公开(公告)号：KR100759973B1

公开(公告)日：2007-09-18

申请号：KR1020010005695

申请日：2001-02-06

Applicant: 삼성전자주식회사

Inventor： 남효학 ,  이봉우 ,  김형열

IPC: G02F1/1339

Abstract: 본 발명에서는 각각 정렬 키가 형성되어 있는 제1 또는 제2 기판에 스페이서를 산포하고, 제1 또는 제2 기판의 외곽 둘레에 봉인재를 형성한다. 제1 및 제2 기판을 정렬하여 정렬 키의 위치를 비교하여 제1 및 제2 기판의 크기 편차를 측정한다. 열 공정으로 제1 및 제2 기판의 정렬 키가 일치하도록 크기 편차를 보정하여 제1 및 제2 기판을 접합한다.
열팽창계수, 정렬, 자외선경화성수지

公开(公告)号：KR1020070014271A

公开(公告)日：2007-02-01

申请号：KR1020050068744

申请日：2005-07-28

Applicant: 삼성전자주식회사

Inventor： 김형열

IPC: H01L21/304

Abstract: A pad conditioner of a CMP is provided to eliminate sources capable of causing scratches in a polishing process of a pad by removing impurities like slurry integrated on the surface of the pad or between grooves before the impurities are hardened. A pad conditioner(122) of a CMP apparatus having a pad(110) for polishing a semiconductor wafer includes a DIW(deionized water) vibration device(124) which vibrates DIW to be supplied to the upper surface of the pad so as to eliminate impurities deposited on the pad. The pad conditioner further includes an oscillator for driving the DIW vibration device which can be installed in a position separated from the pad by 5 millimeters.

Abstract translation: 提供CMP的垫式调节器以通过在杂质固化之前除去积聚在垫的表面上或凹槽之间的杂质，从而消除能够在抛光过程中产生划痕的源。 具有用于研磨半导体晶片的衬垫（110）的CMP装置的衬垫调节器（122）包括DIW（去离子水）振动装置（124），其将DIW振动以供应到衬垫的上表面，以消除 杂质沉积在垫上。 垫式调节器还包括用于驱动DIW振动装置的振荡器，其可以安装在与垫隔开5毫米的位置。

公开(公告)号：KR1020030064469A

公开(公告)日：2003-08-02

申请号：KR1020020004777

申请日：2002-01-28

Applicant: 삼성전자주식회사

Inventor： 백순기 ,  김형열

IPC: H01L21/304

CPC classification number: B24B55/02 ,  B24B37/04

Abstract: PURPOSE: An apparatus for planarizing a semiconductor wafer is provided to prevent the contamination due to a cleaning solution by improving the structure of a cleaning unit. CONSTITUTION: An apparatus for planarizing a semiconductor wafer includes a polishing station(110), a polishing head(152), and a cleaning unit(130). The polishing station has a platen(120) on which a polishing pad(122) is adhered. The polishing head is used for polishing a wafer which is located on the polishing pad. The cleaning unit is used for providing the fluid to the polishing pad. The cleaning unit includes a shift(132), an arm(134), a cleaning solution path, and the first drop holes. The arm is connected to the shaft. The cleaning solution path is formed at the inside of the arm. The first drop holes are used for dropping the cleaning solution on the surface of the polishing pad.

Abstract translation: 目的：提供一种用于平坦化半导体晶片的装置，以通过改善清洁单元的结构来防止由清洁溶液引起的污染。 构成：用于平坦化半导体晶片的装置包括抛光台（110），抛光头（152）和清洁单元（130）。 抛光台具有粘贴有抛光垫（122）的台板（120）。 抛光头用于抛光位于抛光垫上的晶片。 清洁单元用于将流体提供给抛光垫。 清洁单元包括位移（132），臂（134），清洁溶液路径和第一下落孔。 臂连接到轴。 清洁溶液路径形成在臂的内部。 第一个滴孔用于将清洗液滴在抛光垫的表面上。

公开(公告)号：KR1020020066657A

公开(公告)日：2002-08-21

申请号：KR1020010006969

申请日：2001-02-13

Applicant: 삼성전자주식회사

Inventor： 이봉우 ,  남효학 ,  김형열

IPC: G02F1/1339

CPC classification number: G02F1/1303 ,  B05B5/032 ,  G02F1/0107 ,  G02F1/1339

Abstract: PURPOSE: A spacer spraying device for an LCD and a spacer system are provided to prevent spacers from being dropped on a substrate having a substrate spacer of organic film by mounting a protection cover in a spacer chamber. CONSTITUTION: A device for spraying spacers includes a chamber(100) having a reaction chamber inside, a spacer spraying nozzle(200) attached to an upper end of the chamber for spraying spacers for maintaining an interval between two substrate components uniformly, a supporting die(400) for supporting a substrate(300) when spraying the spacers, and a protection cover(500) for preventing spacers in the chamber from being dropped on the substrates, wherein the cover is movable vertically.

Abstract translation: 目的：提供一种用于LCD和间隔器系统的间隔物喷射装置，以通过将保护盖安装在间隔室中来防止间隔物落在具有有机膜基板间隔物的基板上。 构成：用于喷射间隔物的装置包括在内部具有反应室的腔室（100），附接到腔室的上端的间隔件喷射喷嘴（200），用于喷射间隔件以均匀地保持两个基底部件之间的间隔;支撑模具 （400），用于在喷射间隔物时支撑基板（300）;以及保护盖（500），用于防止所述室中的间隔件落在所述基板上，其中所述盖可垂直移动。