04L41/0893 ,  H04L45/00 ,  H04L45/44 ,  H04L45/586 ,  H04L63/0272 ,  H04L67/34

Abstract: Techniques are described for implementing one or more logical routers within a single physical routing device. These logical routers, as referred to herein, are logically isolated in the sense that they achieve operational and organizational isolation within the routing device without requiring the use of additional or redundant hardware, e.g., additional hardware-based routing controllers. The routing device may, for example, include a computing platform, and a plurality of software process executing within the computing platform, wherein the software processes operate as logical routers. The routing device may include a forwarding component shared by the logical routers to forward network packets received from a network in accordance with the forwarding tables.

Abstract translation: 描述了用于在单个物理路由设备内实现一个或多个逻辑路由器的技术。 这些逻辑路由器在逻辑上是隔离的，因为它们实现路由设备内的操作和组织隔离，而不需要使用额外的或冗余的硬件，例如附加的基于硬件的路由控制器。 路由设备可以例如包括计算平台和在计算平台内执行的多个软件进程，其中软件进程作为逻辑路由器操作。 路由设备可以包括由逻辑路由器共享的转发组件，以转发根据转发表从网络接收的网络分组。