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公开(公告)号：KR1020140069653A
公开(公告)日：2014-06-10
申请号：KR1020120137189
申请日：2012-11-29
Applicant: (주)우리정도
CPC classification number: C23C28/023 , C23C18/32 , C25D5/50
Abstract: Provided is a metal sleeve mainly used for a mounting device of an image forming apparatus; a metal sleeve having a triple plated layer plated by a plating method simple to manufacture the metal sleeve; eliminating the phenomenon of brittleness at high temperatures; and having excellent toughness, elasticity, and excellent thermal fixation property along with excellent heat transfer property. The seamless metal sleeve having a triple plated layer includes: a first nickel plated layer plated by electrolytic nickel plating to have uniform thickness and form a cylindrical membrane layer which is hollow inside; a copper plated layer plated by with copper on the outer peripheral surface of the first nickel plated layer using electroplating to form a membrane layer which is thin in thickness; and a second nickel plated layer plated again with nickel on the outer peripheral surface of the copper plated layer using electrolysis nickel electroplating to form a thin membrane layer. The method to manufacture the seamless metal sleeve includes: a step of forming a triple plated layer consisting of membranes by plating the cylindrical master with metallic materials such as nickel, copper, and nickel in a sequential order; a step of reacting sulfur and hydrogen in each plated layer by heat-treating the cylindrical master plated with the triple plated layer in a hydrogen environment at a temperature ranging from 350-600°C; and a step of obtaining the seamless metal sleeve having a triple plated layer by separating the cylindrical master after the triple plated layer being cooled to a temperature ranging from 80-100°C.
Abstract translation: 提供了主要用于图像形成装置的安装装置的金属套筒; 具有通过简单制造金属套筒的电镀方法电镀的三层镀层的金属套管; 消除高温脆性现象; 并且具有优异的韧性，弹性和优异的热固定性以及优异的传热性能。 具有三层镀层的无缝金属套筒包括：通过电解镀镍电镀以均匀厚度的第一镀镍层，并形成内部为中空的圆柱形膜层; 使用电镀在所述第一镀镍层的外周面上用铜电镀铜镀层，以形成厚度薄的膜层; 以及使用电解镍电镀在镍镀层的外周面上再次镀镍的第二镀镍层，以形成薄膜层。 制造无缝金属套筒的方法包括：依次顺序通过用金属材料如镍，铜和镍电镀圆柱形母版来形成由膜构成的三重镀层的步骤; 在氢气环境中，在350-600℃的温度下热处理镀有三层镀层的圆柱形母材，在每个镀层中反应硫和氢的步骤; 以及在将三层镀层冷却至80-100℃的温度之后，通过分离圆柱形母版来获得具有三重镀层的无缝金属套筒的步骤。
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Patent Agency Ranking
公开(公告)号：KR1020140069646A
公开(公告)日：2014-06-10
申请号：KR1020120137182
申请日：2012-11-29
Applicant: (주)우리정도
CPC classification number: C25D5/12 , C25D3/562 , H01H2037/526
Abstract: Provided in the present invention is a method to manufacture a bimetal by applying a plating method utilizing electricity to manufacture bimetal products at a reduced production cost, and to easily make a thinner bimetal have a more accurate curvature value with a simpler manufacturing process. The method to manufacture a bimetal by applying a plating method utilizing electricity includes: a first plated layer being formed by a high conductive metallic material produced by plating and electrodepositing having high or low thermal expansion coefficient; a second plated layer being formed by a conductive metallic material being produced by plating and electrodepositing on one surface of the first plated layer by applying the electroplating method again; and having a thermal expansion coefficient relatively different from the thermal expansion coefficient of the first plating layer. The plating method includes a step of forming a first plated layer on one side of the surface-treated master with a metallic material having low or high thermal expansion coefficient by applying the plating method utilizing electricity to plate and to electrodeposit; a step of masking one side of the first plated layer after the side of the first plated layer is separated from the surface-treated master; a step of cooling the first and second plated layers after the layers are heated at a certain temperature; and a step of rolling the first plated layer and the second plated layer by applying a light pressure.
Abstract translation: 本发明提供了一种制造双金属的方法，其通过利用电力的电镀方法以降低的生产成本制造双金属产品，并且通过更简单的制造工艺容易地使较薄的双金属具有更精确的曲率值。 通过应用电镀方法制造双金属的方法包括：由具有高或低热膨胀系数的电镀和电沉积产生的高导电金属材料形成的第一镀层; 由导电金属材料形成的第二镀层通过再次施加电镀方法通过电镀和电沉积在第一镀层的一个表面上而制成; 并且具有与第一镀层的热膨胀系数相对不同的热膨胀系数。 电镀方法包括以下步骤：通过使用电镀板和电沉积法，利用具有低或高热膨胀系数的金属材料在表面处理的母版的一侧上形成第一镀层; 在第一镀层的侧面与表面处理的母料分离之后，掩蔽第一镀层的一侧的步骤; 在所述层在一定温度下加热之后冷却所述第一和第二镀层的步骤; 以及通过施加轻压轧制第一镀层和第二镀层的步骤。
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公开(公告)号：KR1020020012375A
公开(公告)日：2002-02-16
申请号：KR1020000045646
申请日：2000-08-07
Applicant: (주)우리정도
IPC: C25C1/00
Abstract: PURPOSE: Provided is a method for manufacturing high purity electrolytic metal salt solution in a high yield, compared with an existing manufacturing technology by differing the internal construction and the arrangement structure of an electrolytic cell. CONSTITUTION: In a method for manufacturing an electrolytic metal salt solution by using as an anode the pertinent metal plate of a material to be obtained with electrolytic metal salts and applying an electric current to the anode, thereby dissolving the electrolytic metal salts, the method includes: installing a cylindrical cathode at the center of a single circular electrolytic cell; covering the cathode with a membrane material; and filling the electrolytic cell with an electrolyte solution so that the electrolytic metal salt solution is obtained in such a manner that dissolved metal ions are present only in the solution, wherein a concentrated solution is obtained by passing the metal salt solution through a membrane filter using a reverse osmosis process after collecting the relevant metal salt solution having a low concentration during the initial manufacturing period of a relevant metal salt solution, the cathode is composed of a stainless steel plate, a titanium net or a platinum net differently from the anode, and an anode bag made of polyethylene, polypropylene or polyester is covered on the anode.
Abstract translation: 目的：提供与现有制造技术相比，通过不同的电解槽的内部结构和排列结构，制造高纯度电解金属盐溶液的方法。 本发明提供一种电解金属盐溶液的制造方法，其特征在于，使用电解金属盐所得材料的相关金属板作阳极，向阳极施加电流，从而溶解电解金属盐， ：在单个圆形电解槽的中央安装圆柱形阴极; 用膜材覆盖阴极; 并且用电解质溶液填充电解池，使得电解金属盐溶液以仅溶解的金属离子存在于溶液中的方式获得，其中通过使金属盐溶液通过膜过滤器获得浓缩溶液，该溶液通过膜过滤器使用 在相关金属盐溶液的初始制造期间收集低浓度的相关金属盐溶液之后的反渗透方法，阴极由不同于阳极的不锈钢板，钛网或铂网组成，以及 在阳极上覆盖由聚乙烯，聚丙烯或聚酯制成的阳极袋。
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公开(公告)号：KR1020010110265A
公开(公告)日：2001-12-12
申请号：KR1020010070867
申请日：2001-11-14
Applicant: (주)우리정도
Inventor： 장태순
IPC: B21D28/26
CPC classification number: H01L21/4871 , B21D28/02 , H01L23/3736 , H01L2023/4037
Abstract: 본 발명은 반도체패키지용 방열판의 제조과정에서 원판인 금속편에 방열판 유닛을 성형하는 펀칭단계에 관한 것으로, 더 상세하게는 종래의 방열판 제조용 금속편 폭의 배수보다 다소 큰 폭을 갖는 금속편에 복수 열로 방열판 유닛을 형성하는 방법에 관한 것이다.
본 발명에 의하면 방열판 제조시 소재의 사용효율과 제품의 생산효율을 증대시킬 수 있게 된다. 또한 본 발명은 상기 금속편을 연속적으로 제공함으로써 방열판의 생산성이 증대되며, 생산의 자동화를 가능하게 된다.-
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公开(公告)号：KR1020000023913A
公开(公告)日：2000-05-06
申请号：KR1019990040791
申请日：1999-09-21
Applicant: (주)우리정도
Inventor： 장태순
IPC: H01L23/495
Abstract: PURPOSE: A composition is provided to remove an oxide layer of a semiconductoror lead frame under an identical condition regardless of components of a copper alloy used in a plating process of the semiconductor lead frame. CONSTITUTION: A composition used for removing an oxide layer of a semiconductor lead frame includes 30-100 g/liter of sulfuric and 10-50 g/liter of ammonium perozodisulfate that are dissolved in water. The composition may further includes 0.1-0.5 g/liter of surfactant and 0.05-0.3 g/liter of a stabilizing agent. The surfactant is selected from one of Plurafac LF 1430 and LutenSol AT 25. The stabilizing agent is selected from the group consisting of glycerin, disodiun suceinate, and gluconic acid. The composition has specific gravity of about 1.1-1.3 g/cm¬3 and pH 0.5-2.0.
Abstract translation: 目的：提供一种组合物，用于在相同的条件下去除半导体或引线框架的氧化物层，而与半导体引线框架的电镀工艺中使用的铜合金的成分无关。 构成：用于除去半导体引线框架的氧化物层的组合物包括溶解在水中的30-100g /升硫酸和10-50g /升过氧化硫酸铵。 组合物还可包含0.1-0.5g /升表面活性剂和0.05-0.3g /升稳定剂。 表面活性剂选自Plurafac LF 1430和LutenSol AT 25中的一种。稳定剂选自甘油，二琥珀酸酯和葡萄糖酸。 该组合物的比重为约1.1-1.3g / cm 3，pH为0.5-2.0。
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