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21.发明申请公开(公告)号：US20200344555A1
公开(公告)日：2020-10-29
申请号：US15930530
申请日：2020-05-13
Applicant: Vesper Technologies Inc.
Inventor： Robert J. Littrell , Ronald Gagnon , Karl Grosh
Abstract: A device comprising: a sensor; and a first circuit configured to detect when an input stimulus to the sensor satisfies one or more detection criteria, and further configured to produce a signal upon detection that causes adjustment of performance of the device; and a second circuit for processing input following detection, wherein the second circuit is configured to increase its power level following detection, relative to a power level of the second circuit prior to detection.
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公开(公告)号：US20200296530A1
公开(公告)日：2020-09-17
申请号：US16819673
申请日：2020-03-16
Applicant: Vesper Technologies Inc.
Inventor： Robert J. Littrell
Abstract: An acoustic device is described and includes an acoustic sensor element configured to sense acoustic energy and produce an output signal and a threshold detector circuit including a switch having an input coupled to the output of the acoustic sensor element to receive the output signal, a control port that receives a control signal, and first and second output ports, a first channel including an analog-to-digital converter that operates at a first power level a second analog-to-digital converter that operates at a second higher power level, relative to the first power level and a threshold level detector that receives an output from the first analog-to-digital converter to produce the control signal having a first state that causes the switch feed the output signal from the acoustic sensor element to the second analog-to-digital converter when the first digitized output signal meets a threshold criteria.
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公开(公告)号：US20200148532A1
公开(公告)日：2020-05-14
申请号：US16196922
申请日：2018-11-20
Inventor： Karl Grosh , Robert J. Littrell
Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.
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公开(公告)号：US10170685B2
公开(公告)日：2019-01-01
申请号：US14208827
申请日：2014-03-13
Inventor： Karl Grosh , Robert J. Littrell
IPC: H04R17/02 , H01L41/083 , H01L41/187 , H01L41/113 , B81B3/00 , H04R17/00
Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.
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25.发明申请Acoustic Transducer with Gap-Controlling Geometry and Method of Manufacturing an Acoustic Transducer 审中-公开具有间隙控制几何的声学传感器和制造声学传感器的方法公开(公告)号：US20150271606A1
公开(公告)日：2015-09-24
申请号：US14702319
申请日：2015-05-01
Applicant: Vesper Technologies Inc.
Inventor： Karl Grosh , Robert J. Littrell
IPC: H04R17/02 , H01L41/314 , H01L41/332 , H01L41/27 , H04R7/06 , H04R31/00
CPC classification number: H04R17/02 , H01L41/27 , H01L41/314 , H01L41/332 , H04R7/06 , H04R17/025 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2410/03
Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.
Abstract translation: 优选实施例的换能器包括换能器和多个相邻的锥形悬臂梁。 每个梁限定了梁基部，梁尖端和设置在梁基部和梁尖之间的梁主体。 梁被布置成使得每个梁尖端朝向公共区域延伸。 每个光束沿着光束基座连接到基板，并且沿着光束主体离开基板。 制造换能器的优选方法可以包括：将块状的压电和电极的交替层淀积到衬底上，处理沉积的层以限定块中的悬臂几何形状，在块中沉积金属迹线，以及从块中的衬底释放悬臂梁 。
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Patent Agency Ranking
公开(公告)号：US20220369043A1
公开(公告)日：2022-11-17
申请号：US17879454
申请日：2022-08-02
Applicant: Vesper Technologies Inc.
Inventor： Craig Core , Hamid Basaeri , Robert Littrell
Abstract: A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.
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公开(公告)号：US20220365128A1
公开(公告)日：2022-11-17
申请号：US17741246
申请日：2022-05-10
Applicant: Vesper Technologies, Inc.
Inventor： Michael Carfore
IPC: G01R31/28
Abstract: An apparatus for testing a transducer module includes a test signal generator coupled to a common-mode terminal common to a plurality of transducers, and a signal processing circuit configured to receive output signal from each of said transducers and to produce an output signal. If the transducers are well matched to one another, the output signal will have little or no output amplitude. If there is a mismatch between the transducers, however, the output signal will have an amplitude proportional to the mismatch. The amplitude of the output signal may be compared to a predetermined threshold in order to produce a mismatch output signal indicating the existence of, and/or the degree of, mismatch between the transducers.
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公开(公告)号：US11363387B2
公开(公告)日：2022-06-14
申请号：US17165998
申请日：2021-02-03
Applicant: Vesper Technologies, Inc.
Inventor： Robert Littrell , Ronald Gagnon
Abstract: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.
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公开(公告)号：US11099078B1
公开(公告)日：2021-08-24
申请号：US16110528
申请日：2018-08-23
Applicant: Vesper Technologies, Inc.
Inventor： Robert Littrell , Yu Hui , Craig Core , Ronald Gagnon
Abstract: An acoustic sensor has a MEMS die with MEMS structure. Among other things, the MEMS structure includes a diaphragm configured to mechanically respond to incident acoustic signals, and a temperature sensor member configured to detect temperature.
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公开(公告)号：US10771889B2
公开(公告)日：2020-09-08
申请号：US15357075
申请日：2016-11-21
Applicant: Vesper Technologies Inc.
Inventor： Robert J. Littrell
Abstract: A package comprises: a transducer; a substrate comprising an acoustic port, with the transducer attached to a surface of the substrate and over or adjacent to the acoustic port; and a venting mechanism for venting air or sound pressure from a device comprising the package, with the venting mechanism being affixed to the substrate and partially surrounding the acoustic port, and with the venting mechanism being dimensioned to filter out audio frequencies.
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